Methods and apparatus for applying adhesives in patterns to an advancing substrate

US9265672B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9265672-B2
Application numberUS-201213685817-A
CountryUS
Kind codeB2
Filing dateNov 27, 2012
Priority dateNov 27, 2012
Publication dateFeb 23, 2016
Grant dateFeb 23, 2016

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Aspects of the methods and apparatuses herein involve applying fluids onto an advancing substrate. The apparatuses and methods herein may provide for the application of viscous fluids, such as adhesives, in pre-determined patterns to an advancing substrate. The fluid application apparatus may include a slot die applicator and a substrate carrier. The slot die applicator may include a slot opening, a first lip, and a second lip, the slot opening located between the first lip and the second lip. And the substrate carrier may be adapted to advance the substrate past the slot die applicator as the slot die applicator discharges adhesive onto the substrate. In operation, when a first surface of the substrate is disposed on the substrate carrier, the substrate carrier advances a second surface of the substrate past the slot opening of the slot die applicator.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for applying a fluid discharged from a slot die applicator to a substrate in a pattern, the slot die applicator including a slot opening, a first lip, and a second lip, the slot opening located between the first lip and the second lip; and the substrate having a first surface disposed opposite of a second surface and an unconstrained caliper, Hs, the method comprising the steps of: continuously advancing the substrate in a machine direction; engaging the substrate with a substrate carrier, the substrate carrier comprising: a non-compliant support surface and a pattern element, the pattern element including a pattern surface, wherein pattern element extends away from the non-compliant support surface to define a first minimum distance, R 1 , between the pattern surface and the non-compliant support surface; positioning the substrate carrier adjacent the slot die applicator to define a minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip that is less than the unconstrained caliper, Hs, of the substrate; advancing the second surface of the substrate past the slot die applicator while the first surface of the substrate is disposed on the substrate carrier; intermittently deflecting the pattern surface toward the non-compliant support surface such to define a second minimum distance, R 2 , between the pattern surface and the non-compliant surface, wherein R 2 is less than R 1 , by advancing the substrate and the pattern element past the first lip, the slot opening, and the second lip of the slot die applicator while the first surface of the substrate is disposed on the substrate carrier; and discharging fluid from the slot opening of the slot die applicator onto the second surface of the substrate. 2. The method of claim 1 , wherein the substrate carrier comprises a roller. 3. The method of claim 1 , wherein the substrate carrier comprises an endless belt. 4. The method of claim 1 , wherein the substrate carrier further comprises a compliant base surface, wherein the pattern element protrudes from the compliant base surface to define a distance, Hp, between the pattern surface and the compliant base surface. 5. The method of claim 4 , wherein the substrate carrier is positioned adjacent the slot die applicator to define a minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip that is less than the unconstrained caliper, Hs, of the substrate; and wherein a sum of the distance, Hp, and distance, Hg, is greater than the unconstrained caliper, Hs, of the substrate. 6. The method of claim 1 , wherein the fluid comprises an adhesive. 7. The method of claim 1 , wherein the fluid is a different color than the substrate.

Assignees

Inventors

Classifications

  • having elastic ribbons fixed thereto; Devices for applying the ribbons · CPC title

  • Coating heads with slot-shaped outlet (B05C5/0283 takes precedence) · CPC title

  • Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves · CPC title

  • Details thereof, e.g. surface characteristics · CPC title

  • B05C13/00Primary

    Means for manipulating or holding work, e.g. for separate articles {(B05C1/0821 takes precedence)} · CPC title

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Frequently asked questions

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What does patent US9265672B2 cover?
Aspects of the methods and apparatuses herein involve applying fluids onto an advancing substrate. The apparatuses and methods herein may provide for the application of viscous fluids, such as adhesives, in pre-determined patterns to an advancing substrate. The fluid application apparatus may include a slot die applicator and a substrate carrier. The slot die applicator may include a slot openi…
Who is the assignee on this patent?
Procter & Gamble
What technology area does this patent fall under?
Primary CPC classification B05C13/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 23 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).