Optoelectronic semiconductor chip
US-2024204138-A1 · Jun 20, 2024 · US
US9279906B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9279906-B2 |
| Application number | US-201213601767-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 31, 2012 |
| Priority date | Aug 31, 2012 |
| Publication date | Mar 8, 2016 |
| Grant date | Mar 8, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
The present invention is directed to a microstructure film comprising an area of microstructures and two edge areas, wherein the height of the highest part in the edge areas exceeds the height of the highest point in the microstructures, preferably by about 1 μm to about 1 mm. The application also describes how such a film may be manufactured.
Opening claim text (preview).
What is claimed is: 1. An embossing assembly for manufacturing a microstructure film, comprising: a) a drum; b) an embossing shim tightly wrapped around the drum wherein the embossing shim has a three-dimensional pattern for forming microstructures; c) a tape laminated around each end of the embossing shim; and d) a deformable nip roller capable of pressing against the tape and the embossing shim to create spaces for an embossing composition to enter to form edge areas. 2. The assembly of claim 1 , wherein the microstructure film comprises an area of microstructures and two edge areas, the height of the highest part in each of the edge areas exceeds the height of the highest point in the microstructures, the two edge areas and the microstructures are on opposite sides of the film, and all the heights are measured from the same base line. 3. The assembly of claim 2 , wherein, in the microstructure film, the highest part in the edge areas is a spacer line. 4. The assembly of claim 3 , wherein the spacer line has a width which is in the range of about 3 μm to about 30 mm. 5. The assembly of claim 2 , wherein, in the microstructure film, the height of the highest part in the edge areas exceeds the height of the highest point in the microstructures by about 1μ to about 1 mm. 6. The assembly of claim 5 , wherein, in the microstructure film, the height of the highest part in the edge areas is the thickness of the thickest part in the edge areas.
by making depressions in the lens surfaces · CPC title
characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids {(foam layer B32B5/18; layer of synthetic resin characterised by fillers that create voids or cavities B32B27/205); characterised by an apertured layer} · CPC title
Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.] · CPC title
Physics · mapped topic
Particulate matter · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.