Electronic module

US9271418B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9271418-B2
Application numberUS-201214009166-A
CountryUS
Kind codeB2
Filing dateFeb 29, 2012
Priority dateApr 1, 2011
Publication dateFeb 23, 2016
Grant dateFeb 23, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The invention relates to an electronic module comprising at least one electronic or electric component ( 3 ), a base plate ( 4 ), and a support plate ( 2 ), in particular a printed circuit board or a substrate. Said support plate ( 2 ) is arranged on the base plate ( 4 ) and comprises conductor paths. Said base plate ( 4 ) comprises a blind hole-type recess ( 5 ) on a side oriented towards the support plate ( 2 ). The component ( 3 ) is in contact on the support plate ( 2 ) and is arranged in the recess ( 5 ) of the base plate ( 4 ).

First claim

Opening claim text (preview).

The invention claimed is: 1. An electronic module, comprising: at least one electronic or electric component ( 3 ), a base plate ( 4 ) and a support plate ( 2 ), said support plate ( 2 ) being arranged on the base plate ( 4 ) and comprising conductor paths, wherein said base plate ( 4 ) comprises a blind hole-type recess ( 5 ) on a side oriented towards the support plate ( 2 ), wherein the at least one electronic or electric component ( 3 ) is mounted on the support plate ( 2 ) and is arranged in the recess ( 5 ) of the base plate ( 4 ), and wherein the support plate ( 2 ) comprises a base area ( 20 ) and at least one connection element ( 21 ), which is integrally formed with the base area ( 20 ) and is positioned at a non-zero angle (α) to said base area ( 20 ), a sensor ( 6 ) being arranged in the at least one connection element ( 21 ). 2. The electronic module according to claim 1 , characterized in that at least one sensor ( 6 , 8 ) is arranged on a side of the support plate ( 2 ) facing away from the base plate ( 4 ). 3. The electronic module according to claim 1 , characterized in that the at least one electronic or electric component ( 3 ) is an interference suppression component. 4. The electronic module according to claim 3 , characterized in that the interference suppression component is arranged on the support plate ( 2 ) facing the base plate ( 4 ) in proximity of a component in which interference is to be suppressed. 5. The electronic module according to claim 1 , characterized in that the at least one electronic or electric component ( 3 ) is a HDI printed circuit board. 6. The electronic module according to claim 1 , characterized in that a cavity ( 5 a ) of the recess ( 5 ) is completely or partially filled with a sealing compound. 7. The electronic module according to claim 1 , characterized in that the base plate ( 4 ) is embodied as a cooling plate. 8. The electronic module according to claim 1 , characterized in that the at least one electronic or electric component ( 3 ) arranged in the recess ( 5 ) is fixedly bonded in said recess ( 5 ) by means of an adhesive. 9. The electronic module according to claim 1 , further comprising a reinforcing element ( 7 ) which supports the connection element ( 21 ). 10. The electronic module according to claim 1 , characterized in that the support plate ( 2 ) is a printed circuit board or a substrate. 11. The electronic module according to claim 1 , characterized in that the base plate ( 4 ) is embodied as a cooling plate made from aluminum. 12. The electronic module according to claim 1 , characterized in that a cavity ( 5 a ) of the recess ( 5 ) is completely or partially filled with a sealing compound which has a very good thermal conductivity.

Assignees

Inventors

Classifications

  • H05K1/182Primary

    associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] · CPC title

  • H05K7/06Primary

    on insulating boards {, e.g. wiring harnesses (for printed circuits H05K1/18, H05K3/30)} · CPC title

  • Filters, inductors or a magnetic substance · CPC title

  • Sensor · CPC title

  • specially adapted for transmission control units, e.g. gearbox controllers · CPC title

Patent family

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Frequently asked questions

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What does patent US9271418B2 cover?
The invention relates to an electronic module comprising at least one electronic or electric component ( 3 ), a base plate ( 4 ), and a support plate ( 2 ), in particular a printed circuit board or a substrate. Said support plate ( 2 ) is arranged on the base plate ( 4 ) and comprises conductor paths. Said base plate ( 4 ) comprises a blind hole-type recess ( 5 ) on a side oriented towards the …
Who is the assignee on this patent?
Braun Holger, Bubeck Helmut, Lausmann Matthias, and 5 more
What technology area does this patent fall under?
Primary CPC classification H05K1/182. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 23 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).