Techniques and system for managing platform temperature

Patent metadata

Field	Value
Publication number	US-9268378-B2
Application number	US-201313931128-A
Country	US
Kind code	B2
Filing date	Jun 28, 2013
Priority date	Jun 28, 2013
Publication date	Feb 23, 2016
Grant date	Feb 23, 2016

Abstract

In one embodiment an apparatus includes a temperature sensor to perform a multiplicity of junction temperature measurements for a component in a platform, a controller comprising logic at least a portion of which is in hardware. The logic may receive from the temperature sensor the multiplicity of junction temperature measurements and may instruct the component to perform a first power down action of the component when a junction temperature measurement exceeds a first threshold, and may instruct the component to perform a second power down action of the component when an average junction temperature based on the multiplicity of junction temperature measurements exceeds a second threshold. Other embodiments are disclosed and claimed.

First claim

What is claimed is:

1. An apparatus, comprising:
a temperature sensor to perform a multiplicity of junction temperature measurements for a component in a platform; and
a controller comprising logic at least a portion of which is in hardware, the logic to:
receive from the temperature sensor the multiplicity of junction temperature measurements;
determine whether a one of the multiplicity of junction temperature measurements exceeds a first threshold;
determine whether an average junction temperature based on the multiplicity of junction temperature measurements exceeds a second threshold; and
instruct the component to perform a first power down action of the component based on a determination that a one of the multiplicity of junction temperature measurements exceeds the first threshold; or
instruct the component to perform a second power down action of the component based on a determination that an average junction temperature based the multiplicity of junction temperature measurements exceeds the second threshold.

2. The apparatus of claim 1 , the first threshold comprising a maximum junction temperature T J — MAX for the component, the logic to perform a rapid throttling of the component when the first threshold is exceeded, the rapid throttling comprising reducing micro-operations input rate and/or operating frequency for the component.

3. The apparatus of claim 1 , the second threshold comprising a maximum steady state junction temperature T J — STEADY STATE , the logic to perform a controlled power down of the component when the second threshold is exceeded, wherein skin temperature of the platform does not exceed about 40° C.

4. The apparatus of claim 1 the logic to determine the average junction temperature based upon a rolling average calculation for junction temperature measurements.

5. The apparatus of claim 1 , comprising:
a second temperature sensor to perform a multiplicity of second junction temperature measurements for a second component of the platform; and
the logic to receive from the second temperature sensor the multiplicity of second junction temperature measurements and to instruct the second component to perform a third power down action to the second circuit component when a one of the multiplicity of second junction temperature measurements exceeds a third threshold and to instruct the second component to perform a fourth power down action when a second average junction temperature based on the multiplicity of second junction temperature measurements exceeds a fourth threshold.

6. The apparatus of claim 1 , the component comprising a general purpose processor (CPU), a graphics processor unit (GPU), a memory device, and/or a chipset.

7. At least one non-transitory computer-readable storage medium comprising instructions that, when executed, cause a controller to:
receive from a temperature sensor a multiplicity of junction temperature measurements;
determine whether a one of the multiplicity of junction temperature measurements exceeds a first threshold;
determine whether an average junction temperature based on the multiplicity of junction temperature measurements exceeds a second threshold; and
instruct a component to perform a first power down action of the component based on a determination that a one of the multiplicity of junction temperature measurements exceeds the first threshold; or
instruct the component to perform a second power down action of the component based on a determination that an average junction temperature based on the multiplicity of junction temperature measurements exceeds the second threshold.

8. The at least one computer-readable storage medium of claim 7 comprising instructions that, when executed, cause a controller to perform a rapid throttling of the component when a maximum junction temperature T J — MAX is exceeded, the rapid throttling action comprising reducing micro-operations input rate and/or operating frequency for the component.

9. The at least one computer-readable storage medium of claim 7 comprising instructions that, when executed, cause a controller to perform a controlled power down of the component when a maximum steady state junction temperature T J — STEADY STATE is exceeded.

10. The at least one computer-readable storage medium of claim 7 comprising instructions that, when executed, cause a controller to determine the average junction temperature based upon a rolling average calculation for junction temperature measurements.

11. The at least one computer-readable storage medium of claim 7 comprising instructions that, when executed, cause a controller to:
receive from a second temperature sensor a multiplicity of second junction temperature measurements for a second component;
instruct the second component to perform a third power down action to the second circuit component when a one of the multiplicity of second junction temperature measurements exceeds a third threshold; and
instruct the second component to perform a fourth power down when a second average junction temperature based on the multiplicity of second junction temperature measurements exceeds a fourth threshold.

12. An apparatus, comprising:
a temperature sensor to perform a multiplicity of junction temperature measurements for a component in a platform; and
a processor comprising logic at least a portion of which is in hardware, the logic to:
receive from the temperature sensor the multiplicity of junction temperature measurements;
determine whether a one of the multiplicity of junction temperature measurements exceeds a first threshold;
determine whether an average junction temperature based on the multiplicity of junction temperature measurements exceeds a second threshold; and
instruct the component to perform a first power down action of the component based on a determination that a one of the multiplicity of junction temperature measurements exceeds the first threshold; or
instruct the component to perform a second power down action of the component based on a determination that an average junction temperature based the multiplicity of junction temperature measurements exceeds the second threshold.

13. The apparatus of claim 12 , the first threshold comprising a maximum junction temperature T J — MAX for the component, the logic to perform a rapid throttling of the component when the first threshold is exceeded, the rapid throttling comprising reducing micro-operations input rate and/or operating frequency for the component.

14. The apparatus of claim 12 , the second threshold comprising a maximum steady state junction temperature T J — STEADY STATE , the logic to perform a controlled power down of the component when the second threshold is exceeded, wherein skin temperature of the platform does not exceed about 40° C.

15. The apparatus of claim 12 the logic to determine the average junction temperature based upon a rolling average calculation for junction temperature measurements.

16. The apparatus of claim 12 , comprising:
a second temperature sensor to perform a multiplicity of second junction temperature measurements for a second component of the platform; and
the logic to receive from the second temperature sensor the multiplicity of second junction temperature measurements and to instruct the second component to perform a third power down action to the second circuit component when a one of the multiplicity of second junction temperature measurements exceeds a third threshold and to instruct the second component to perform a fourth power down when a second averag

Assignees

• Intel Corp

Inventors

• Rotem Efraim
• Naveh Alon
• Rajwan Doron
• Shulman Nadav
• Weissmann Eliezer

Classifications

• G06F1/206 Primary

  comprising thermal management · CPC title

• G06F1/3206

  Monitoring of events, devices or parameters that trigger a change in power modality · CPC title

• G06F1/3287

  by switching off individual functional units in the computer system · CPC title

• G06F1/3215

  Monitoring of peripheral devices · CPC title

• G06F1/3243

  Power saving in microcontroller unit · CPC title