Cooling systems for electrical equipment

US9282684B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9282684-B2
Application numberUS-201213596798-A
CountryUS
Kind codeB2
Filing dateAug 28, 2012
Priority dateJun 23, 2010
Publication dateMar 8, 2016
Grant dateMar 8, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A space-saving, high-density modular data center and an energy-efficient cooling system for a modular data center are disclosed. The modular data center includes a first cooling circuit including a primary cooling device and a plurality of modular data pods. Each modular data pod includes a plurality of servers, a heat exchange member coupled to the first cooling circuit and a second cooling circuit coupled to the heat exchange member and configured to cool the plurality of servers, the second cooling circuit including a secondary cooling device configured to cool fluid flowing through the second cooling circuit. Each modular data pod also includes an auxiliary enclosure containing at least a portion of a distributed mechanical cooling system, which is configured to trim the cooling performed by a central free-cooling system.

First claim

Opening claim text (preview).

What is claimed is: 1. A cooling system for electrical equipment, comprising: a first cooling circuit including a primary cooling device; a heat exchange member in thermal communication with the electrical equipment and coupled to the first cooling circuit; and a second cooling circuit coupled to the heat exchange member, the second cooling circuit including a secondary cooling device that cools fluid flowing through the second cooling circuit, wherein the first cooling circuit includes two supply lines and two return lines in a reverse-return configuration. 2. The cooling system according to claim 1 , wherein the secondary cooling device cools a portion of a heat load associated with the electrical equipment that the primary cooling device cannot cool. 3. The cooling system according to claim 1 , wherein the secondary cooling device cools a portion of a heat load associated with the electrical equipment as a function of atmospheric conditions. 4. The cooling system according to claim 1 , further comprising primary cooling coils in thermal communication with the electrical equipment. 5. The cooling system according to claim 1 , wherein the secondary cooling device operates to cool the electrical equipment when a wet bulb temperature of the atmosphere associated with the environment of the electrical equipment exceeds a predetermined wet bulb temperature. 6. The cooling system according to claim 1 , wherein the fluid flowing through the first cooling circuit is a glycol solution or water and wherein the fluid flowing through the second cooling circuit is a refrigerant. 7. The cooling system according to claim 1 , further comprising: a second heat exchange member in thermal communication with the electrical equipment and coupled to the first cooling circuit; and a third cooling circuit coupled to the second heat exchange member, the third cooling circuit including a second secondary cooling device that cools fluid flowing through the third cooling circuit. 8. The cooling system according to claim 7 , further comprising secondary cooling coils in thermal communication with the electrical equipment. 9. The cooling system according to claim 1 , wherein the primary cooling device is a free-cooling device. 10. The cooling system according to claim 9 , wherein the free-cooling device includes a fluid cooler. 11. A cooling system for electrical equipment, comprising: a first cooling circuit including a primary cooling device; a heat exchange member in thermal communication with the electrical equipment and coupled to the first cooling circuit; a second cooling circuit coupled to the heat exchange member, the second cooling circuit including a secondary cooling device that cools fluid flowing through the second cooling circuit; and a third cooling circuit coupled to the second cooling circuit, the third cooling circuit including a cooling fluid source and an expansion tank. 12. The cooling system according to claim 1 , wherein the heat exchange member is a condenser. 13. The cooling system according to claim 10 , wherein the fluid cooler is a cooling tower.

Assignees

Inventors

Classifications

  • Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces · CPC title

  • Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls {; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies (F28D17/00, F28D19/00, F28D20/00 take precedence)} · CPC title

  • using a liquid coolant without phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title

  • within rooms for removing heat from cabinets, e.g. air conditioning devices · CPC title

  • Cooling means · CPC title

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Frequently asked questions

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What does patent US9282684B2 cover?
A space-saving, high-density modular data center and an energy-efficient cooling system for a modular data center are disclosed. The modular data center includes a first cooling circuit including a primary cooling device and a plurality of modular data pods. Each modular data pod includes a plurality of servers, a heat exchange member coupled to the first cooling circuit and a second cooling ci…
Who is the assignee on this patent?
Keisling Earl, Costakis John, Mcdonneli Gerald, and 1 more
What technology area does this patent fall under?
Primary CPC classification H05K7/20827. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 08 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).