Microstructure film

US9279906B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9279906-B2
Application numberUS-201213601767-A
CountryUS
Kind codeB2
Filing dateAug 31, 2012
Priority dateAug 31, 2012
Publication dateMar 8, 2016
Grant dateMar 8, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention is directed to a microstructure film comprising an area of microstructures and two edge areas, wherein the height of the highest part in the edge areas exceeds the height of the highest point in the microstructures, preferably by about 1 μm to about 1 mm. The application also describes how such a film may be manufactured.

First claim

Opening claim text (preview).

What is claimed is: 1. An embossing assembly for manufacturing a microstructure film, comprising: a) a drum; b) an embossing shim tightly wrapped around the drum wherein the embossing shim has a three-dimensional pattern for forming microstructures; c) a tape laminated around each end of the embossing shim; and d) a deformable nip roller capable of pressing against the tape and the embossing shim to create spaces for an embossing composition to enter to form edge areas. 2. The assembly of claim 1 , wherein the microstructure film comprises an area of microstructures and two edge areas, the height of the highest part in each of the edge areas exceeds the height of the highest point in the microstructures, the two edge areas and the microstructures are on opposite sides of the film, and all the heights are measured from the same base line. 3. The assembly of claim 2 , wherein, in the microstructure film, the highest part in the edge areas is a spacer line. 4. The assembly of claim 3 , wherein the spacer line has a width which is in the range of about 3 μm to about 30 mm. 5. The assembly of claim 2 , wherein, in the microstructure film, the height of the highest part in the edge areas exceeds the height of the highest point in the microstructures by about 1μ to about 1 mm. 6. The assembly of claim 5 , wherein, in the microstructure film, the height of the highest part in the edge areas is the thickness of the thickest part in the edge areas.

Assignees

Inventors

Classifications

  • by making depressions in the lens surfaces · CPC title

  • characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids {(foam layer B32B5/18; layer of synthetic resin characterised by fillers that create voids or cavities B32B27/205); characterised by an apertured layer} · CPC title

  • Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.] · CPC title

  • Physics · mapped topic

  • Particulate matter · CPC title

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What does patent US9279906B2 cover?
The present invention is directed to a microstructure film comprising an area of microstructures and two edge areas, wherein the height of the highest part in the edge areas exceeds the height of the highest point in the microstructures, preferably by about 1 μm to about 1 mm. The application also describes how such a film may be manufactured.
Who is the assignee on this patent?
Kang Gary Yih-Ming, E Ink California Llc
What technology area does this patent fall under?
Primary CPC classification G02B1/00. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 08 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).