Bonding material comprising coated silver nanoparticles and bonded object produced using same

Patent metadata

Field	Value
Publication number	US-9273235-B2
Application number	US-201114124509-A
Country	US
Kind code	B2
Filing date	Jun 10, 2011
Priority date	Jun 10, 2011
Publication date	Mar 1, 2016
Grant date	Mar 1, 2016

Abstract

A bonding material using silver nanoparticles considerably changes in coating-material property in response to a slight change in composition, and the stability thereof has been insufficient for large-amount application. A bonding material which uses silver nanoparticles, meets the requirements for mass printing, attains dimensional stability, and gives a smooth printed surface is provided. The bonding material includes silver nanoparticles which have at least an average primary particle diameter of 1 nm to 200 nm and have been coated with an organic substance having 8 or less carbon atoms, a dispersion medium, and a viscosity modifier composed of an organic substance, and has a viscosity (measured at a shear rate of 15.7 [1/s]) of 100 Pa·s or lower and a thixotropic ratio (measured at a shear rate of 3.1 [1/s]/measured at a shear rate of 15.7 [1/s]) of 4 or lower.

First claim

The invention claimed is:

1. A bonding material comprising: silver nanoparticles which have an average primary particle diameter of 1 nm to 200 nm and have been coated with an organic substance having 8 or less carbon atoms; a dispersion medium; and a viscosity modifier composed of an organic substance, wherein the bonding material has a viscosity measured at a shear rate of 15.7 [1/s] of 100 Pa·s or lower and a thixotropic ratio (a viscosity measured at a shear rate of 3.1 [1/s]/a viscosity measured at a shear rate of 15.7 [1/s]) of 4 or lower.

2. The bonding material according to claim 1 , further comprising silver particles having an average particle diameter of 0.5 to 10.0 μm.

3. The bonding material according to claim 1 , wherein the viscosity modifier is a substance having an ether linkage in its structure.

4. The bonding material according to claim 3 , wherein the viscosity modifier further has a carboxyl group.

5. The bonding material according to claim 1 , wherein the viscosity modifier contains two or three ether linkages in the structure.

6. The bonding material according to claim 5 , wherein the viscosity modifier further has a carboxyl group.

7. The bonding material according to claim 1 , wherein the viscosity modifier is any of 2-methoxyethoxyacetic acid and 2-butoxyethoxyacetic acid.

8. The bonding material according to claim 1 , wherein a weight reduction ratio between 250° C. and 350° C. during an increase in temperature from 40° C. at 10° C./min is 0.1% or less in TG measurement under a nitrogen atmosphere.

9. A silver coating film by a screen printing method using the bonding material according to claim 1 , wherein a surface roughness (Ra) measured with a laser microscope immediately after printing is 10 μm or less.

10. A bonded object formed using the bonding material according to claim 1 .

Assignees

• Kurita Satoru
• Hinotsu Takashi
• Sasaki Shinya
• Dowa Electronics Materials Co Ltd

Inventors

• Kurita Satoru
• Hinotsu Takashi
• Sasaki Shinya

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/01323

  in liquid form, e.g. by dispensing droplets or by screen printing · CPC title

• H10W72/353

  not comprising solid metals or solid metalloids, e.g. ceramics · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title