Electronic apparatus

Patent metadata

Field	Value
Publication number	US-9277675-B2
Application number	US-201314014222-A
Country	US
Kind code	B2
Filing date	Aug 29, 2013
Priority date	Aug 23, 2012
Publication date	Mar 1, 2016
Grant date	Mar 1, 2016

Abstract

According to one embodiment, an electronic apparatus includes a heating component, a housing, and a heat pipe. The housing accommodates the heating component and includes a wall. The wall includes a first region configured to receive heat from the component and a second region configured to have a lower temperature than a temperature of the first region. At least a portion of the heat pipe is buried in the wall from the first region to the second region.

First claim

What is claimed is:

1. An electronic apparatus comprising:
a heating component;
a housing comprising a wall, the heating component in the housing, the wall comprising a first region that receives heat from the heating component and a second region that has a lower temperature than a temperature of the first region;
a heat pipe, at least a portion of the heat pipe in the wall between the first region and the second region; and
a heat insulator between the heating component and the first region.

2. The electronic apparatus of claim 1 ,
wherein an inner surface of the wall comprises a groove, and
at least a portion of the heat pipe is in the groove.

3. The electronic apparatus of claim 1 ,
wherein a transversal thickness of the heat pipe is less than a transversal thickness of the wall.

4. The electronic apparatus of claim 2 ,
wherein
a surface of the heat pipe is substantially flush with the inner surface of the wall.

5. The electronic apparatus of claim 1 , further comprising:
a fan in the housing,
wherein the second region comprises a hole that directs air flow toward the fan for cooling the second region.

6. The electronic apparatus of claim 1 , further comprising:
a heat diffuser having a greater transversal width than a transversal width of the heat pipe, the heat diffuser on an inner surface of the wall in the first region.

7. The electronic apparatus of claim 1 , further comprising:
a heat diffuser having a greater transversal width than a transversal width of the heat pipe, the heat diffuser on an inner surface of the wall in the second region.

8. The electronic apparatus of claim 1 ,
wherein the heat pipe is inside the wall.

Assignees

• Toshiba Kk

Inventors

• Fujiwara Nobuto

Classifications

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title

• F28D15/00

  Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls {; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies (F28D17/00, F28D19/00, F28D20/00 take precedence)} · CPC title

• G06F1/20

  Cooling means · CPC title

• H05K7/2029

  using a liquid coolant with phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title