Infrared sensor

Patent metadata

Field	Value
Publication number	US-9279729-B2
Application number	US-201214003743-A
Country	US
Kind code	B2
Filing date	Mar 21, 2012
Priority date	Mar 30, 2011
Publication date	Mar 8, 2016
Grant date	Mar 8, 2016

Abstract

A lightweight infrared sensor which is readily and stably erected to a substrate, the infrared sensor includes an insulating film; a first and second heat sensitive element are disposed on one surface of the insulating film separately; a first and second conductive film on one surface of the insulating film and are respectively connected to the first and the second heat sensitive element; an infrared reflection film on the other surface of the insulating film so as to face the second heat sensitive element; a reinforcing plate on which a sensor part window corresponding to a sensor part is formed and which is adhered to the insulating film; and a first and a second terminal electrode are respectively connected to the first and the second wiring film and formed on the edge of the insulating film.

First claim

What is claimed is:

1. An infrared sensor comprising:
an insulating film;
a first heat sensitive element and a second heat sensitive element that are disposed on one surface of the insulating film so as to be separated apart from one another;
a first conductive wiring film and a second conductive wiring film that are formed on one surface of the insulating film and are respectively connected to the first heat sensitive element and the second heat sensitive element;
an infrared reflection film that is disposed on the other surface of the insulating film so as to face the second heat sensitive element;
a reinforcing plate on which a sensor part window corresponding to the region of the first heat sensitive element, the second heat sensitive element, and the infrared reflection film is formed and which is adhered to one surface of the insulating film;
a plurality of terminal electrodes that are respectively connected to the first conductive wiring film and the second conductive wiring film, are formed on the edge of the other surface of the insulating film, and are capable of being fitted into a external connector, and
a sealing member adhered to the reinforcing plate, which sealing member is for sealing the sensor part window and can reflect infrared radiation from outside;
wherein the reinforcing plate extends to a region facing the terminal electrodes.

2. The infrared sensor according to claim 1 , further comprising:
a circuit part that is formed on the insulating film,
wherein a circuit part window corresponding to the circuit part is formed in the reinforcing plate.

3. The infrared sensor according to claim 1 , wherein the first conductive wiring film is arranged around the first heat sensitive element and is formed to have a larger area than that of the second wiring film.

Assignees

• Nakamura Kenzo
• Ishikawa Mototaka
• Uozumi Gakuji
• Mitsubishi Materials Corp

Inventors

• Nakamura Kenzo
• Ishikawa Mototaka
• Uozumi Gakuji

Classifications

• G01J5/20

  using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices · CPC title

• G01J5/0215

  Compact construction · CPC title

• G01J5/10 Primary

  using electric radiation detectors · CPC title

• H01L37/02

  Electricity · mapped topic

• G01J2005/067

  Physics · mapped topic