Electronic package module and method for fabrication of the same
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Substrate structure having component-disposing area and manufacturing process thereof
US9258908B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9258908-B2 |
| Application number | US-201313740286-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 14, 2013 |
| Priority date | Nov 21, 2012 |
| Publication date | Feb 9, 2016 |
| Grant date | Feb 9, 2016 |
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Abstract
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A substrate structure having a component-disposing area and a process thereof are provided. The substrate structure having a component-disposing area includes a core layer, a first dielectric-layer, a laser-resistant metallic-pattern and a second dielectric-layer. The core layer includes a first surface, a component-disposing area and a patterned metallic-layer disposed on the first surface and including multiple pads, and the pads are located within the component-disposing area. The first dielectric-layer is disposed on the core layer and includes multiple openings to respectively expose the pads. The laser-resistant metallic-pattern is disposed on the first dielectric-layer and surrounds a projection area of the first dielectric-layer which the component-disposing area is orthogonally projected on. The second dielectric-layer is disposed on the first dielectric-layer and covers the laser-resistant metallic-pattern, the second dielectric-layer includes a component-disposing cavity corresponding to the projection area, penetrating through the second dielectric-layer and communicated with the openings to expose the pads.
First claim
Opening claim text (preview).
What is claimed is: 1. A substrate structure having a component-disposing area, comprising: a core layer, comprising a first surface, a patterned metallic layer and a component-disposing area, wherein the patterned metallic layer is disposed on the first surface and comprises a plurality of pads and the pads are located within the component-disposing area; a first dielectric-layer, disposed on the core layer and comprising a plurality of openings respectively exposing the pads;…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9258908B2 cover?
- A substrate structure having a component-disposing area and a process thereof are provided. The substrate structure having a component-disposing area includes a core layer, a first dielectric-layer, a laser-resistant metallic-pattern and a second dielectric-layer. The core layer includes a first surface, a component-disposing area and a patterned metallic-layer disposed on the first surface and…
- Who is the assignee on this patent?
- Unimicron Technology Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W70/05. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 09 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).