Opto-electric hybrid board and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-9265141-B2
Application number	US-201213406674-A
Country	US
Kind code	B2
Filing date	Feb 28, 2012
Priority date	Mar 16, 2011
Publication date	Feb 16, 2016
Grant date	Feb 16, 2016

Abstract

Provided are an opto-electric hybrid board which eliminates the necessity of an aligning operation of a core of an optical waveguide unit and an optical element of an electric circuit unit and which is excellent in mass-productivity, and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes fitting holes which are formed in a surface of an overcladding layer and are located and formed at predetermined locations with respect to one end surface of a core. The electric circuit unit includes protruding portions which fit into the fitting holes and are located and formed at predetermined locations with respect to the optical element.

First claim

What is claimed is:

1. An opto-electric hybrid board, comprising:
an optical waveguide unit; and
an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit,
wherein the optical waveguide unit comprises:
an undercladding layer;
a core for an optical path, the core being formed on a surface of the undercladding layer;
an overcladding layer which covers the core; and
a fitting hole for locating the electric circuit unit, the fitting hole being formed in a surface of the overcladding layer;

wherein the electric circuit unit comprises:
an electric circuit board;
the optical element mounted at a predetermined portion on the electric circuit board; and
a protruding portion which fits into the fitting hole;

wherein the fitting hole of the optical waveguide unit is located and formed at a predetermined location with respect to an end surface of the core;
wherein the protruding portion of the electric circuit unit is located and formed at a predetermined location with respect to the optical element;
wherein the optical waveguide unit and the electric circuit unit are coupled to each other in a state in which the protruding portion of the electric circuit unit fits into the fitting hole of the optical waveguide unit; and
wherein shapes of the fitting hole and the protruding portion are non-complementary.

2. The opto-electric hybrid board according to claim 1 , wherein a depressed portion into which an end of the optical waveguide unit fits is formed in the electric circuit unit, and the protruding portion is formed in the depressed portion.

3. A manufacturing method for an opto-electric hybrid board in which an optical waveguide unit and an electric circuit unit having an optical element mounted thereon are coupled, the method comprising:
manufacturing the optical waveguide unit comprising:
forming an undercladding layer;
forming, on a surface of the undercladding layer, a core for an optical path; and
forming an overcladding layer so as to cover the core, the forming of the overcladding layer comprising forming a fitting hole for locating the electric circuit unit at a predetermined location located with respect to an end surface of the core;

manufacturing the electric circuit unit comprising:
forming an electric circuit board; and
mounting the optical element at a predetermined portion on the electric circuit board, the forming of the electric circuit board comprising forming a protruding portion which fits into the fitting hole at a predetermined location located with respect to an expected mounting location of the optical element; and

coupling the optical waveguide unit and the electric circuit unit, the coupling comprising fitting the protruding portion of the electric circuit unit into the fitting hole of the optical waveguide unit
wherein the optical waveguide unit and the electric circuit unit are separately manufactured and then coupled.

4. The manufacturing method for an opto-electric hybrid board according to claim 3 , further comprising forming a depressed portion into which an end of the optical waveguide unit fits in the electric circuit unit, and forming the protruding portion in the depressed portion.

5. The opto-electric hybrid board according to claim 1 ,
wherein the fitting hole has a shape of a cylinder, and
wherein the protruding portion has a shape of a frustum of a cone.

6. The manufacturing method for an opto-electric hybrid board according to claim 3 ,
wherein the fitting hole is formed by photolithography, and
wherein the protruding portion is formed by etching.

7. The manufacturing method for an opto-electric hybrid board according to claim 6 ,
wherein the fitting hole has a shape of a cylinder, and
wherein the protruding portion has a shape of a frustum of a cone.

Assignees

• Inoue Masami
• Hodono Masayuki
• Nagafuji Akiko
• Tsujita Yuichi
• Honjo Mitsuru
• Nitto Denko Corp

Inventors

• Inoue Masami
• Hodono Masayuki
• Nagafuji Akiko
• Tsujita Yuichi
• Honjo Mitsuru

Classifications

• Y10T29/4913

  Assembling to base an electrical component, e.g., capacitor, etc. · CPC title

• G02B6/424

  Mounting of the optical light guide · CPC title

• H05K2201/09072

  Hole or recess under component or special relationship between hole and component · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K2201/10121

  Optical component, e.g. opto-electronic component · CPC title