Method for selective growth of highly doped group IV—Sn semiconductor materials

US9263263B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9263263-B2
Application numberUS-201313944592-A
CountryUS
Kind codeB2
Filing dateJul 17, 2013
Priority dateJul 17, 2012
Publication dateFeb 16, 2016
Grant dateFeb 16, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Disclosed are methods for selective deposition of doped Group IV-Sn materials. In some embodiments, the method includes providing a patterned substrate comprising at least a first region and a second region, where the first region includes an exposed first semiconductor material and the second region includes an exposed insulator material, and performing at least two cycles of a grow-etch cyclic process. Each cycle includes depositing a doped Group IV-Tin (Sn) layer, where depositing the doped Group IV-Sn layer includes providing a Group IV precursor, a Sn precursor, and a dopant precursor, and using an etch gas to etch back the deposited doped Group IV-Sn layer.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method comprising: providing a patterned substrate comprising at least a first region and a second region, wherein the first region comprises an exposed first semiconductor material and the second region comprises an exposed insulator material; and performing at least two cycles of a grow-etch cyclic process, wherein each cycle comprises: (i) depositing a doped Group IV-Tin (Sn) layer, wherein a Sn concentration throughout the doped Group IV-Sn la…

Assignees

Inventors

Classifications

Patent family

Related publications grouped by family.

External sources

Next steps

Free tools are coming soon. Tell us what you want to track and we'll notify you.

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9263263B2 cover?
Disclosed are methods for selective deposition of doped Group IV-Sn materials. In some embodiments, the method includes providing a patterned substrate comprising at least a first region and a second region, where the first region includes an exposed first semiconductor material and the second region includes an exposed insulator material, and performing at least two cycles of a grow-etch cycli…
Who is the assignee on this patent?
Imec
What technology area does this patent fall under?
Primary CPC classification H10P14/2907. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 16 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).