Insulated gate semiconductor device having a shield electrode structure

Patent metadata

Field	Value
Publication number	US-9269779-B2
Application number	US-201414336770-A
Country	US
Kind code	B2
Filing date	Jul 21, 2014
Priority date	Jul 21, 2014
Publication date	Feb 23, 2016
Grant date	Feb 23, 2016

Abstract

A semiconductor device includes a semiconductor region with a charge balance region on a junction blocking region, which has a lower doping concentration. A trench structure having an insulated shield electrode and an insulated gate electrode is provided in the semiconductor region. The semiconductor device further includes one or more features configured to improve operating performance. The features include terminating the trench structure in the junction blocking region, providing a localized doped region adjoining a lower surface of a body region and spaced apart from the trench structure, disposing a notch proximate to the lower surface of the body region, and/or configuring the insulated shield electrode to have a wide portion adjoining a narrow portion.

First claim

What is claimed is:

1. An insulated gate semiconductor device structure comprising:
a region of semiconductor material comprising:
a semiconductor substrate;
a first semiconductor layer of a first conductivity type and a first dopant concentration on the semiconductor substrate; and
a second semiconductor layer on the first semiconductor layer, the second semiconductor layer having the first conductivity type, having a second dopant concentration greater than the first dopant concentration, and having a major surface;

a body region of a second conductivity type in the second semiconductor layer extending from the major surface;
a first trench structure in the first semiconductor layer and the second semiconductor layer extending from the major surface adjacent the body region, and wherein the first trench structure comprises:
a first trench terminating within the first semiconductor layer;
a first insulated gate electrode; and
a first insulated shield electrode below the first insulated gate electrode;

a second trench structure in the first semiconductor layer and the second semiconductor layer extending from the major surface adjacent the body region and laterally spaced apart from the first trench structure, and wherein the second trench structure comprises:
a second trench terminating within the first semiconductor layer;
a second insulated gate electrode; and
a second insulated shield electrode below the second insulated gate electrode, wherein the second semiconductor layer is a continuous layer extending between the first trench and the second trench;

a first source region of the first conductivity type in the body region adjacent the first trench structure; and
a second source region of the first conductivity type in the body region adjacent the second trench structure.

2. The structure of claim 1 , further comprising a first doped region of the second conductivity type in the second semiconductor layer adjacent a lower surface of the body region, wherein a portion of the second semiconductor layer separates the first doped region from the first trench structure, another portion of the second semiconductor layer separates the first doped region from the second trench structure, and a further portion of the second semiconductor layer separates the first doped region from the first semiconductor layer.

3. The structure of claim 2 , wherein the first doped region adjoins the lower surface of the body region.

4. The structure of claim 2 , wherein the first doped region is in the second semiconductor layer and spaced apart from the body region.

5. The structure of claim 2 further comprising a plurality of second doped regions of the second conductivity type between the first doped region and the major surface and spaced apart from the first and second trench structures, wherein the first doped region is partially within the body region and partially within the second semiconductor layer.

6. The structure of claim 2 further comprising a second doped region of the first conductivity type in the second semiconductor layer adjacent the first doped region and adjacent the first and second trench structures.

7. The structure of claim 1 , wherein the first shield electrode comprises a first portion and a second portion, wherein the first portion is wider than the second portion, and wherein the first portion is between the first insulated gate electrode and the second portion.

8. The structure of claim 1 , wherein the first trench structure comprises a sidewall profile having a notch oriented substantially inward towards an inner portion of the first trench and adjacent the lower surface of the body region.

9. The structure of claim 8 , wherein the lower surface of the body region is above the notch.

10. The structure of claim 8 , wherein the sidewall profile tapers inward as the trench extends downward from the major surface towards the notch.

11. The structure of claim 10 , wherein the sidewall profile is substantially perpendicular to the major surface as the first trench extends downward from the notch towards a lower surface of the first trench.

12. An insulated gate semiconductor device structure comprising:
a region of semiconductor material comprising:
a semiconductor substrate;
a first semiconductor layer of a first conductivity type and a first dopant concentration on the semiconductor substrate; and
a second semiconductor layer on the first semiconductor layer, the second semiconductor layer having the first conductivity type, having a second dopant concentration greater than the first dopant concentration, and having a major surface;

a body region of a second conductivity type in the second semiconductor layer extending from the major surface;
a trench structure in the first semiconductor layer and the second semiconductor layer extending from the major surface adjacent the body region, and wherein the trench structure comprises:
a trench;
an insulated gate electrode; and
an insulated shield electrode below the insulated gate electrode; and

a source region of the first conductivity type in the body region adjacent the trench structure, wherein:
the trench structure comprises a sidewall profile having a notch oriented substantially inward towards an inner portion of the trench and adjacent the lower surface of the body region.

13. The structure of claim 12 , wherein the trench structure terminates within the first semiconductor layer.

14. The structure of claim 12 , wherein the shield electrode comprises a first portion and a second portion, wherein the first portion is wider than the second portion.

15. The structure of claim 12 further comprising a doped region of the second conductivity type in the second semiconductor layer adjacent a lower surface of the body region, wherein a portion of the second semiconductor layer separates the doped region from the trench structure.

16. The structure of claim 15 , wherein the doped region adjoins the lower surface of the body region.

17. An insulated gate semiconductor device structure comprising:
a region of semiconductor material comprising:
a semiconductor substrate;
a first semiconductor layer of a first conductivity type and a first dopant concentration on the semiconductor substrate; and
a second semiconductor layer on the first semiconductor layer, the second semiconductor layer having the first conductivity type, having a second dopant concentration greater than the first dopant concentration, and having a major surface;

a body region of a second conductivity type in the second semiconductor layer extending from the major surface;
a trench structure in the first semiconductor layer and the second semiconductor layer extending from the major surface adjacent the body region, and wherein the trench structure comprises:
a trench;
an insulated gate electrode; and
an insulated shield electrode below the insulated gate electrode;

a source region of the first conductivity type in the body region adjacent the trench structure; and
a doped region of the second conductivity type in the second semiconductor layer adjacent a lower surface of the body region, wherein a portion of the second semiconductor layer separates the doped region from the trench structure and another portion of the second semiconductor layer separates the doped region from the first semiconductor layer.

18. The structure of claim 17 , wherein the trench structure includes a notch oriented substantially inward towards an inner portion of the trench and adjacent the lower surface of th

Assignees

• Semiconductor Components Ind

Inventors

• Deng Shengling
• Hossain Zia

Classifications

• H10D64/2527

  for vertical devices wherein the source or drain electrodes are recessed in semiconductor bodies · CPC title

• H10D62/107

  Buried supplementary regions, e.g. buried guard rings  (multi-RESURF H10D62/111) · CPC title

• H10D64/516

  the thicknesses being non-uniform · CPC title

• H10D64/513 Primary

  within recesses in the substrate, e.g. trench gates, groove gates or buried gates · CPC title

• H10D64/256

  for lateral devices wherein the source or drain electrodes are recessed in semiconductor bodies (source or drain electrodes of TFTs H10D30/673) · CPC title