High electron mobility transistor and method for forming the same
US-12176414-B2 · Dec 24, 2024 · US
US9269801B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9269801-B2 |
| Application number | US-201214369027-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 12, 2012 |
| Priority date | Dec 27, 2011 |
| Publication date | Feb 23, 2016 |
| Grant date | Feb 23, 2016 |
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A normally-off-type HFET includes: an undoped Al w Ga 1-w N layer of t 1 thickness, an undoped Al x Ga 1-x N layer of t 2 thickness and an undoped GaN channel layer of t ch thickness that are sequentially stacked; a source electrode and a drain electrode separated from each other and electrically connected to the channel layer; an undoped Al y Ga 1-y N layer of t 3 thickness formed between the source electrode and the drain electrode on the channel layer; an Al z Ga 1-z N layer of t 4 thickness formed in a shape of a mesa on a partial area of the Al y Ga 1-y N layer between the source electrode and the drain electrode; and a Schottky barrier type gate electrode formed on the Al z Ga 1-z N layer, in which conditions of y>x>w>z, t 1 >t 4 >t 3 and 2wt ch /(x−w)>t 2 >1 nm are satisfied.
Opening claim text (preview).
The invention claimed is: 1. A normally-off-type HFET comprising: an undoped Al w Ga 1-w N layer of t 1 thickness, an undoped Al x Ga 1-x N layer of t 2 thickness and an undoped GaN channel layer of t ch thickness that are sequentially stacked; a source electrode and a drain electrode separated from each other and electrically connected to said channel layer; an undoped Al y Ga 1-y N layer of t 3 thickness formed between said source electrode and said drain electrode on said channel layer; an Al z Ga 1-z N layer of t 4 thickness formed in a shape of a mesa on a partial area of said Al y Ga 1-y N layer between said source electrode and said drain electrode; and a Schottky barrier type gate electrode formed on said Al z Ga 1-z N layer, conditions of y>x>w>z, t 1 >t 4 >t 3 and 2wt ch /(x−w)>t 2 >1 nm being satisfied. 2. The normally-off-type HFET according to claim 1 , wherein a condition of w−z>0.03 is satisfied. 3. The normally-off-type HFET according to claim 1 , wherein a condition of t 4 /t 3 >4 is satisfied. 4. The normally-off-type HFET according to claim 1 , wherein said Al z Ga 1-z N layer is undoped. 5. The normally-off-type HFET according to claim 1 , wherein the gate electrode comprises an Ni/Au stacked layer, a WN layer, a TiN layer, a W layer, or a Ti layer. 6. The normally-off-type HFET according to claim 1 , wherein said Al w Ga 1-w N layer, said Al x Ga 1-x N layer, said GaN channel layer, said Al y Ga 1-y N layer, and said Al z Ga 1-z N layer each have a Ga polarity in which a Ga atomic plane appears on a (0001) plane of an upper surface side. 7. A normally-off-type HFET comprising: an undoped Al w Ga 1-w N layer of t 1 thickness and an undoped GaN channel layer of t ch thickness that are sequentially stacked; a source electrode and a drain electrode separated from each other and electrically connected to said channel layer; an undoped Al y Ga 1-y N layer of t 3 thickness formed between said source electrode and said drain electrode on said channel layer; an Al z Ga 1-z N layer of t 4 thickness formed in a shape of a mesa on a partial area of said Al y Ga 1-y N layer between said source electrode and said drain electrode; and a Schottky barrier type gate electrode formed on said Al z Ga 1-z N layer, conditions of y>w>z and t 1 >t 4 >t 3 being satisfied.
comprising only Group III-V materials heterojunctions, e.g. GaN/AlGaN heterojunctions · CPC title
Nitride Group III-V materials, e.g. AlN or GaN · CPC title
Electrodes comprising a Schottky barrier to a semiconductor · CPC title
being Group III-V materials, e.g. GaAs · CPC title
Schottky barrier electrodes · CPC title
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