Diarylamine novolac resin

US9263286B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9263286-B2
Application numberUS-201214348461-A
CountryUS
Kind codeB2
Filing dateSep 25, 2012
Priority dateSep 29, 2011
Publication dateFeb 16, 2016
Grant dateFeb 16, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A novel diarylamine novolac resin such as a phenylnaphthylamine novolac resin, and further a resist underlayer film-forming composition in which the resin is used in a lithography process for manufacturing a semiconductor device. A polymer including a unit structure (A) of Formula (1): (in Formula (1), each of Ar 1 and Ar 2 is a benzene ring or a naphthalene ring). A method for manufacturing a semiconductor device, including: forming an underlayer film on a semiconductor substrate with the resist underlayer film-forming composition; forming a hardmask on the underlayer film; forming a resist film on the hardmask; forming a resist pattern by irradiation with light or an electron beam followed by development; etching the hardmask with the resist pattern; etching the underlayer film with the hardmask thus patterned; and processing the semiconductor substrate with the underlayer film thus patterned.

First claim

Opening claim text (preview).

The invention claimed is: 1. A polymer comprising: a unit structure (A) of Formula (1): where: each of Ar 1 and Ar 2 is a benzene ring or a naphthalene ring, each of R 1 and R 2 is a substituent of a hydrogen atom on the benzene ring or the naphthalene ring and is selected from the group consisting of a halogen group, a nitro group, an amino group, a hydroxy group, a C 1-10 alkyl group, a C 2-10 alkenyl group, a C 6-40 aryl group, and a combination of the halogen group, the nitro group, the amino group, the hydroxy group, the alkyl group, the alkenyl group, and the aryl group, in which each of the alkyl group, the alkenyl group, and the aryl group is an organic group that optionally contains an ether bond, a ketone bond, or an ester bond; R 3 is selected from the group consisting of a hydrogen atom, a C 1-10 alkyl group, a C 2-10 alkenyl group, a C 6-40 aryl group, and a combination of the hydrogen atom, the alkyl group, the alkenyl group, and the aryl group, in which each of the alkyl group, the alkenyl group, and the aryl group is an organic group that optionally contains an ether bond, a ketone bond, or an ester bond; R 4 is selected from the group consisting of a C 6-40 aryl group and a heterocyclic group, in which each of the aryl group and the heterocyclic group is an organic group that is optionally substituted with a halogen group, a nitro group, an amino group, a C 1-10 alkyl group, a C 1-10 alkoxy group, a C 6-40 aryl group, a formyl group, a carboxy group, or a hydroxy group; R 5 is selected from the group consisting of a hydrogen atom, a C 1-10 alkyl group, a C 6-40 aryl group, and a heterocyclic group, in which each of the alkyl group, the aryl group, and the heterocyclic group is an organic group that is optionally substituted with a halogen group, a nitro group, an amino group, or a hydroxy group; R 4 and R 5 together with a carbon atom to which R 4 and R 5 are bound optionally form a ring; and each of n 1 and n 2 is independently an integer of 0 to 3; wherein the unit structure (A) includes a unit structure (a1) where either Ar 1 or Ar 2 is a benzene ring, and the other is a naphthalene ring. 2. The polymer according to claim 1 , wherein R 5 in Formula (1) is a hydrogen atom, and R 4 in Formula (1) is an optionally substituted phenyl group, an optionally substituted naphthyl group, an optionally substituted anthryl group, or an optionally substituted pyrenyl group. 3. The polymer according to claim 1 , wherein R 3 in Formula (1) is a hydrogen atom or a phenyl group. 4. The polymer according to claim 1 , wherein the unit structure (A) includes a unit structure (a2) where both Ar 1 and Ar 2 are benzene rings. 