Component built-in board and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9282628-B2
Application number	US-201414157669-A
Country	US
Kind code	B2
Filing date	Jan 17, 2014
Priority date	Mar 1, 2012
Publication date	Mar 8, 2016
Grant date	Mar 8, 2016

Abstract

A component built-in board, wherein at least two layers of a plurality of printed wiring bases are disposed on a rear surface side of an electronic component; the at least two layers of the printed wiring bases include a heat radiation-dedicated wiring pattern that is disposed above the rear surface of the electronic component; the heat radiation-dedicated wiring pattern is formed such that a heat radiation-dedicated wiring line and a signal-dedicated wiring line are continuous; a via includes a plurality of heat radiation-dedicated vias which connects the rear surface of the electronic component and the heat radiation-dedicated wiring pattern; and the heat radiation-dedicated wiring pattern is continuous from a place where connected to the heat radiation-dedicated via to be connected also to another via disposed at an outer peripheral side of the electronic component.

First claim

What is claimed is:

1. A component built-in board that has stacked therein a plurality of printed wiring bases in which a wiring pattern and a via are formed on/in an insulating base and that is configured having an electronic component built in thereto, wherein
at least two layers of the plurality of printed wiring bases are disposed on a rear surface side which is an opposite side to an electrode formation surface side of the electronic component;
the at least two layers of the printed wiring bases disposed on the rear surface side of the electronic component include a heat radiation-dedicated wiring pattern as the wiring pattern that is disposed in multiple layers via the insulating base on a region above the rear surface of the electronic component;
the heat radiation-dedicated wiring pattern is formed such that a heat radiation-dedicated wiring line and a signal-dedicated wiring line are continuous;
the via includes a plurality of heat radiation-dedicated vias that are disposed on the region above the rear surface to connect the rear surface of the electronic component and the heat radiation-dedicated wiring pattern disposed in multiple layers; and
the heat radiation-dedicated wiring pattern is continuous from a place where connected to the heat radiation-dedicated via to be connected also to another via disposed at an outer peripheral side of the electronic component.

2. The component built-in board according to claim 1 , wherein
the heat radiation-dedicated via has a larger diameter than the other via.

3. The component built-in board according to claim 1 , wherein
the diameter of the heat radiation-dedicated via is set in a range of 60 μm to 500 μm.

4. A method of manufacturing a component built-in board, the component built-in board having stacked therein a plurality of printed wiring bases in which a wiring pattern and a via are formed on/in an insulating base and the component built-in board being configured having an electronic component built in thereto, the method comprising the steps of:
forming the wiring pattern and the via on/in a plurality of the insulating bases;
forming a heat radiation-dedicated wiring pattern as the wiring pattern on at least two layers of those of the plurality of insulating bases that are disposed on a rear surface side which is an opposite side to an electrode formation surface side of the electronic component, the heat radiation-dedicated wiring pattern being disposed in multiple layers via the insulating base on a region above the rear surface of the electronic component and being formed such that a heat radiation-dedicated wiring line and a signal-dedicated wiring line are continuous;
forming a plurality of heat radiation-dedicated vias, as the via, that are connected to the rear surface of the electronic component and the heat radiation-dedicated wiring pattern;
forming in at least one of the plurality of insulating bases an opening that has the electronic component built in thereto;
stacking the at least two layers of the printed wiring bases that have the heat radiation-dedicated via and the heat radiation-dedicated wiring pattern formed on the rear surface side of the electronic component;
performing thermal compression bonding to collectively stack the plurality of printed wiring bases such that the rear surface of the electronic component is connected to the heat radiation-dedicated wiring pattern disposed in the multiple layers via the heat radiation-dedicated via such that the heat radiation-dedicated wiring pattern is continuous from a place where connected to the heat radiation-dedicated via to be connected also to another via disposed at an outer peripheral side of the electronic component.

5. The method of manufacturing a component built-in board according to claim 4 , wherein
the heat radiation-dedicated via is formed having a larger diameter than the other via.

6. The method of manufacturing a component built-in board according to claim 4 , wherein
the via and the heat radiation-dedicated via are formed by: laser processing in which a via hole of the via is formed and then a laser light output is adjusted to form a via hole of the heat radiation-dedicated via is formed; and conductive paste filling processing in which a conductive paste is filled into each of the formed via holes.

Assignees

• Fujikura Ltd

Inventors

• Okamoto Masahiro

Classifications

• H10W72/9413

  on encapsulations · CPC title

• H10W72/874

  On different surfaces · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title