Multilayer circuit substrate

Patent metadata

Field	Value
Publication number	US-9282632-B2
Application number	US-201313861907-A
Country	US
Kind code	B2
Filing date	Apr 12, 2013
Priority date	Nov 14, 2012
Publication date	Mar 8, 2016
Grant date	Mar 8, 2016

Abstract

A multilayer circuit substrate includes: a first conductor layer in which first transmission lines and a second transmission line are formed; a second conductive layer facing the first conductive layer through an insulating layer; and a third conductive layer that faces the second conductive layer through an insulating layer and that has a bypass line formed therein. The bypass line is electrically connected to the second transmission line of the first conductive layer through via conductors and such that the second transmission line and the first transmission lines intersect with each other. In the second conductive layer, a ground conductor is formed at least in a position that faces the bypass line, and the first transmission lines are made narrower at the intersection with the second transmission line than other portions.

First claim

What is claimed is:

1. A multilayer circuit substrate formed by alternately stacking insulating layers and conductive layers, comprising:
a first conductive layer having a first transmission line and a second transmission line formed therein;
a second conductive layer facing the first conductive layer through an insulating layer; and
a third conductive layer facing the second conductive layer through an insulating layer, the third conductive layer having a bypass line electrically connected to the second transmission line of the first conductive layer through a via conductor so as to allow the second transmission line to intersect with the first transmission line,
wherein the second conductive layer has a ground conductor formed at least in a position that overlaps the bypass line in a plan view, and
wherein the first transmission line is formed such that a line width thereof at an intersection with the second transmission line is made smaller than that in other portions.

2. The multilayer circuit substrate according to claim 1 , further comprising a fourth conductive layer facing the third conductive layer through an insulating layer, the fourth conductive layer having a ground conductor formed at least in a position that overlaps the bypass line in a plan view.

3. The multilayer circuit substrate according to claim 1 , further comprising a core layer that is thicker than any of the first to third conductive layers,
wherein the core layer has a recess or penetrating hole formed therein, and
wherein an electronic component is embedded in the recess or penetrating hole.

4. A high frequency circuit module, comprising:
the multilayer circuit substrate according to claim 1 ; and
an electronic component mounted on the multilayer circuit substrate.

5. A multilayer circuit substrate formed by alternately stacking insulating layers and conductive layers, comprising:
a first conductive layer having a first transmission line and a second transmission line formed therein;
a second conductive layer facing the first conductive layer through an insulating layer; and
a third conductive layer facing the second conductive layer through an insulating layer, the third conductive layer having a bypass line electrically connected to the second transmission line of the first conductive layer through a via conductor so as to allow the second transmission line to intersect with the first transmission line,
wherein the second conductive layer has a ground conductor formed at least in a position that faces the bypass line,
wherein the first transmission line is formed such that a line width thereof at an intersection with the second transmission line is made smaller than that in other portions,
wherein, in the ground conductor of the second conductive layer, an opening pattern is formed at least in a position that faces the first transmission line, except for an intersection with the second transmission line, and
wherein the third conductive layer has a ground conductor formed in a position that faces the first transmission line of the first conductive layer.

6. The multilayer circuit substrate according to claim 5 , wherein, in the first conductive layer, a plurality of the first transmission lines are formed so as to be parallel to each other, and between the plurality of the first transmission lines, first ground lines are formed so as to be parallel to the first transmission lines, and
wherein the ground conductor of the second conductive layer includes second ground lines formed so as to face the first ground lines in the opening pattern.

7. The multilayer circuit substrate according to claim 6 , wherein the second ground lines are made wider than the first ground lines.

8. The multilayer circuit substrate according to claim 5 , further comprising a fourth conductive layer facing the third conductive layer through an insulating layer, the fourth conductive layer having a ground conductor formed at least in a position that faces the bypass line.

9. The multilayer circuit substrate according to claim 5 , further comprising a core layer that is thicker than any of the first to third conductive layers,
wherein the core layer has a recess or penetrating hole formed therein, and
wherein an electronic component is embedded in the recess or penetrating hole.

10. A high frequency circuit module, comprising:
the multilayer circuit substrate according to claim 5 ; and
an electronic component mounted on the multilayer circuit substrate.

Assignees

• Taiyo Yuden Kk

Inventors

• Saji Tetsuo
• Nakamura Hiroshi

Classifications

• H05K1/185

  associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards · CPC title

• H01P3/088

  Stacked transmission lines · CPC title

• H05K2201/09336

  Signal conductors in same plane as power plane · CPC title

• H05K1/0253 Primary

  Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings (H05K1/0251 takes precedence) · CPC title

• H05K1/0227

  Split or nearly split shielding or ground planes · CPC title