Method for producing pressure-sensitive adhesive tape package

Patent metadata

Field	Value
Publication number	US-9283738-B2
Application number	US-201214353107-A
Country	US
Kind code	B2
Filing date	Oct 23, 2012
Priority date	Oct 24, 2011
Publication date	Mar 15, 2016
Grant date	Mar 15, 2016

Abstract

An object of the present invention is to provide a method for producing a pressure-sensitive adhesive tape package suitable for mass production. The production method according to the present invention aims at producing a pressure-sensitive adhesive tape package which is a pressure-sensitive adhesive tape package 10 accommodating a pressure-sensitive adhesive tape 14 having a support 18 and an adhesive agent layer 12 provided on one surface of the support 18 , the pressure-sensitive adhesive tape package comprising a release sheet 16 to which the adhesive agent layer of the adhesive tape is releasably attached. In this method, the adhesive tape 14 is bonded to the release sheet base material 116 , and folded in two. Subsequently, a plurality of adhesive tapes 14 is heat sealed and temporarily attached to one release sheet base material 116 , and the release sheet base material 116 is cut.

First claim

The invention claimed is:

1. A method for producing a pressure-sensitive adhesive tape package, the pressure-sensitive adhesive tape package accommodating a pressure-sensitive adhesive tape having a support and an adhesive agent layer provided on one surface of the support, the pressure-sensitive adhesive tape package comprising a release sheet to which the adhesive agent layer of the adhesive tape is releasably attached, the method comprising:
a step of feeding a release sheet base material serving as the release sheet to a predetermined feed position;
a step of sequentially feeding a plurality of adhesive tapes in a row to the release sheet base material at the feed position, and bonding the adhesive tapes to the release sheet base material such that predetermined spaces are formed between the adhesive tapes adjacent in anterior and posterior directions of the feeding direction;
a step of folding the release sheet base material with the adhesive tape in two;
a step of sealing a predetermined portion of the release sheet base material to form the two-folded release sheet base material including a plurality of accommodating spaces each of which accommodates one adhesive tape;
a step of temporarily attaching a part of each adhesive tape to the release sheet base material; and
a step of cutting the release sheet base material to form the pressure-sensitive adhesive tape package;
wherein the step of bonding the adhesive tape to the release sheet base material comprises:
a substep of cutting an adhesive tape base material serving as the adhesive tape to form a row of adhesive tapes; and
a substep of separating adjacent adhesive tapes from each other, and feeding the adhesive tapes to the feed position while intervals between the adjacent adhesive tapes are increasing.

2. The method for producing a pressure-sensitive adhesive tape package according to claim 1 , wherein the sealing is heat sealing.

3. The method for producing a pressure-sensitive adhesive tape package according to claim 2 , wherein the temporary attachment is performed by thermal bonding.

4. The method for producing a pressure-sensitive adhesive tape package according to claim 2 , wherein in the step of sealing a predetermined portion of the release sheet base material, two sealed portions are formed at a constant interval between adjacent accommodating spaces, and
in the step of cutting the release sheet base material, cutting is performed between the two sealed portions.

5. The method for producing a pressure-sensitive adhesive tape package according to claim 1 , wherein the temporary attachment is performed by thermal bonding.

6. The method for producing a pressure-sensitive adhesive tape package according to claim 1 , wherein in the step of sealing a predetermined portion of the release sheet base material, two sealed portions are formed at a constant interval between adjacent accommodating spaces, and
in the step of cutting the release sheet base material, cutting is performed between the two sealed portions.

7. A method for producing a pressure-sensitive adhesive tape package, the pressure-sensitive adhesive tape package accommodating a pressure-sensitive adhesive tape having a support and an adhesive agent layer provided on one surface of the support, the pressure-sensitive adhesive tape package comprising a release sheet to which the adhesive agent layer of the adhesive tape is releasably attached, the method comprising:
a step of feeding a release sheet base material serving as the release sheet to a predetermined feed position;
a step of sequentially feeding a plurality of rows of a plurality of adhesive tapes to the release sheet base material at the feed position, and bonding the adhesive tapes to the release sheet base material such that predetermined spaces are formed between the adhesive tapes adjacent in anterior, posterior, left, and right directions of the feeding direction;
a step of slitting the release sheet base material along a longitudinal direction thereof to form a plurality of release sheet base materials, a row of adhesive tapes being bonded to each of the release sheet base materials;
a step of folding the slit release sheet base material with the adhesive tape in two;
a step of sealing a predetermined portion of the release sheet base material to form the two-folded release sheet base material including a plurality of accommodating spaces each of which accommodates one adhesive tape;
a step of temporarily attaching the release sheet base material to a part of each adhesive tape; and
a step of cutting the release sheet base material to form the pressure-sensitive adhesive tape package;
wherein the step of bonding the adhesive tape to the release sheet base material comprises:
a substep of cutting an adhesive tape base material serving as the adhesive tape to form a plurality of rows of adhesive tapes; and
a substep of separating the adhesive tapes adjacent in anterior, posterior, left, and right directions from each other and feeding the adhesive tapes to the feed position while intervals between the adjacent adhesive tapes are increasing.

8. The method for producing a pressure-sensitive adhesive tape package according to claim 7 , wherein the sealing is heat sealing.

9. The method for producing a pressure-sensitive adhesive tape package according to claim 8 , wherein the temporary attachment is performed by thermal bonding.

10. The method for producing a pressure-sensitive adhesive tape package according to claim 8 , wherein in the step of sealing a predetermined portion of the release sheet base material, two sealed portions are formed at a constant interval between adjacent accommodating spaces, and
in the step of cutting the release sheet base material, cutting is performed between the two sealed portions.

11. The method for producing a pressure-sensitive adhesive tape package according to claim 7 , wherein the temporary attachment is performed by thermal bonding.

12. The method for producing a pressure-sensitive adhesive tape package according to claim 7 , wherein in the step of sealing a predetermined portion of the release sheet base material, two sealed portions are formed at a constant interval between adjacent accommodating spaces, and
in the step of cutting the release sheet base material, cutting is performed between the two sealed portions.

Assignees

• Hisamitsu Pharmaceutical Co

Inventors

• Miyachika Takafumi
• Takada Kiyotaka

Classifications

• B32B37/26 Primary

  with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers · CPC title

• Y10T156/1036

  Bending of one piece blank and joining edges to form article · CPC title

• A61F13/0008 Primary

  having means for facilitating the removal of the packaging and release liner · CPC title

• A61F13/0276

  Apparatus or processes for manufacturing adhesive dressings or bandages · CPC title

• C09J7/0207

  Chemistry & Metallurgy · mapped topic