5. The polymer according to claim 1 , wherein the polymer is a copolymer, comprising: the first unit structure (a1) that has the formula of unit structure (A) where one of Ar 1 or Ar 2 is a benzene ring and the other one of Ar 1 or Ar 2 is a naphthalene ring; and a second unit structure (a2) that has the formula of unit structure (A) where each of Ar 1 and Ar 2 is a benzene ring. 6. The polymer according to claim 1 , wherein the polymer is a copolymer, comprising: the unit structure (A) of Formula (1); and a unit structure (B) of Formula (2): where: R 6 is selected from the group consisting of a C 6-40 aryl group and a heterocyclic group, in which each of the aryl group and the heterocyclic group is an organic group that is optionally substituted with a halogen group, a nitro group, an amino group, a C 1-10 alkyl group, a C 1-10 alkoxy group, a C 6-40 aryl group, a formyl group, a carboxy group, or a hydroxy group; R 7 is selected from the group consisting of a hydrogen atom, a C 1-10 alkyl group, a C 6-40 aryl group, and a heterocyclic group, in which each of the alkyl group, the aryl group, and the heterocyclic group is an organic group that is optionally substituted with a halogen group, a nitro group, an amino group, or a hydroxy group; and R 6 and R 7 together with a carbon atom to which R 6 and R 7 are bound optionally form a ring. 7. The polymer according to claim 1 , wherein the polymer is a copolymer, comprising: the first unit structure (a1) that has the formula of unit structure (A) where one of Ar 1 or Ar 2 is a benzene ring and the other one of Ar 1 or Ar 2 is a naphthalene ring; and a unit structure (B) of Formula (2): wherein: R 6 is selected from the group consisting of a C 6-40 aryl group and a heterocyclic group, in which each of the aryl group and the heterocyclic group is an organic group that is optionally substituted with a halogen group, a nitro group, an amino group, a C 1-10 alkyl group, a C 1-10 alkoxy group, a C 6-40 aryl group, a formyl group, a carboxy group, or a hydroxy group; R 7 is selected from the group consisting of a hydrogen atom, a C 1-10 alkyl group, a C 6-40 aryl group, and a heterocyclic group, in which each of the alkyl group, the aryl group, and the heterocyclic group is an organic group that is optionally substituted with a halogen group, a nitro group, an amino group, or a hydroxy group; and R 6 and R 7 together with a carbon atom to which R 6 and R 7 are bound optionally form a ring. 8. A resist underlayer film-forming composition for lithography, comprising: the polymer as claimed in claim 1 . 9. The resist underlayer film-forming composition according to claim 8 , further comprising: a cross-linker. 10. The resist underlayer film-forming composition according to claim 8 , further comprising: an acid and/or an acid generator. 11. A resist underlayer film obtained by: applying the resist underlayer film-forming composition as claimed in claim 8 onto a semiconductor substrate; and baking the applied resist underlayer film-forming composition. 12. A method for manufacturing a semiconductor device, the method comprising: forming an underlayer film on a semiconductor substrate with the resist underlayer film-forming composition as claimed in claim 8 ; forming a resist film on the underlayer film; forming a resist pattern by irradiation with light or an electron beam followed by development; etching the underlayer film with the resist pattern; and processing the semiconductor substrate with the patterned underlayer film. 13. A method for manufacturing a semiconductor device, the method comprising: forming an underlayer film on a semiconductor substrate with the resist underlayer film-forming composition as claimed in claim 8 ; forming a hardmask on the underlayer film; forming a resist film on the hardmask; forming a resist pattern by irradiation with light or an electron beam followed by development; etching the hardmask with the resist pattern; etching the underlayer film with the hardmask thus patterned; and processing the semiconductor substrate with the underlayer film thus patterned.

Assignees

Inventors

Classifications

  • H10P50/692Primary

    characterised by their composition, e.g. multilayer masks or materials · CPC title

  • Polyamines containing heterocyclic moieties in the main chain · CPC title

  • with only one nitrogen atom in the ring · CPC title

  • of aldehydes with acyclic or carbocyclic compounds · CPC title

  • Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors · CPC title

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What does patent US9263286B2 cover?
A novel diarylamine novolac resin such as a phenylnaphthylamine novolac resin, and further a resist underlayer film-forming composition in which the resin is used in a lithography process for manufacturing a semiconductor device. A polymer including a unit structure (A) of Formula (1): (in Formula (1), each of Ar 1 and Ar 2 is a benzene ring or a naphthalene ring). …
Who is the assignee on this patent?
Nissan Chemical Ind Ltd
What technology area does this patent fall under?
Primary CPC classification H10P50/692. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 16 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).