Integrated chip and manufacturing method therefor, and full-color integrated chip and display panel
US-12183868-B2 · Dec 31, 2024 · US
US9276175B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9276175-B2 |
| Application number | US-97967310-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 28, 2010 |
| Priority date | Dec 29, 2009 |
| Publication date | Mar 1, 2016 |
| Grant date | Mar 1, 2016 |
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Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a light emitting structure, a buffer layer on the light emitting structure, and a filter layer on the buffer layer.
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What is claimed is: 1. A light emitting device comprising: a light emitting structure including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a support layer on the light emitting structure; a filter layer on the support layer; and an air gap inter-disposed between the light emitting structure and the filter layer, wherein the filter layer comprises: a first dielectric layer having a first refractive index; and a second dielectric layer on the first dielectric layer, the second dielectric layer having a second refractive index different from the first refractive index, wherein an outer side surface of the support layer is vertically aligned with an outer side surface of the filter layer; wherein a lateral width of the air gap is greater than a lateral width of the support layer, and wherein all top surfaces of the support layer directly contact a bottom surface of the filter layer. 2. The light emitting device according to claim 1 , wherein the support layer comprises one of copper (Cu) and gold (Au). 3. The light emitting device according to claim 1 , wherein a thickness of the first dielectric layer and a thickness of the second dielectric layer are both λ/(4n×cosθ), where λ is a wavelength of long-wavelength light to be reflected, n is a refractive index of the first or the second dielectric layer, respectively, and θ is an angle of incident light. 4. The light emitting device according to claim 1 , further comprising a phosphor layer on the filter layer. 5. The light emitting device according to claim 1 , further comprising: at least one electrode on the light emitting structure; and a conductive or non-conductive substrate under the light emitting structure. 6. The light emitting device according to claim 1 , wherein the air gap is flush with the support layer. 7. The light emitting device according to claim 1 , wherein the support layer is only between a periphery of the filter layer and a periphery of the light emitting structure. 8. The light emitting device according to claim 1 , wherein a maximum lateral width of the air gap is greater than a maximum lateral width of the support layer. 9. A light emitting device comprising: a light emitting structure including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a support layer on the light emitting structure; a filter layer on the support layer, and an air gap inter-disposed between the light emitting structure and the filter layer, wherein a topmost surface of the support layer is flush with a bottom most surface of the filter layer, wherein a lateral width of the air gap is greater than a lateral width of the support layer, and wherein all top surfaces of the support layer directly contact a bottom surface of the filter layer. 10. The light emitting device according to claim 9 , further comprising a phosphor layer on the filter layer. 11. The light emitting device according to claim 10 , wherein the phosphor layer comprises a substantially flat top surface. 12. The light emitting device according to claim 9 , further comprising: at least one electrode on the light emitting structure; and a conductive or non-conductive substrate under the light emitting structure. 13. The light emitting device according to claim 9 , wherein the air gap is flush with the support layer. 14. The light emitting device according to claim 9 , wherein the support layer is only between a periphery of the filter layer and a periphery of the light emitting structure. 15. The light emitting device according to claim 9 , wherein a maximum lateral width of the air gap is greater than a maximum lateral width of the support layer. 16. A light emitting device package comprising: a package body; at least one electrode layer on the package body; and a light emitting device electrically connected to the electrode layer, wherein the light emitting device comprises: a light emitting structure including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a support layer on the light emitting structure; a filter layer on the support layer; and an air gap inter-disposed between the light emitting structure and the filter layer, wherein the filter layer comprises: a first dielectric layer having a first refractive index; and a second dielectric layer on the first dielectric layer, the second dielectric layer having a second refractive index different from the first refractive index, wherein an outer side surface of the support layer is vertically aligned with an outer side surface of the filter layer; wherein a lateral width of the air gap is greater than a lateral width of the support layer, and wherein all to surfaces of the support layer directly contact a bottom surface of the filter.
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