Microfluidic delivery member with filter and method of forming same

Patent metadata

Field	Value
Publication number	US-9259754-B2
Application number	US-201414310986-A
Country	US
Kind code	B2
Filing date	Jun 20, 2014
Priority date	Jun 20, 2014
Publication date	Feb 16, 2016
Grant date	Feb 16, 2016

Abstract

Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instances, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.

First claim

The invention claimed is:

1. A microfluidic delivery member comprising:
a printed circuit board having first and second surfaces and a through hole extending from the first surface to the second surface;
a filter secured to the second surface of the printed circuit board over the through hole; and
a semiconductor die having first and second surfaces and an inlet path, the semiconductor die secured to the first surface of the printed circuit board with the inlet path in fluid communication with the through hole of the printed circuit board, the second surface of the die including a plurality of nozzles that are in fluid communication with the inlet path.

2. The microfluidic delivery member of claim 1 wherein the filter includes at least one of a stainless steel mesh, randomly weaved mesh, polypropylene or a substrate material with a plurality of holes.

3. The microfluidic delivery member of claim 1 wherein the plurality of nozzles have a diameter between 15 and 30 microns.

4. The microfluidic delivery member of claim 3 , wherein the filter is configured to filter particles greater than one third of the diameter of the nozzles.

5. The microfluidic delivery member of claim 1 , further comprising a mechanical spacer located between the filter and the second surface of the printed circuit board, to space the filter from the second surface of the printed circuit board by a first distance.

6. The microfluidic delivery member of claim 5 , wherein the first distance is between 100 and 700 microns from the second surface of the printed circuit board.

7. The microfluidic delivery member of claim 5 , further comprising a liner on sidewalls of the through hole, the liner being integral with the mechanical spacer.

8. The microfluidic delivery member of claim 5 , wherein the mechanical spacer is one of a raised portion of solder mask formed on the printed circuit board and adhesive material.

9. The microfluidic delivery member of claim 5 , further comprising a liner on sidewalls of the through hole, the liner being spaced apart from the mechanical spacer.

10. The microfluidic delivery member of claim 9 , wherein the liner includes ends that extend on the first and second surfaces of the printed circuit board at the through hole.

11. A microfluidic delivery member comprising:
a printed circuit board having first and second surfaces and a through hole extending from the first surface to the second surface;
a filter secured to the printed circuit board and facing the through hole; and
a semiconductor die having first and second surfaces and an inlet path, the semiconductor die secured to the filter with the inlet path in fluid communication with the through hole of the printed circuit board through the filter, the second surface of the die including a plurality of nozzles that are in fluid communication with the inlet path.

12. The microfluidic delivery member of claim 11 further comprising first and second mechanical spacers, the first mechanical spacer being located between the printed circuit board and the filter and the second mechanical spacer being located between the filter and the die.

13. The microfluidic delivery member of claim 12 wherein the first mechanical spacer is a raised portion of solder mask formed on the printed circuit board.

14. The microfluidic delivery member of claim 12 wherein the first and second mechanical spacers are between 100 and 700 microns thick.

15. The microfluidic delivery member of claim 11 further comprising an adhesive material that secures the filter to the printed circuit board.

16. The microfluidic delivery member of claim 11 , wherein the filter is located between the printed circuit board and the semiconductor die.

17. The microfluidic delivery member of claim 16 , wherein the filter has a first surface that includes a recess, the recess facing the inlet path of the semiconductor die.

18. The microfluidic delivery member of claim 16 , further comprising first and second mechanical spacers, the first mechanical spacer being located between the semiconductor die and the filter and the second mechanical spacer being located between the filter and the printed circuit board.

19. A microfluidic delivery member comprising:
a printed circuit board having first and second surfaces and a through hole extending from the first surface to the second surface; and
a semiconductor die having first and second surfaces and an inlet path, the semiconductor die secured to the first surface of the printed circuit board with the inlet path in fluid communication with the through hole of the printed circuit board, the second surface of the die including a plurality of nozzles that are in fluid communication with the inlet path, the plurality of nozzles being configured to expel a fluid received through the through hole of the printed circuit board.

20. The microfluidic delivery member of claim 19 , further comprising a filter secured to the second surface of the printed circuit board.

21. The microfluidic delivery member of claim 20 wherein the filter includes at least one of a stainless steel mesh, randomly weaved mesh, polypropylene or a substrate material with a plurality of holes.

22. The microfluidic delivery member of claim 20 wherein the plurality of nozzles have a diameter between 15 and 30 microns.

23. The microfluidic delivery member of claim 22 , wherein the filter is configured to filter particles greater than one third of the diameter of the nozzles.

24. The microfluidic delivery member of claim 20 , further comprising a liner on sidewalls of the through hole, a first portion of the liner being located on the second surface of the printed circuit board and securing the filter to printed circuit board.

25. The microfluidic delivery member of claim 24 , wherein the liner includes a second portion located on the first surface of the printed circuit board, the second portion being shorter than the first portion.

Assignees

• St Microelectronics Inc
• St Microelectronics Asia

Inventors

• Dodd Simon
• Scheffelin Joe
• Gruenbacher Dana
• Neo Teck Khim
• Hunt Dave
• Sherman Faiz

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title