Method for fabricating three-dimensional semiconductor device using buried stop layer in substrate
US-2024268119-A1 · Aug 8, 2024 · US
US9263231B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9263231-B2 |
| Application number | US-201314050952-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 10, 2013 |
| Priority date | Oct 10, 2013 |
| Publication date | Feb 16, 2016 |
| Grant date | Feb 16, 2016 |
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An ion implant apparatus and moveable ion beam current sensor are described. Various examples provide moving the ion beam current sensor during an ion implant process such that a distance between the ion beam current sensor and a substrate is maintained during scanning of the ion beam toward the substrate. The ion beam current sensor is disposed on a moveable support configured to move the ion beam current sensor in a first direction corresponding to the scanning of the ion beam while the substrate is moved in a second direction.
Opening claim text (preview).
The invention claimed is: 1. An ion implant apparatus comprising: an ion source configured to generate an ion beam; a scanner configured to scan the ion beam back and forth in a first direction in a scan plane; a platen configured to support a substrate when the ion beam is incident on the substrate and configured to drive the substrate in a second direction orthogonal to the scan plane, a front surface of the substrate defining a substrate plane; an ion beam current sensor…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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