Light emitting device and method for producing same

Patent metadata

Field	Value
Publication number	US-9276179-B2
Application number	US-201313958653-A
Country	US
Kind code	B2
Filing date	Aug 5, 2013
Priority date	Jun 25, 2008
Publication date	Mar 1, 2016
Grant date	Mar 1, 2016

Abstract

There is provided a light emitting device highly resistant to the environment, and having good heat resistance, light resistance and gas barrier property, and a method for producing same. With the light emitting device, a substrate 2 and interconnect patterns 5 A, 5 B formed on the surface thereof are covered with an acrylic resin primer 10 having better gas barrier property than a silicone resin sealing resin part 3 . Light resistance is ensured by the silicone resin sealing resin portion 3 and the gas barrier property can be ensured by the acrylic resin primer 10.

First claim

The invention claimed is:

1. A light emitting device comprising:
a substrate;
a metal portion formed on a surface of the substrate;
an LED chip supported by the substrate;
a sealing resin portion which covers the LED chip; and
a primer made of resin and provided between the metal portion and the sealing resin portion and contacting both the metal portion and the sealing resin portion,
wherein at least a top surface of the LED chip is exposed on the outside of the primer and wherein the primer does not exist between the substrate and the LED chip;
a wall portion protruding from the substrate;
a metal reflecting film formed on an inner wall surface of the wall portion;
wherein the metal reflecting film is covered with the sealing resin portion, and
wherein the primer is provided between the metal reflecting film and the sealing resin portion, and
wherein the primer contacts both the metal reflecting film and the sealing resin portion.

Assignees

• Sharp Kk

Inventors

• Takenaka Yasuji
• Takemoto Masashi
• Aoki Nobuaki

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W72/01515

  Forming coatings · CPC title