Evaporators for heat transfer systems

US9273887B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9273887-B2
Application numberUS-201213421524-A
CountryUS
Kind codeB2
Filing dateMar 15, 2012
Priority dateJun 30, 2000
Publication dateMar 1, 2016
Grant dateMar 1, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A heat transfer system includes an evaporator having a heated wall, a liquid barrier wall containing working fluid, a primary wick positioned between the heated wall and an inner side of the liquid barrier wall, a vapor removal channel located at an interface between the primary wick and the heated wall, and a liquid flow channel located between the liquid barrier wall and the primary wick. Methods of transferring heat include applying heat energy to a vapor barrier wall, flowing liquid through a liquid flow channel, pumping the liquid from the liquid flow channel through a primary wick, and evaporating at least some of the liquid at a vapor removal channel.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of making an evaporator, the method comprising: orienting a heated wall having a planar shape to define at least a portion of an exterior surface of the evaporator with a heat-absorbing surface of the heated wall configured to receive heat; orienting a liquid barrier wall having a planar shape configured to confine liquid adjacent the heated wall; positioning a wick between the heated wall and the liquid barrier wall; defining at least one vapor removal channel at an interface between the wick and the heated wall; defining at least one liquid flow channel between the liquid barrier wall and the wick; and defining a vapor vent channel substantially between the wick and the liquid barrier wall proximate the at least one liquid flow channel, the vapor vent channel sized and configured to remove vapor bubbles from the wick. 2. The method of claim 1 , wherein defining at least one liquid flow channel between the liquid barrier wall and the wick comprises forming the at least one liquid flow channel in at least one of an inner surface of the liquid barrier wall and an outer surface of the wick. 3. The method of claim 1 , further comprising orienting a subcooler adjacent the liquid barrier wall. 4. The method of claim 1 , wherein defining at least one vapor removal channel at an interface between the wick and the heated wall comprises forming the at least one vapor removal channel in at least one of an inner surface of the heated wall and an outer surface of the wick and wherein defining at least one liquid flow channel between the liquid barrier wall and the wick comprises forming the at least one liquid flow channel in at least one of an inner surface of the liquid barrier wall and the outer surface of the wick. 5. The method of claim 1 , wherein: defining at least one liquid flow channel between the liquid barrier wall and the wick comprises forming the at least one liquid flow channel in one of an inner surface of the liquid barrier wall and the outer surface of the wick; and defining a vapor vent channel substantially between the wick and the liquid barrier wall proximate the at least one liquid flow channel comprises forming the vapor vent channel in the other one of the inner surface of the liquid barrier wall and the outer surface of the wick. 6. The method of claim 1 , wherein defining at least one vapor removal channel at an interface between the wick and the heated wall comprises forming the at least one vapor removal channel in at least one of an inner surface of the heated wall and an outer surface of the wick. 7. The method of claim 6 , further comprising electroetching the at least one vapor removal channel into the heated wall. 8. The method of claim 6 , machining the at least one vapor removal channel into the heated wall. 9. A method of making an evaporator, the method comprising: orienting a heated wall such that a heat-absorbing surface of the heated wall defines at least a portion of an exterior surface of the evaporator configured to receive heat; orienting a liquid barrier wall configured to confine liquid adjacent the heated wall; positioning a primary wick between the heated wall and the liquid barrier wall; defining at least one vapor removal channel at an interface between the primary wick and the heated wall; defining at least one liquid flow channel between the liquid barrier wall and the primary wick; and positioning a secondary wick between the at least one liquid flow channel and the primary wick. 10. The method of claim 9 , further comprising defining a vapor vent channel at an interface between the secondary wick and the primary wick. 11. The method of claim 9 , further comprising forming the heated wall and the liquid barrier wall into a planar shape. 12. The method of claim 9 , further comprising forming the heated wall and the liquid barrier wall into an annular shape. 13. The method of claim 12 , further comprising positioning the heated wall inside of and coaxial with the liquid barrier wall. 14. The method of claim 13 , further comprising forming a plurality of fins on an outer surface of the liquid barrier wall. 15. The method of claim 13 , further comprising positioning the primary wick to be coaxial within the liquid barrier wall and the heated wall. 16. A method of making an evaporator, the method comprising: defining at least a portion of an exterior surface of the evaporator with a heat-absorbing surface of a heated wall configured to receive heat; positioning a wick to extend between the heated wall and a liquid barrier wall positioned proximate the heated wall and configured to confine liquid; forming at least one liquid flow channel in at least one of an inner surface of the liquid barrier wall and a surface of the wick; forming at least one vapor removal channel in at least one of an inner surface of the heated wall and another surface of the wick; positioning a secondary wick between the wick and the at least one liquid flow channel; and forming a vapor vent channel at an interface between the secondary wick and the wick configured to remove vapor bubbles from the wick. 17. The method of claim 16 , further comprising forming fins on an outer surface of the liquid barrier wall. 18. The method of claim 16 , further comprising selecting the wick to exhibit a planar shape. 19. The method of claim 18 , further comprising selecting the heated wall and the liquid barrier wall to both exhibit a planar shape.

Assignees

Inventors

Classifications

  • Heat exchanger or boiler making · CPC title

  • F25B23/006Primary

    boiling cooling systems · CPC title

  • forming loops, e.g. capillary pumped loops · CPC title

Patent family

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Frequently asked questions

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What does patent US9273887B2 cover?
A heat transfer system includes an evaporator having a heated wall, a liquid barrier wall containing working fluid, a primary wick positioned between the heated wall and an inner side of the liquid barrier wall, a vapor removal channel located at an interface between the primary wick and the heated wall, and a liquid flow channel located between the liquid barrier wall and the primary wick. Met…
Who is the assignee on this patent?
Kroliczek Edward J, Nikitkin Michael, Wolf Sr David A, and 1 more
What technology area does this patent fall under?
Primary CPC classification F25B23/006. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Mar 01 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).