Socket, circuit board assembly, and apparatus having the same
US-9204549-B2 · Dec 1, 2015 · US
US9271418B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9271418-B2 |
| Application number | US-201214009166-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 29, 2012 |
| Priority date | Apr 1, 2011 |
| Publication date | Feb 23, 2016 |
| Grant date | Feb 23, 2016 |
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The invention relates to an electronic module comprising at least one electronic or electric component ( 3 ), a base plate ( 4 ), and a support plate ( 2 ), in particular a printed circuit board or a substrate. Said support plate ( 2 ) is arranged on the base plate ( 4 ) and comprises conductor paths. Said base plate ( 4 ) comprises a blind hole-type recess ( 5 ) on a side oriented towards the support plate ( 2 ). The component ( 3 ) is in contact on the support plate ( 2 ) and is arranged in the recess ( 5 ) of the base plate ( 4 ).
Opening claim text (preview).
The invention claimed is: 1. An electronic module, comprising: at least one electronic or electric component ( 3 ), a base plate ( 4 ) and a support plate ( 2 ), said support plate ( 2 ) being arranged on the base plate ( 4 ) and comprising conductor paths, wherein said base plate ( 4 ) comprises a blind hole-type recess ( 5 ) on a side oriented towards the support plate ( 2 ), wherein the at least one electronic or electric component ( 3 ) is mounted on the support plate ( 2 ) and is arranged in the recess ( 5 ) of the base plate ( 4 ), and wherein the support plate ( 2 ) comprises a base area ( 20 ) and at least one connection element ( 21 ), which is integrally formed with the base area ( 20 ) and is positioned at a non-zero angle (α) to said base area ( 20 ), a sensor ( 6 ) being arranged in the at least one connection element ( 21 ). 2. The electronic module according to claim 1 , characterized in that at least one sensor ( 6 , 8 ) is arranged on a side of the support plate ( 2 ) facing away from the base plate ( 4 ). 3. The electronic module according to claim 1 , characterized in that the at least one electronic or electric component ( 3 ) is an interference suppression component. 4. The electronic module according to claim 3 , characterized in that the interference suppression component is arranged on the support plate ( 2 ) facing the base plate ( 4 ) in proximity of a component in which interference is to be suppressed. 5. The electronic module according to claim 1 , characterized in that the at least one electronic or electric component ( 3 ) is a HDI printed circuit board. 6. The electronic module according to claim 1 , characterized in that a cavity ( 5 a ) of the recess ( 5 ) is completely or partially filled with a sealing compound. 7. The electronic module according to claim 1 , characterized in that the base plate ( 4 ) is embodied as a cooling plate. 8. The electronic module according to claim 1 , characterized in that the at least one electronic or electric component ( 3 ) arranged in the recess ( 5 ) is fixedly bonded in said recess ( 5 ) by means of an adhesive. 9. The electronic module according to claim 1 , further comprising a reinforcing element ( 7 ) which supports the connection element ( 21 ). 10. The electronic module according to claim 1 , characterized in that the support plate ( 2 ) is a printed circuit board or a substrate. 11. The electronic module according to claim 1 , characterized in that the base plate ( 4 ) is embodied as a cooling plate made from aluminum. 12. The electronic module according to claim 1 , characterized in that a cavity ( 5 a ) of the recess ( 5 ) is completely or partially filled with a sealing compound which has a very good thermal conductivity.
associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] · CPC title
on insulating boards {, e.g. wiring harnesses (for printed circuits H05K1/18, H05K3/30)} · CPC title
Filters, inductors or a magnetic substance · CPC title
Sensor · CPC title
specially adapted for transmission control units, e.g. gearbox controllers · CPC title
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