Alkaline soluble resin, process for preparing same, and photoresist composition containing same

Patent metadata

Field	Value
Publication number	US-9279037-B2
Application number	US-201314239552-A
Country	US
Kind code	B2
Filing date	Jul 26, 2013
Priority date	Apr 3, 2013
Publication date	Mar 8, 2016
Grant date	Mar 8, 2016

Abstract

An alkaline soluble resin, a process for preparing the same, and a photoresist composition containing the same. The alkaline soluble resin is a polyether chain-containing acrylate alkaline soluble resin. A photoresist composition comprising said alkaline soluble resin can reduce the slope angle of the film layer and prevent gaps which cause light leakage from forming in the junction between the colored film layer and the black matrix. Moreover, the coating and the rubbing effect of the orientation layer can be improved.

First claim

What is claimed is:

1. An alkaline soluble resin, wherein the alkaline soluble resin is a polyether chain-containing acrylate alkaline soluble resin obtained from grafting an acrylate alkaline soluble resin with a polyether chain-containing monoacid having the following structural formula:

wherein n is an integer of 7-30.

2. The alkaline soluble resin according to claim 1 , wherein said acrylate alkaline soluble resin comprises any one of methacrylates, amine modified acrylates, acrylate alkaline soluble resins with polycyclic aromatic side chains, and highly branched alkaline soluble acrylated polyesters.

3. The alkaline soluble resin according to claim 1 , wherein said alkaline soluble resin contains less than 100 carbon atoms.

4. A process for preparing the alkaline soluble resin according to claim 1 , comprising:
1) reacting adipic acid with 1,3-dibromo-5,5-dimethylhydantoin in dichloromethane to obtain 1-bromohexanoic acid; reacting 1-bromohexanoic acid with sodium hydroxide to obtain sodium 1-hydroxyhexanoate; and reacting sodium 1-hydroxyhexanoate with acryloyl chloride to obtain an active adipate;
2) reacting polyethylene glycol with the active adipate in N,N-dimethylformamide to obtain a polyether chain-containing monoacid; and
3) reacting the polyether chain-containing monoacid with an acrylate alkaline soluble resin in N,N-dimethylformamide to obtain a polyether chain-containing acrylate alkaline soluble resin.

5. The process for preparing the alkaline soluble resin according to claim 4 , wherein the ratio of the polyethylene glycol to the active adipate in parts by weight in step 2 is in the range of 1:0.5 to 1:0.95.

6. The process for preparing the alkaline soluble resin according to claim 4 , wherein the ratio of the polyether chain-containing monoacid to the acrylate alkaline soluble resin in parts by weight in step 3 is in the range of 1:0.45 to 1:0.83.

7. The process for preparing the alkaline soluble resin according to claim 4 , wherein said polyether chain-containing monoacid has the following structural formula:

wherein n is an integer of 7-30.

8. The process for preparing the alkaline soluble resin according to claim 4 , wherein said acrylate alkaline soluble resin comprises any one of methacrylates, amine modified acrylates, acrylate alkaline soluble resins with polycyclic aromatic side chains, and highly branched alkaline soluble acrylated polyesters.

9. The process for preparing the alkaline soluble resin according to claim 4 , wherein said alkaline soluble resin contains less than 100 carbon atoms.

10. A photoresist composition, comprising an alkaline soluble resin, wherein the alkaline soluble resin is a polyether chain-containing acrylate alkaline soluble resin obtained from grafting an acrylate alkaline soluble resin with a polyether chain-containing monoacid having the following structural formula:

wherein n is an integer of 7-30.

11. The photoresist composition according to claim 10 , wherein said photoresist composition comprises the following components by weight percentage:
alkaline soluble resin: 7%-24%;
photoactive compound: 10%-22%; and
photoinitiator: 1.3%-12.5%.

12. The photoresist composition according to claim 11 , wherein the photoinitiator comprises one or more of benzoins, benzophenones, and anthraquinones.

13. The photoresist composition according to claim 11 , wherein the photoactive compound comprises one or more of dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, pentaerythritol tetraacrylate, and ethoxylated pentaerythritol tetraacrylate.

14. The photoresist composition according to claim 11 , further comprising a solvent, wherein said solvent comprises one or more of propanedione methyl ether acetate, propylene glycol diacetate, ethyl 3-ethoxy-3-iminopropionate, 2-methyl-heptane, 3-methyl-heptane, cyclopentanone, and cyclohexanone.

15. The photoresist composition according to claim 10 , wherein said acrylate alkaline soluble resin comprises any one of methacrylates, amine modified acrylates, acrylate alkaline soluble resins with polycyclic aromatic side chains, and highly branched alkaline soluble acrylated polyesters.

16. The photoresist composition according to claim 10 , wherein said alkaline soluble resin contains less than 100 carbon atoms.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Wang Xuelan
• Tang Chen
• Chang Shan

Classifications

• C08G65/002

  from unsaturated compounds (unsaturated oxiranes C08G65/14) · CPC title

• G03F7/027 Primary

  Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence) · CPC title

• C08G65/3322

  acyclic · CPC title

• C08F222/102

  of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate · CPC title

• C08F261/00

  Macromolecular compounds obtained by polymerising monomers on to polymers of oxygen-containing monomers as defined in group C08F16/00 · CPC title