Optical sensor chip device and corresponding production method

Patent metadata

Field	Value
Publication number	US-9275974-B2
Application number	US-201414177722-A
Country	US
Kind code	B2
Filing date	Feb 11, 2014
Priority date	Feb 11, 2013
Publication date	Mar 1, 2016
Grant date	Mar 1, 2016

Abstract

An optical sensor chip device and a corresponding production method. The optical sensor chip device includes a substrate having a front side and a rear side; at least one first optical sensor chip for acquiring a first optical spectral range, the chip being attached to the substrate; and a first sealed cavern fashioned above an upper side of the first optical sensor chip. The first optical sensor chip is situated on a first side of the first cavern, and a first optical device is situated on an opposite, second side of the first cavern.

First claim

What is claimed is:

1. An optical sensor chip device, comprising:
a substrate having a front side and a rear side;
at least one first optical sensor chip which is attached to the substrate to acquire a first optical spectral range;
a first sealed cavern fashioned above an upper side of the first optical sensor chip, wherein the first optical sensor chip is situated on a first side of the first cavern, and a first optical device is situated on an opposite, second side of the first cavern; and
a cap fashioned on the upper side of the optical sensor chip, the cap enclosing a hollow space having a vacuum.

2. The optical sensor chip device as recited in claim 1 , wherein the first optical sensor chip is bonded, via its lower side, onto the front side of the substrate, and the first cavern being limited laterally by a rim that is attached on the front side of the substrate.

3. The optical sensor chip device as recited in claim 2 , the rim covers the first sensor chip at least in some regions.

4. The optical sensor chip device as recited in claim 2 , wherein the substrate is a semiconductor substrate or a glass substrate, and the rim being a molding compound.

5. The optical sensor chip device as recited in claim 1 , wherein the first optical sensor chip has a through-plating that runs from the upper side to the lower side of the first optical sensor chip, and that is bonded to a through-plating of the substrate.

6. The optical sensor chip device as recited in claim 1 , further comprising:
at least one of a wake-up chip device and a microcontroller attached on the substrate.

7. An optical sensor chip device, comprising:
a substrate having a front side and a rear side;
at least one first optical sensor chip which is attached to the substrate to acquire a first optical spectral range;
a first sealed cavern fashioned above an upper side of the first optical sensor chip, wherein the first optical sensor chip is situated on a first side of the first cavern, and a first optical device is situated on an opposite, second side of the first cavern;
a second optical sensor chip to acquire a second optical spectral range; and
a second sealed cavern fashioned above an upper side of the second optical sensor chip, the second optical sensor chip being situated on a first side of the second cavern, and a second optical device being situated on an opposite, second side of the second cavern.

8. The optical sensor chip device as recited in claim 7 , wherein the first optical sensor chip is fashioned for acquiring visible light, and the second optical sensor chip is fashioned for acquiring electromagnetic radiation in the infrared range, and the first optical device and the second optical device being lens devices.

9. An optical sensor chip device, comprising:
a substrate having a front side and a rear side;
at least one first optical sensor chip which is attached to the substrate to acquire a first optical spectral range; and
a first sealed cavern fashioned above an upper side of the first optical sensor chip, wherein the first optical sensor chip is situated on a first side of the first cavern, and a first optical device is situated on an opposite, second side of the first cavern;
wherein the first optical sensor chip is bonded via its upper side onto the rear side of the substrate, and the first cavern is limited laterally at least in some regions by a through-hole running through the substrate.

10. The optical sensor chip device as recited in claim 9 , wherein the first optical device is attached on the front side of the substrate at the through-hole.

11. The optical sensor chip device as recited in claim 10 , wherein the first cavern above the substrate is limited laterally by a rim that is connected to the through-hole and that is attached on the front side of the substrate.

12. A method for producing an optical sensor chip device, comprising:
providing a substrate having a front side and a rear side;
attaching to the substrate at least one first optical sensor chip for acquiring a first optical spectral range; and
forming a first sealed cavern above an upper side of the first optical sensor chip, the first optical sensor chip being situated on a first side of the first cavern, and a first optical device being situated on an opposite, second side of the first cavern;
wherein the optical sensor chip is bonded via its upper side onto the rear side of the substrate, and a respective through-hole that runs through the substrate is formed, the cavern being laterally limited at least in some regions by a through-hole.

13. The method for producing an optical sensor chip device as recited in claim 12 , further comprising:
bonding the first chip via its respective lower side onto the front side of the substrate; and
forming a rim so as to be attached on the front side of the substrate, the first cavern being laterally limited by the rim.

Assignees

• Kaschner Axel
• Krueger Michael
• Bosch Gmbh Robert

Inventors

• Kaschner Axel
• Krueger Michael

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10F39/193

  Infrared image sensors · CPC title

• H10F39/184

  Infrared image sensors · CPC title

• H10F77/407 Primary

  indirectly associated with the devices · CPC title

• H10F39/804

  Containers or encapsulations · CPC title