Method of forming a ring-shaped metal structure

Patent metadata

Field	Value
Publication number	US-9263362-B2
Application number	US-201213406062-A
Country	US
Kind code	B2
Filing date	Feb 27, 2012
Priority date	Aug 13, 2009
Publication date	Feb 16, 2016
Grant date	Feb 16, 2016

Abstract

A method includes providing a first semiconductor chip comprising a ring-shaped metal structure extending along a contour of a first main surface of the semiconductor chip. The method includes encapsulating the first semiconductor chip with an encapsulation body thereby defining a second main surface and depositing a metal layer over the first semiconductor chip and the encapsulation body. A plurality of external contact pads are placed over the second main surface of the encapsulation body, the metal layer electrically coupling at least one external contact pad of the plurality of external contact pads to the ring-shaped metal structure. A seal ring is placed between the ring-shaped metal structure and the contour of the first main surface of the first semiconductor chip.

First claim

What is claimed is:

1. A method comprising:
providing a first semiconductor chip and a second semiconductor chip, the first semiconductor chip comprising a ring-shaped metal structure extending along a contour of a first main surface of the first semiconductor chip and surrounding a plurality of main surface contact pads;
covering the first and second semiconductor chips with an encapsulation material;
depositing a metal layer over the first semiconductor chip and the encapsulation material;
placing a plurality of external contact pads over the encapsulation material, the metal layer electrically coupling at least one external contact pad of the plurality of external contact pads to the ring-shaped metal structure of the first semiconductor chip and to the plurality of main surface contact pads; and
separating the first semiconductor chip from the second semiconductor chip by removing the encapsulation material partially;
the method further comprising enclosing the ring-shaped metal structure with a seal ring located between the ring-shaped metal structure and a side surface of the first semiconductor chip such that the seal ring encloses the ring-shaped metal structure, the seal ring located between a scribing line and the semiconductor chips and configured to protect the semiconductor chips from damage when the first and second semiconductor chips are separated.

2. The method of claim 1 , wherein the first and second semiconductor chips are placed over a carrier before covering the first and second semiconductor chips with the encapsulation material, and the first and second semiconductor chips are removed from the carrier after covering the first and second semiconductor chips with the encapsulation material.

3. The method of claim 2 , wherein the first semiconductor chip is placed over the carrier with the first main surface of the first semiconductor chip facing the carrier.

4. The method of claim 1 , wherein the first main surface is the active main surface of the first semiconductor chip.

5. The method of claim 1 , wherein the second semiconductor chip comprises a ring-shaped metal structure extending along the contour of a first main surface of the second semiconductor chip.

6. The method of claim 1 , wherein the first semiconductor chip comprises a MMIC.

7. The method of claim 1 , wherein the ring-shaped metal structure extends along more than 90% of the contour of the first main surface of the first semiconductor chip.

8. The method of claim 1 , wherein the distance between the ring-shaped metal structure and an adjacent edge of the first semiconductor chip is less than 150 μm.

9. The method of claim 1 , wherein lateral width of the ring-shaped metal structure is less than 100 μm.

Assignees

• Lachner Rudolf
• Boeck Josef
• Aufinger Klaus
• Knapp Herbert
• Infineon Technologies Ag

Inventors

• Lachner Rudolf
• Boeck Josef
• Aufinger Klaus
• Knapp Herbert

Classifications

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W74/117

  the substrate having spherical bumps for external connection · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W72/9413

  on encapsulations · CPC title