Integrated circuit with electrostatic discharge protection
US-2024395801-A1 · Nov 28, 2024 · US
US9269703B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9269703-B2 |
| Application number | US-201414453907-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 7, 2014 |
| Priority date | Nov 3, 2010 |
| Publication date | Feb 23, 2016 |
| Grant date | Feb 23, 2016 |
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An ESD protection circuit with a diode string coupled to a diode-isolated, gate-grounded NMOS ESD device. A method of forming an ESD protection circuit with a diode string coupled to a diode-isolated, gate-grounded NMOS ESD device.
Opening claim text (preview).
What is claimed is: 1. A method of forming an integrated circuit, comprising: forming a gate-grounded NMOS ESD device; forming an isolation diode in series with and coupled to a source of the gate-grounded NMOS transistor, wherein the isolation diode is segmented and placed in close proximity to, and on opposite sides of, a body of the gate-grounded NMOS ESD device; and forming a diode string coupled to the gate-grounded NMOS ESD device in a forward biased configuration, wherein diodes of the diode string are segmented and placed on multiple sides of the body of the gate-grounded NMOS ESD device. 2. The method of claim 1 where said diode string is formed with at least 2 diodes in series. 3. The method of claim 2 where said diode string is formed with 3 diodes in series. 4. The method of claim 1 further comprising coupling said diode string between a drain and a source of said gate-grounded NMOS ESD device. 5. The method of claim 1 further comprising coupling said diode string between a source of said gate-grounded NMOS ESD device and a p+ diffusion of the isolation diode in said gate-grounded NMOS ESD device. 6. The method of claim 1 where a p+ substrate contact diffusion surrounds said gate-grounded NMOS ESD device and said diode string. 7. The method of claim 1 further comprising coupling a gate of said gate-grounded NMOS ESD device to ground through a resistor.
Combinations of field-effect devices and one or more diodes, capacitors or resistors · CPC title
Insulated-gate field-effect transistors [IGFET] (H10D30/40 takes precedence) · CPC title
involving a parasitic bipolar transistor triggered by the electrical biasing of the gate electrode of the FET, e.g. gate coupled transistors · CPC title
Manufacturing their isolation regions · CPC title
using silicon technology, e.g. SiGe · CPC title
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