Devices including at least one adhesion layer and methods of forming adhesion layers
US-9129620-B2 · Sep 8, 2015 · US
US9281003B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9281003-B2 |
| Application number | US-201314396486-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 25, 2013 |
| Priority date | Apr 25, 2012 |
| Publication date | Mar 8, 2016 |
| Grant date | Mar 8, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A device including a near field transducer (NFT); a write pole; at least one dielectric material positioned between the NFT and the write pole; and an adhesion layer positioned between the NFT and the at least one dielectric material.
Opening claim text (preview).
What is claimed is: 1. A device comprising: a near field transducer (NFT); a write pole; at least one dielectric material positioned between the NFT and the write pole; and an adhesion layer positioned between the NFT and the at least one dielectric material. 2. The device according to claim 1 , wherein the adhesion layer comprises one or more materials selected from: zirconium (Zr), titanium (Ti), yttrium (Y), scandium (Sc), aluminum (Al), ruthenium (Ru), vanadium (V), silicon (Si), germanium (Ge), tantalum (Ta), tin (Sn), and combinations thereof; cobalt (Co), nickel (Ni), chromium (Cr), tungsten (W), titanium tungsten (TiW), molybdenum (Mo), magnesium (Mg), niobium (Nb), hafnium (Hf), zinc (Zn), and combinations thereof; titanium nitride (TiN), zirconium nitride (ZrN), tantalum nitride (TaN), hafnium nitride (HfN) and combinations thereof; indium oxide (In 2 O 3 ), tin oxide (SnO 2 ), a solid solution of In 2 O 3 —SnO 2 (ITO), zinc oxide (ZnO), aluminum (Al) doped ZnO, gallium (Ga) doped ZnO, and combinations thereof; sulfides of Zr, Zn, Ti, Co, silver (Ag), copper (Cu), indium (In), cadmium (Cd), Sn, bismuth (Bi), lead (Pb), selenium (Se), iron (Fe), Mo; or binary sulfides thereof; and silicon carbide (SiC) or hydrogenated silicon carbide (SiC:H). 3. The device according to claim 1 , wherein the adhesion layer comprises Zr, Ti, Y, Sc, Al, Ru, V, Si, Ge, Ta, Sn, or combinations thereof; and the adhesion layer has an average thickness from about 2.5 Å to about 50 Å. 4. The device according to claim 1 , wherein the adhesion layer comprises Co, Ni, Cr, W, TiW, Mo, Mg, Nb, Hf, Zn, or combinations thereof; and the adhesion layer has an average thickness of not greater than about 25 Å. 5. The device according to claim 1 , wherein the adhesion layer comprises TiN, ZrN, TaN, HfN, or combinations thereof and the adhesion layer has an average thickness of not greater than about 50 Å. 6. The device according to claim 1 , wherein the adhesion layer comprises In 2 O 3 , SnO 2 , ITO, ZnO, Al doped ZnO, Ga doped ZnO, or combinations thereof; and the adhesion layer has an average thickness of not greater than about 50 Å. 7. The device according to claim 1 , wherein the adhesion layer comprises sulfides of Zr, Zn, Ti, Co, Ag, Cu, In, Cd, Sn, Bi, Pb, Se, Fe, Mo; or binary sulfides thereof. 8. The device according to claim 1 , wherein the adhesion layer comprises SiC, SiC:H, or combinations thereof. 9. The device according to claim 1 further comprising a second adhesion layer adjacent the opposing surface of the NFT. 10. The device according to claim 9 , wherein the second adhesion layer comprises one or more materials selected from: Co, Ni, Cr, W, TiW, Mo, Mg, Nb, Hf, Zn, and combinations thereof; TiN, ZrN, TaN, HfN, and combinations thereof; In 2 O 3 , SnO 2 , ITO, ZnO, Al doped ZnO, Ga doped ZnO and combinations thereof; sulfides of Zr, Zn, Ti, Co, Ag, Cu, In, Cd, Sn, Bi, Pb, Se, Fe, Mo; or binary sulfides thereof; and SiC, SiC:H, and combinations thereof. 11. The device according to claim 1 further comprising additional adhesion layers adjacent a non-opposing surface of the NFT. 12. The device according to claim 11 , wherein the additional adhesion layer comprises one or more materials selected from: Co, Ni, Cr, W, TiW, Mo, Mg, Nb, Hf, Zn, and combinations thereof; TiN, ZrN, TaN, HfN, and combinations thereof; In 2 O 3 , SnO 2 , ITO, ZnO, Al doped ZnO, Ga doped ZnO and combinations thereof; sulfides of Zr, Zn, Ti, Co, Ag, Cu, In, Cd, Sn, Bi, Pb, Se, Fe, Mo; or binary sulfides thereof; and SiC, SiC:H, and combinations thereof. 13. The device according to claim 9 further comprising additional adhesion layers adjacent a non-opposing surface of the NFT. 14. The device according to claim 1 , wherein the NFT comprises Au, Au doped with another material, Ag, Ag doped with another material, Cu, or Al. 15. The device according to claim 1 , wherein the NFT is a peg and disc type NFT. 16. The device according to claim 1 further comprising an energy source, wherein the NFT is configured to receive energy from the energy source. 17. The device according to claim 16 , wherein the energy source comprises a laser. 18. The device according to claim 16 further comprising a waveguide, the waveguide configured to receive the energy from the energy source and couple it into the NFT. 19. The device according to claim 10 , wherein the NFT comprises Au, Au doped with another material, Ag, Ag doped with another material, Cu, or Al. 20. The device according to claim 10 , further comprising an energy source, wherein the NFT is configured to receive energy from the energy source.
the arm comprising an optical waveguide, e.g. for thermally-assisted recording · CPC title
Optical waveguide in or on flying head · CPC title
where the layers are extra layers normally not provided in the transducing structure, e.g. optical layers (G11B5/3196 takes precedence) · CPC title
using near-field interactions or transducing means and at least one other method or means for recording or reproducing · CPC title
including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure (G11B5/3106 takes precedence) · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.