Methods and apparatus for embedding wire in substrates for secure documents
US-2015356399-A1 · Dec 10, 2015 · US
US9258901B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9258901-B2 |
| Application number | US-201314134028-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 19, 2013 |
| Priority date | Jan 5, 2011 |
| Publication date | Feb 9, 2016 |
| Grant date | Feb 9, 2016 |
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Official abstract text for this publication.
A microcircuit deposition system incorporates a first printing engine for depositing a dielectric on a substrate. A microwire spooling machine houses a microwire spool and incorporates a tension guide to position a microwire trace onto the dielectric layer. A second printing engine trails the microwire spooling machine to deposit a covering dielectric layer over the microwire trace.
Opening claim text (preview).
What is claimed is: 1. A method for installing microwire comprising: supporting a first printing engine for the bottom layer of dielectric material; spacing a guide bale to track the first printing engine at a desired distance for placing the drawn microwire; and, spacing a second printing engine for the top layer of dielectric material to track the guide bale at a desire distance, printing a bottom layer of a dielectric material to insulate a drawn microwire from a substrat…
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