Encapsulating structure of OLED device

Patent metadata

Field	Value
Publication number	US-9276233-B2
Application number	US-201314359810-A
Country	US
Kind code	B2
Filing date	Dec 2, 2013
Priority date	Sep 24, 2013
Publication date	Mar 1, 2016
Grant date	Mar 1, 2016

Abstract

An encapsulating structure of an OLED device, comprising an upper substrate and a lower substrate that are disposed in opposition to each other, an OLED device, and a frit wall for sealing peripheries of the upper substrate and the lower substrate; two faces of the upper substrate and the lower substrate that are opposed abut against each other, the lower substrate has a recessed section, which is opened toward the upper substrate and within which the OLED device is positioned; the upper substrate has a first annular groove that is opened toward the lower substrate, the lower substrate has a second annular groove that is opposed to the first annular groove and opened toward the upper substrate, an upper bound of the frit wall is located in the first annular groove, and a lower bound of the frit wall is located in the second annular groove. The encapsulation stability of the encapsulating structure is relatively high, and service life of the OLED device is relatively long.

First claim

The invention claimed is:

1. An encapsulating structure of an OLED device, comprising an upper substrate and a lower substrate that are disposed in opposition to each other, an OLED device, and a frit wall for sealing peripheries of the upper substrate and the lower substrate;
wherein two faces of the upper substrate and the lower substrate that are opposed abut against each other, the lower substrate has a recessed section, which is opened toward the upper substrate and within which the OLED device is positioned; the upper substrate has a first annular groove that is opened toward the lower substrate, the lower substrate has a second annular groove that is opposed to the first annular groove and opened toward the upper substrate, an upper bound of the frit wall is located in the first annular groove, and a lower bound of the frit wall is located in the second annular groove.

2. The encapsulating structure claimed as claim 1 , wherein on a top side of the OLED device facing the upper substrate, there is provided a sealing layer, which hermetically fits to a periphery of the recessed section of the lower substrate, so as to seal the OLED device at the bottom of the recessed section.

3. The encapsulating structure claimed as claim 2 , wherein a side wall of the recessed section has a stepwise configuration, in which, a step face provided by the side wall of the recessed section is parallel to a bottom face of the recessed section and the OLED device is disposed at the bottom face of the recessed section, a side of the sealing layer facing the bottom face of the recessed section hermetically fits to the step face in the recessed section, and a top surface of the sealing layer is flush with a top surface of the lower substrate.

4. The encapsulating structure claimed as claim 2 , wherein the sealing layer is a sealing layer formed of an encapsulating thin film of at least one layer.

5. The encapsulating structure claimed as claim 2 , wherein the sealing layer includes multiple layers of an organic thin film, or multiple layers of an inorganic thin film, or multiple layers of an organic thin film and an inorganic thin film that are laminated alternately.

6. The encapsulating structure claimed as claim 5 , wherein the organic thin film is an organic thin film produced by polyimide, polyurea, polyamic acid, polyacrylic acid, polyester, polyethylene, or polypropylene; and the inorganic thin film is an inorganic thin film produced with SiOx, SiNx, SiCxNy, SiOxNy, AlOx, SnO2, AIN, MgF2, CaF2, In2O3or ITO.

7. The encapsulating structure claimed as claim 2 , wherein the sealing layer is a sealing layer formed of a resin material.

8. The encapsulating structure claimed as claim 2 , wherein the sealing layer includes a drying layer and a filling layer located between the drying layer and the upper substrate.

9. The encapsulating structure claimed as claim 8 , wherein the filling layer is a transparent filling layer formed of silicon oil, resin or liquid crystal.

10. The encapsulating structure claimed as claim 8 , wherein a side wall of the recessed section has two step faces, the drying layer hermetically fits to one of the step faces, and the filling layer hermetically fits to the other one of the step faces.

11. The encapsulating structure claimed as claim 1 , wherein a shape of a cross-section of the first annular groove is of an arc, a triangle, a rectangle or a trapezoid; and
a shape of a cross-section of the second annular groove is of an arc, a triangle, a rectangle or a trapezoid.

12. The encapsulating structure claimed as claim 1 , wherein the upper substrate and the lower substrate are glass substrates.

13. The encapsulating structure claimed as claim 3 , wherein the sealing layer is a sealing layer formed of an encapsulating thin film of at least one layer.

14. The encapsulating structure claimed as claim 3 , wherein the sealing layer includes multiple layers of an organic thin film, or multiple layers of an inorganic thin film, or multiple layers of an organic thin film and an inorganic thin film that are laminated alternately.

15. The encapsulating structure claimed as claim 14 , wherein the organic thin film is an organic thin film produced by polyimide, polyurea, polyamic acid, polyacrylic acid, polyester, polyethylene, or polypropylene; and
the inorganic thin film is an inorganic thin film produced with SiOx, SiNx, SiCxNy, SiOxNy, AlOx, SnO2, AIN, MgF2, CaF2, In2O3or ITO.

16. The encapsulating structure claimed as claim 3 , wherein the sealing layer is a sealing layer formed of a resin material.

17. The encapsulating structure claimed as claim 3 , wherein the sealing layer includes a drying layer and a filling layer located between the drying layer and the upper substrate.

18. The encapsulating structure claimed as claim 17 , wherein the filling layer is a transparent filling layer formed of silicon oil, resin or liquid crystal.

19. The encapsulating structure claimed as claim 17 , wherein a side wall of the recessed section has two step faces, the drying layer hermetically fits to one of the step faces, and the filling layer hermetically fits to the other one of the step faces.

Assignees

• Boe Technology Group Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Zhang Yuxin

Classifications

• H10K50/844

  Encapsulations · CPC title

• H01L51/5246 Primary

  Electricity · mapped topic

• H10K50/8426 Primary

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title