Double-sided circuit board with opposing modular card connector assemblies

Patent metadata

Field	Value
Publication number	US-9276335-B2
Application number	US-201213710916-A
Country	US
Kind code	B2
Filing date	Dec 11, 2012
Priority date	Dec 11, 2012
Publication date	Mar 1, 2016
Grant date	Mar 1, 2016

Abstract

An electronic assembly includes a circuit board that serves as both a mechanical attachment point and signal conduit for electronic components. The circuit board includes at least two modular card connector assemblies disposed on opposing surfaces of a mounting region of the circuit board. Pin sets of the modular card connector assemblies are connected together via corresponding through holes extending between the opposing surfaces in the mounting region. Further, pins of one or both the modular card connector assemblies may be connected to other electronic components disposed at the circuit board via lateral traces. One or both of the modular card connector assemblies can comprise a modular card socket to removably couple with a modular card. Alternatively, one or both of the modular card connector assemblies comprises a pin interface assembly that is integral to or otherwise fixedly attached to the modular card.

First claim

What is claimed is:

1. An electronic assembly comprising:
a circuit board comprising:
a set of through holes extending between a first surface of the circuit board and an opposing second surface of the circuit board;
a first modular card socket disposed at the first surface of the circuit board, the first modular card socket having a first pin set of one or more pins, each pin of the first pin set coupled to a corresponding through hole of the set of through holes; and
a second modular card socket disposed opposite the first modular card socket at the second surface of the circuit board, the second modular card socket having a second pin set of one more pins, each pin of the second pin set coupled to a corresponding through hole of the set of through holes.

2. The electronic assembly of claim 1 , wherein each pin of the first pin set comprises a press-fit pin inserted in the corresponding through hole.

3. The electronic assembly of claim 1 , wherein each pin of the first pin set comprises a solder joint coupled to a corresponding pad coupled to the corresponding through hole.

4. The electronic assembly of claim 1 , further comprising:
a first modular card inserted into the first modular card socket; and
a second modular card inserted into the second modular card socket.

5. The electronic assembly of claim 4 , wherein:
the first modular card comprises a processing card having at least one processor; and
the second modular card comprises a memory module card having at least one memory integrated circuit; and
the first modular card and the second modular card conduct memory bus signaling using the first pin set, the set of through holes, and the second pin set.

6. The electronic assembly of claim 4 , further comprising:
an integrated circuit device disposed at the first surface of the circuit board and having a third pin set of one or more pins, each pin of the third pin set coupled to a corresponding trace of a set of one or more traces of the circuit board;
wherein the first modular card socket further comprises a fourth pin set of one or more pins, each pin of the fourth pin set coupled to a corresponding trace of the set of one or more traces; and
wherein the first modular card and the integrated circuit device conduct bus signaling via the third pin set, the set of one or more traces, and the fourth pin set.

7. The electronic assembly of claim 1 , wherein the first modular card socket further comprises a third pin set of one or more pins, each pin of the third pin set coupled to a corresponding trace of a set of one or more traces of the circuit board.

8. An electronic assembly comprising:
a circuit board having a first mounting surface and a second mounting surface opposite the first mounting surface, the circuit board comprising:
a set of through holes, each through hole extending between the first mounting surface and the second mounting surface; and
a first trace set of one or more traces;

a first modular card connector assembly disposed at the first mounting surface and comprising a first pin set of one or more pins and a second pin set of one or more pins, each pin of the first pin set comprising a press-fit pin inserted in a corresponding through hole of the set of through holes and each pin of the second pin set coupled to a corresponding trace of the first trace set; and
a second modular card connector assembly disposed at the second mounting surface opposite of the first modular card connector assembly and comprising a third pin set of one or more pins, each pin of the third pin set comprising a press-fit pin inserted in a corresponding through hole of the plurality of through holes.

9. The electronic assembly of claim 8 , wherein the first modular card connector assembly comprises a first modular card socket having a socket opening to removably couple with a card edge of a modular card.

10. The electronic assembly of claim 9 , wherein the second modular card connector assembly comprises a second modular card socket having a second opening to removably couple with a modular card.

11. The electronic assembly of claim 10 , further comprising:
a first modular card coupled with the first modular card socket, the first modular card comprising:
a fourth pin set of one or more pins, each pin of the fourth pin set comprising a card edge contact electrically coupled to a corresponding pin of the first pin set via the socket opening of the first modular card socket;
a fifth pin set of one or more pins, each pin of the fifth set comprising a card edge contact coupled to a corresponding pin of the second pin set via the socket opening of the first modular card socket;
one or more processors; and
a memory controller coupled to the one or more processors and coupled to the fourth pin set of one or more pins; and

a second modular card coupled with the second modular card socket, the second modular card comprising:
a sixth pin set of one or more pins, each pin of the sixth pin set comprising a card edge contact electrically coupled to a corresponding pin of the third pin set via the socket opening of the second modular card socket; and
one or more memory integrated circuits electrically coupled to the sixth pin set of one or more pins.

12. The electronic assembly of claim 11 , further comprising:
an integrated circuit device disposed at the first mounting surface of the circuit board, the integrated circuit device comprising a seventh pin set of one or more pins, each pin of the seventh pin set electrically coupled to a corresponding trace of the first trace set.

13. The electronic assembly of claim 9 , wherein:
the second modular card connector assembly further comprises a fourth pin set of one or more pins; and
the circuit board further comprises:
a second trace set of one or more traces;
a first hole disposed at the first mounting surface, the first hole coupling a pin of the second pin set to the corresponding trace of the first trace set; and
a second hole disposed at the second mounting surface, the second hole coaxial with the first hole and coupling a pin of the fourth pin set to a trace of the second trace set.

14. The electronic assembly of claim 13 , wherein the first hole and second hole comprise one of: coaxial blind vias; and a back-drilled plated through hole.

15. The electronic assembly of claim 8 , further comprising:
a first modular card disposed at the first mounting surface; and
wherein the first modular card connector assembly comprises a first pin interface assembly fixedly attached to the first modular card; and
wherein the first pin set comprises one or more press-fit pins of the first pin interface assembly.

16. The electronic assembly of claim 15 , wherein:
the circuit board comprises a set of one or more press-fit holes, each press-fit hole coupled to a corresponding trace of the first trace set; and
the second pin set comprises one or more press-fit pins of the first pin interface assembly, each press-fit pin inserted in a corresponding press-fit hole of the set of one or more press-fit holes.

17. The electronic assembly of claim 15 , further comprising:
a second modular card disposed at the second mounting surface; and
wherein the second modular card connector assembly comprises a second pin interface assembly fixedly attached to the second modular card; and
wherein the third pin set comprises one or more press-fit pins of the second pin interface assembly.

18. The electronic assembly of claim 17 , wherein:
the first modular card comprises a processing modular card h

Assignees

• Fricker Jean-Philippe
• Advanced Micro Devices Inc

Inventors

• Fricker Jean-Philippe

Classifications

• H01R12/523 Primary

  by an interconnection through aligned holes in the boards or multilayer board · CPC title

• H01R12/724

  containing contact members forming a right angle · CPC title

• H01R12/721

  cooperating directly with the edge of the rigid printed circuits · CPC title