Wafer level optical lens structure

Patent metadata

Field	Value
Publication number	US-9279964-B2
Application number	US-201414159818-A
Country	US
Kind code	B2
Filing date	Jan 21, 2014
Priority date	Jan 22, 2013
Publication date	Mar 8, 2016
Grant date	Mar 8, 2016

Abstract

A wafer level optical lens structure is provided. A stress buffer layer is disposed between a light-transmissive substrate and a lens layer, so as to improve production yield of the wafer level optical lens.

First claim

What is claimed is:

1. A wafer level optical lens structure, comprising:
a light-transmissive substrate;
a lens layer; and
at least one stress buffer layer, disposed between the light-transmissive substrate and the lens layer, wherein the stress buffer layer has a specific pattern for buffering a stress effect between the lens layer and the light-transmissive substrate, and the specific pattern of the stress buffer layer is determined according to stress variations between different parts of the wafer level optical lens structure, wherein the lens layer comprises a lens, and the stress buffer layer has an opening corresponding to the lens.

2. The wafer level optical lens structure as claimed in claim 1 , further comprising:
at least one optical layer, disposed between the lens layer and the stress buffer layer and/or between the stress buffer layer and the light-transmissive substrate.

3. The wafer level optical lens structure as claimed in claim 2 , wherein the optical layer comprises at least one of a phase retardation film, a brightness enhancement film and a viewing angle improvement film.

4. The wafer level optical lens structure as claimed in claim 2 , wherein the optical layer has an opening corresponding to the lens.

5. The wafer level optical lens structure as claimed in claim 1 , wherein the stress buffer layer is a frame-shaped pattern, and a projection region of the frame-shaped pattern on the light-transmissive substrate does not cover a projection region of the lens on the light-transmissive substrate.

6. A wafer level optical lens structure, comprising:
a light-transmissive substrate;
a lens layer, comprising a plurality of lenses; and
at least one stress buffer layer, disposed between the light-transmissive substrate and the lens layer, wherein the stress buffer layer has a specific pattern for buffering a stress effect between the lens layer and the light-transmissive substrate, and the specific pattern of the stress buffer layer is determined according to stress variations between different parts of the wafer level optical lens structure, wherein the stress buffer layer has a plurality of openings corresponding to the lenses.

7. The wafer level optical lens structure as claimed in claim 6 , further comprising:
at least one optical layer, disposed between the lens layer and the stress buffer layer and/or between the stress buffer layer and the light-transmissive substrate.

8. The wafer level optical lens structure as claimed in claim 7 , wherein the optical layer comprises at least one of a phase retardation film, a brightness enhancement film and a viewing angle improvement film.

9. The wafer level optical lens structure as claimed in claim 7 , wherein the optical layer has a plurality of openings corresponding to the lenses.

10. The wafer level optical lens structure as claimed in claim 6 , wherein the stress buffer layer has a plurality of frame-shaped patterns corresponding to the lenses, and a projection region of each of the frame-shaped patterns on the light-transmissive substrate does not cover a projection region of the corresponding lens on the light-transmissive substrate.

Assignees

• Himax Tech Ltd

Inventors

• Hsiao Yun-Lien
• Hsu Shu-Hao

Classifications

• B29D11/00317

  Production of lenses with markings or patterns · CPC title

• G02B13/0085 Primary

  employing wafer level optics · CPC title

• B29D11/00307

  Producing lens wafers · CPC title