Light-reflective anisotropic conductive adhesive agent, and light emitting device

Patent metadata

Field	Value
Publication number	US-9260634-B2
Application number	US-201414543550-A
Country	US
Kind code	B2
Filing date	Nov 17, 2014
Priority date	Apr 13, 2010
Publication date	Feb 16, 2016
Grant date	Feb 16, 2016

Abstract

A light-reflective anisotropic conductive adhesive is used for anisotropic conductive connection of a light-emitting element to a wiring board. The adhesive includes a thermosetting resin, conductive particles, and light-reflective acicular insulating particles. The conductive particles comprise a core particle coated with a metal particle or a metal material, and a light reflective layer formed on a surface of the core particle. The light reflective layer comprises inorganic particles selected from any one of titanium oxide particles, zinc oxide particles or aluminum oxide particles until the entire conductive particle appears a color in a range from white to gray.

First claim

What is claimed is:

1. A light-reflective anisotropic conductive adhesive to be used for anisotropic conductive connection of a light-emitting element to a wiring board, the adhesive comprising:
a thermosetting resin;
conductive particles comprising a core particle coated with a metal particle or a metal material, and a light reflective layer formed on a surface of the core particle, wherein the light reflective layer comprises inorganic particles selected from any one of titanium oxide particles, zinc oxide particles or aluminum oxide particles until the entire conductive particle appears a color in a range from white to gray; and
light-reflective acicular insulating particles.

2. The light-reflective anisotropic conductive adhesive according to claim 1 , wherein the light-reflective acicular insulating particles are formed by processing a surface of zinc oxide with a silane agent.

3. The light-reflective anisotropic conductive adhesive according to claim 1 , wherein the light-reflective acicular insulating particles have an aspect ratio larger than 10 and smaller than 35.

4. The light-reflective anisotropic conductive adhesive according to claim 1 , wherein the light-reflective acicular insulating particles have an aspect ratio larger than 10 and smaller than 20.

5. The light-reflective anisotropic conductive adhesive according to claim 1 , wherein a content of the light-reflective acicular insulating particles in the thermosetting resin composite is 1 volume % to 50 volume % with respect to the thermosetting resin composite.

6. The light-reflective anisotropic conductive adhesive according to claim 1 , wherein the adhesive further includes light-reflective globular insulating particles.

7. The light-reflective anisotropic conductive adhesive according to claim 6 , wherein the light-reflective acicular insulating particles are contained with a volume amount equal to or larger than a volume amount of the light-reflective globular insulating particles.

8. A light-emitting device in which a light-emitting element is mounted on a wiring board by a flip-chip method via the light-reflective anisotropic conductive adhesive according to claim 1 .

9. The light-emitting device according to claim 8 , wherein the light-emitting element is a light-emitting diode.

10. The light-reflective anisotropic conductive adhesive according to claim 2 , wherein the light-reflective acicular insulating particles have an aspect ratio larger than 10 and smaller than 35.

11. The light-reflective anisotropic conductive adhesive according to claim 2 , wherein the light-reflective acicular insulating particles have an aspect ratio larger than 10 and smaller than 20.

12. The light-reflective anisotropic conductive adhesive according to claim 2 , wherein a content of the light-reflective acicular insulating particles in the thermosetting resin composite is 1 volume % to 50 volume % with respect to the thermosetting resin composite.

13. The light-reflective anisotropic conductive adhesive according to claim 3 , wherein a content of the light-reflective acicular insulating particles in the thermosetting resin composite is 1 volume % to 50 volume % with respect to the thermosetting resin composite.

14. The light-reflective anisotropic conductive adhesive according to claim 4 , wherein a content of the light-reflective acicular insulating particles in the thermosetting resin composite is 1 volume % to 50 volume % with respect to the thermosetting resin composite.

Assignees

• Dexerials Corp

Inventors

• Namiki Hidetsugu
• Kanisawa Shiyuki
• Umakoshi Hideaki
• Ishigami Akira

Classifications

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/075

  of bond wires · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title