Curable silicone composition, cured product thereof, and optical semiconductor device
US-11879060-B2 · Jan 23, 2024 · US
UV-curable adhesive silicone composition, UV-curable adhesive silicone composition sheet, optical semiconductor apparatus and method for manufacturing the same
US9268227B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9268227-B2 |
| Application number | US-201514728441-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 2, 2015 |
| Priority date | Jan 18, 2012 |
| Publication date | Feb 23, 2016 |
| Grant date | Feb 23, 2016 |
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Abstract
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A method of manufacturing an optical semiconductor apparatus includes: cutting a UV-curable adhesive silicone composition sheet into small chips; disposing the resulted chip on a surface of an optical semiconductor device; irradiating UV-rays to the chip via a photomask according to lithography; developing an uncured portion of the chip with a solvent; and heat-curing after that. The UV-curable adhesive silicone composition sheet is obtained by forming a UV-curable adhesive silicone composition into sheet-form, the UV-curable adhesive silicone composition including: (A) an organopolysiloxane having a resin structure of R 1 SiO 3/2 , R 2 2 SiO 2/2 , and R 3 a R 4 b SiO (4-a-b)/2 units, (B) an organohydrogenpolysiloxane having a resin structure of R 1 SiO 3/2 , R 2 2 SiO 2/2 , and R 3 c H d SiO (4-c-d)/2 units, and (C) a photoactive catalyst. The UV-curable adhesive silicone composition is in a plastic solid state or a semi-solid state in an uncured state at room temperature.
First claim
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What is claimed is: 1. A method of manufacturing an optical semiconductor apparatus, comprising the steps of: cutting a UV-curable adhesive silicone composition sheet into small chips; disposing the resulted UV-curable adhesive silicone composition sheet chip on a surface of an optical semiconductor device; irradiating UV-rays to the UV-curable adhesive silicone composition sheet chip via a photomask according to lithography; developing an uncured portion of the UV-curable a…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Physics · mapped topic
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- What does patent US9268227B2 cover?
- A method of manufacturing an optical semiconductor apparatus includes: cutting a UV-curable adhesive silicone composition sheet into small chips; disposing the resulted chip on a surface of an optical semiconductor device; irradiating UV-rays to the chip via a photomask according to lithography; developing an uncured portion of the chip with a solvent; and heat-curing after that. The UV-curable…
- Who is the assignee on this patent?
- Shinetsu Chemical Co
- What technology area does this patent fall under?
- Primary CPC classification C08G77/70. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Feb 23 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).