Liquid crystal display and manufacturing method thereof

US9268164B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9268164-B2
Application numberUS-201414209263-A
CountryUS
Kind codeB2
Filing dateMar 13, 2014
Priority dateMar 13, 2013
Publication dateFeb 23, 2016
Grant dateFeb 23, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A manufacturing method of a liquid crystal display includes: providing a pixel electrode on an insulation substrate; providing a sacrificial layer on the pixel electrode; providing a common electrode on the sacrificial layer; providing a photoresist layer on the common electrode; exposing a portion of the photoresist layer, common electrode and the sacrificial layer with light; developing the portion of the photoresist layer exposed with the light; etching a layer between the photoresist layer and the sacrificial layer using the developed photoresist layer as a mask to expose the portion of the sacrificial layer exposed with the light; removing the portion of the sacrificial layer exposed with the light; providing a roof layer on the insulation substrate and etching the roof layer to form a liquid crystal injection hole therein; and removing the sacrificial layer exposed through the liquid crystal injection hole to form a microcavity.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a liquid crystal display, the method comprising: providing a pixel electrode on an insulation substrate; providing a sacrificial layer on the pixel electrode; providing a common electrode on the sacrificial layer; providing a photoresist layer on the common electrode; exposing a portion of the photoresist layer, common electrode and the sacrificial layer with light; developing the portion of the photoresist layer exposed with the light; etching a layer between the photoresist layer and the sacrificial layer using the developed photoresist layer as a mask to expose the portion of the sacrificial layer exposed with the light; removing the portion of the sacrificial layer exposed with the light; providing a roof layer on the insulation substrate and etching the roof layer to form a liquid crystal injection hole therein which exposes the sacrificial layer; and removing the sacrificial layer exposed through the liquid crystal injection hole to form a microcavity. 2. The method of claim 1 , further comprising: providing a lower insulating layer between the common electrode and the photoresist layer, wherein the sacrificial layer, the common electrode and the photoresist layer cover the pixel electrode on the insulation substrate. 3. The method of claim 2 , wherein the portion of the sacrificial layer exposed with the light corresponds to the liquid crystal injection hole and a column portion of the roof layer. 4. The method of claim 2 , wherein the etching the layer between the photoresist layer and the sacrificial layer using the developed photoresist layer as a mask comprises: etching the lower insulating layer using the developed photoresist layer as a mask; removing the photoresist layer; and etching the common electrode using the etched lower insulating layer as a mask to expose the portion of the sacrificial layer exposed with the light. 5. The method of claim 4 , further comprising: providing an additional lower insulating layer on the insulation substrate, before the providing the roof layer on the insulation substrate and the etching the roof layer to form the liquid crystal injection hole therein, and after removing the portion of the sacrificial layer exposed with the light. 6. The method of claim 4 , wherein the providing the roof layer on the insulation substrate and the etching the roof layer to form the liquid crystal injection hole therein comprises: the providing the roof layer on the insulation substrate; exposing a portion of the provided roof layer corresponding to the removed portion of the sacrificial layer with light; developing the portion of the roof layer exposed with the light; providing an upper insulating layer on the insulation substrate to cover the developed roof layer; and removing a portion of the upper insulating layer corresponding to the removed portion of the sacrificial layer to form the liquid crystal injection hole. 7. The method of claim 1 , wherein the etching the layer between the photoresist layer and the sacrificial layer using the developed photoresist layer as a mask comprises: etching the common electrode using the developed photoresist layer as a mask to expose the portion of the sacrificial layer exposed with the light; and removing the photoresist layer. 8. The method of claim 7 , wherein the removing the photoresist layer comprises using an ashing process, and the exposed portion of the sacrificial layer is partially removed by the ashing process. 9. The method of claim 8 , wherein the removed portion of the sacrificial layer by the ashing process is positioned under the common electrode. 10. The method of claim 7 , further comprising: providing an additional lower insulating layer on the insulation substrate, before the providing the roof layer on the insulation substrate and the etching the roof layer to form the liquid crystal injection hole therein, and after the removing the portion of the sacrificial layer exposed with the light. 11. The method of claim 7 , wherein the providing the roof layer on the insulation substrate and the etching the roof layer to form the liquid crystal injection hole therein comprises: the providing the roof layer on the insulation substrate; exposing a portion of the provided roof layer corresponding to the removed portion of the sacrificial layer with light; developing the portion of the roof layer exposed with the light; providing an upper insulating layer on the insulation substrate to cover the developed roof layer; and removing a portion of the upper insulating layer corresponding to the removed portion of the sacrificial layer to form the liquid crystal injection hole. 12. The method of claim 7 , wherein the exposed portion of the sacrificial layer corresponds to the liquid crystal injection hole and a column portion of the roof layer.

Assignees

Inventors

Classifications

  • Cells with plural compartments or having plurality of liquid crystal microcells partitioned by walls, e.g. one microcell per pixel · CPC title

  • Electrodes {(reflective electrodes G02F1/133553)} · CPC title

  • G02F1/1341Primary

    Filling or closing of cells · CPC title

  • Insulating layers (G02F1/1335, G02F1/1337, G02F1/135, G02F1/136 take precedence) · CPC title

  • characterised by their geometrical arrangement · CPC title

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What does patent US9268164B2 cover?
A manufacturing method of a liquid crystal display includes: providing a pixel electrode on an insulation substrate; providing a sacrificial layer on the pixel electrode; providing a common electrode on the sacrificial layer; providing a photoresist layer on the common electrode; exposing a portion of the photoresist layer, common electrode and the sacrificial layer with light; developing the p…
Who is the assignee on this patent?
Samsung Display Co Ltd
What technology area does this patent fall under?
Primary CPC classification G02F1/133377. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 23 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).