Optical sensor apparatus

Patent metadata

Field	Value
Publication number	US-9264645-B2
Application number	US-201414448311-A
Country	US
Kind code	B2
Filing date	Jul 31, 2014
Priority date	Aug 2, 2013
Publication date	Feb 16, 2016
Grant date	Feb 16, 2016

Abstract

An optical sensor apparatus includes a package having a window; a sensor chip having an array of light receiving devices and a pixel electrode connected to each light receiving device, the sensor chip having an incidence surface that faces the window of the package; and a read-out circuit disposed under the sensor chip, the read-out circuit having a read-out electrode electrically connected to each pixel electrode of the sensor chip. The sensor chip and the read-out circuit are housed in the package. In plan view from the sensor chip, the read-out circuit is overlapped by the sensor chip, and the read-out circuit has no portion extending off the sensor chip.

First claim

What is claimed is:

1. An optical sensor apparatus comprising:
a package having a window;
a sensor chip having an array of light receiving devices and a pixel electrode connected to each light receiving device, the sensor chip having an incidence surface that faces the window of the package; and
a read-out circuit disposed under the sensor chip, the read-out circuit having a read-out electrode electrically connected to each pixel electrode of the sensor chip,
wherein the sensor chip and the read-out circuit are housed in the package, and
wherein, in plan view from the sensor chip;
the read-out circuit is overlapped by the sensor chip, and
the read-out circuit has no portion extending off the sensor chip.

2. The optical sensor apparatus according to claim 1 , wherein each pixel electrode of the sensor chip and each read-out electrode of the read-out circuit are electrically connected by flip-chip connection to each other through a bump.

3. The optical sensor apparatus according to claim 2 , further comprising an underfill resin filled in a space between the bumps interposed between the pixel electrodes of the sensor chip and the read-out electrodes of the read-out circuit,
wherein the underfill resin has an outer periphery extending outward from the read-out circuit to the sensor chip in a skirt-like manner.

4. The optical sensor apparatus according to claim 1 , further comprising a relay board under the read-out circuit, the relay board having an interconnection electrode, wherein
the read-out circuit has an external connection terminal on a surface thereof and a via hole directly below the external connection terminal,
the external connection terminal is connected to one of the read-out electrodes of the read-out circuit,
the via hole is filled with a conductive material,
the relay board has, in plan view from the sensor chip, a region overlapped by the read-out circuit and a region extending off the sensor chip,
the interconnection electrode extends from the region overlapped by the read-out circuit to the region extending off the sensor chip; and
the external connection terminal and the interconnection electrode are electrically connected through the conductive material in the via hole of the read-out circuit.

5. The optical sensor apparatus according to claim 4 , wherein the package includes a package main body having a connection pin, and
the interconnection electrode of the relay board is electrically connected to the connection pin of the package main body.

6. The optical sensor apparatus according to claim 1 , wherein
the read-out circuit has an external connection terminal on a surface thereof,
the external connection terminal is connected to one of the read-out electrodes of the read-out circuit,
the sensor chip has a through-hole filled with a conductive material, and a pad electrode on the incidence surface opposite to a surface on which one of the pixel electrodes is formed, and
the external connection terminal and the pad electrode are electrically connected through the conductive material filled in the through-hole.

7. The optical sensor apparatus according to claim 6 , further comprising a relay board under the read-out circuit, the relay board having an interconnection electrode in a region extending off the sensor chip in plan view from the sensor chip,
wherein the interconnection electrode of the relay board is electrically connected to the pad electrode through a wire.

8. The optical sensor apparatus according to claim 6 , wherein the package includes a package main body having a connection pin, and
the pad electrode on the incidence surface of the sensor chip is electrically connected to the connection pin of the package main body through a wire.

9. The optical sensor apparatus according to claim 1 , wherein
the read-out circuit has an external connection terminal on a surface thereof,
the external connection terminal is connected to one of the read-out electrodes of the read-out circuit,
the sensor chip has a wiring pattern and a pad electrode on the incidence surface opposite to a surface on which one of the pixel electrodes is formed,
the wiring pattern is formed along an outer periphery of the sensor chip on the incidence surface, a side surface, and the surface on which said one of the pixel electrodes is formed, and
the external connection terminal and the pad electrode are electrically connected through the wiring pattern.

10. The optical sensor apparatus according to claim 9 , further comprising a relay board under the read-out circuit, the relay board having an interconnection electrode in a region extending off the sensor chip in plan view from the sensor chip,
wherein the interconnection electrode of the relay board is electrically connected to the pad electrode through a wire.

Assignees

• Sumitomo Electric Industries
• Sumitomo Electric Industries

Inventors

• Inada Hiroshi
• Migita Masaki
• Iguchi Yasuhiro

Classifications

• H10W90/722

  between stacked chips · CPC title

• H10W72/879

  Bump connectors and bond wires · CPC title

• H04N23/57 Primary

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N25/63

  applied to dark current · CPC title

• H04N25/78

  Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters · CPC title