Light emitting module having heat conductive substrate

Patent metadata

Field	Value
Publication number	US-9279575-B2
Application number	US-201414158144-A
Country	US
Kind code	B2
Filing date	Jan 17, 2014
Priority date	May 30, 2008
Publication date	Mar 8, 2016
Grant date	Mar 8, 2016

Abstract

A substrate having a plurality of light-emitting elements mounted thereon is described. The substrate may be mounted in a lighting apparatus and may include a surface on which the plurality of light-emitting elements are mounted and one or more holes through which heat may be conducted from the first surface to another surface of the substrate. For example, a heat conductive and electrically non-conductive material may cover a surface of the one or more holes. According to some arrangements, the surface of the substrate may include an electrically non-conductive layer and an electrically conductive layer such that the electrically non-conductive layer is electrically isolated or separated from the electrically conductive layer.

First claim

What is claimed is:

1. A module substrate comprising:
a substrate comprising a first surface and a second surface opposite to the first surface;
a light-emitting element mounted on the first surface;
an electrically conducting layer on the first surface, wherein the electrically conducting layer is connected to the light-emitting element; and
a heat-conductive hole comprising a through hole extending entirely through the substrate between the first surface and the second surface and a heat-conductive material covering an inner surface of the through hole, wherein the material covering the inner surface of the through hole is not electrically connected to the electrically conducting layer.

2. A lighting apparatus comprising:
an apparatus main body; and
a module substrate, the module substrate comprising:
a substrate comprising a first surface and a second surface opposite to the first surface;
a light-emitting element mounted on the first surface;
an electrically conducting layer on the first surface, wherein the electrically conducting layer is connected to the light-emitting element; and
a heat-conductive hole comprising a through hole extending entirely through the substrate between the first surface and the second surface and a heat-conductive material covering an inner surface of the through hole, wherein the material covering the inner surface of the through hole is not electrically connected to the electrically conducting layer.

Assignees

• Toshiba Lighting & Technology
• Toshiba Kk

Inventors

• Moriyama Takayoshi
• Higuchi Kazunari
• Hashimoto Sumio
• Kumashiro Shinichi

Classifications

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• H05K2201/10409

  Screws · CPC title

• H05K2201/09063

  Holes or slots in insulating substrate not used for electrical connections · CPC title

• F21V29/74

  with fins or blades · CPC title

• H05K1/0206

  by printed thermal vias · CPC title