Chip package

Patent metadata

Field	Value
Publication number	US-9269732-B2
Application number	US-76636210-A
Country	US
Kind code	B2
Filing date	Apr 23, 2010
Priority date	Dec 28, 2009
Publication date	Feb 23, 2016
Grant date	Feb 23, 2016

Abstract

A chip package is provided. The chip package includes a chip, having a plurality of conductive pads disposed along a periphery of the chip, wherein the conductive pads have a width. A seal ring includes a plurality of metal strips disposed within a space between the two adjacent conductive pads. Each metal strip is electrically connected to at most one of the two adjacent conductive pads.

First claim

What is claimed is:

1. A chip package, comprising:
a chip, having a plurality of conductive pads disposed along a periphery of the chip; and
a ring structure, containing the plurality of conductive pads and at least two metal strips disposed within one space between any two adjacent conductive pads, top surfaces of the at least two metal strips and top surfaces of the any two adjacent conductive pads are co-planar,
wherein at least one of the at least two metal strips, disposed between two adjacent conductive pads, extends from and directly contacts one of the two adjacent conductive pads, and is disposed apart from the other of the two adjacent conductive pads with a first gap, and
wherein the two adjacent conductive pads are not electrically connected with each other by any of the at least two metal strips.

2. The chip package as claimed in claim 1 , wherein the conductive pads have a width and the metal strips are disposed within the space between the two adjacent conductive pads and within the width, and the metal strips are parallel to each other.

3. The chip package as claimed in claim 2 , wherein the metal strips are disposed apart from each other, such that a connection channel is surrounded by the metal strips, the any two adjacent conductive pads and the first gaps, and wherein the first gaps and the connection channel are arranged to form a curved channel, and a length of the curved channel is greater than a distance between an outside metal strip and an inside metal strip of the at least two metal strips.

4. The chip device package as claimed in claim 1 , wherein the first gaps are staggered.

5. The chip package as claimed in claim 1 , wherein the conductive pad comprises a plurality of metal layers.

6. The chip package as claimed in claim 5 , further comprising a plurality of vias disposed between the metal layers of the conductive pad.

7. The chip package as claimed in claim 5 , wherein the metal strip comprises a plurality of metal layers.

8. The chip package as claimed in claim 7 , wherein the amount of the metal layers of the metal strip is the same as that of the metal layers of the conductive pad.

9. The chip package as claimed in claim 7 , further comprising at least a stress barrier disposed between the metal layers of the metal strip.

10. The chip package as claimed in claim 7 , wherein between each of the metal layers of each metal strip has a stress barrier.

11. The chip package as claimed in claim 1 , wherein the plurality of conductive pads is disposed on a front side of the chip, and the chip package further comprises:
a packaging layer bonded to the front side of the chip and located on the plurality of conductive pads;
a conductive trace layer disposed on a back side of the chip opposite to the front side of the chip, wherein the conductive trace layer extends on a sidewall of the chip, and further extends to electrically connect the plurality of conductive pads;
a passivation layer disposed over the conductive trace layer, having an opening, exposing a portion of the conductive trace layer; and
a conductive bump disposed on the opening, electrically connecting to the conductive trace layer.

12. A chip package, comprising:
a chip, having a plurality of conductive pads disposed along a periphery of the chip; and
a ring structure, containing the plurality of conductive pads and at least two metal strips disposed within one space between any two adjacent conductive pads, top surfaces of the at least two metal strips and top surfaces of the any two adjacent conductive pads are co-planar,
wherein at least one of the at least two metal strips, disposed between two adjacent conductive pads, extends from and directly contacts one of the two adjacent conductive pads, and is disposed apart from the other of the two adjacent conductive pads with a first gap, and
wherein the two adjacent conductive pads are not electrically connected with each other by any of the at least two metal strips, the metal strips are parallel to each other and disposed apart from each other, such that a connection channel is surrounded by the metal strips, the any two adjacent conductive pads and the first gaps, the first gaps and the connection channel are arranged to form a curved channel, and a length of the curved channel is greater than a distance between an outside metal strip and an inside metal strip of the at least two metal strips.

13. The chip package as claimed in claim 12 , further comprising a connection part extending from one of the conductive pads and located outside of the space between the any two adjacent conductive pads.

14. The chip package as claimed in claim 12 , wherein the ring structure comprises more than two metal strips disposed within the space and parallel to each other.

15. The chip package as claimed in claim 1 , further comprising a connection part extending from one of the conductive pads and located outside of the space between the any two adjacent conductive pads.

16. The chip package as claimed in claim 1 , wherein the ring structure comprises more than two metal strips disposed within the space and parallel to each other.

Assignees

• Tsai Chia-Lun
• Xintec Inc

Inventors

• Tsai Chia-Lun

Classifications

• H10W74/129

  forming a chip-scale package [CSP] · CPC title

• H10W72/9232

  with additional elements interposed between layers · CPC title

• H10W72/9223

  with redistribution layers [RDL] · CPC title

• H10W72/01953

  by etching · CPC title

• H10W72/01951

  Changing the shapes of bond pads · CPC title