Meta-structure
US-2024128653-A1 · Apr 18, 2024 · US
US9258884B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9258884-B2 |
| Application number | US-201313886045-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 2, 2013 |
| Priority date | May 17, 2012 |
| Publication date | Feb 9, 2016 |
| Grant date | Feb 9, 2016 |
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A structure member is mounted in a communication apparatus including a conductive housing incorporating a dielectric substrate on which a high-frequency circuit is mounted. The structure member includes a pass member which passes a harmonic current component of an operating frequency generated in the dielectric substrate when the high-frequency circuit operates, and a suppression member having an EBG structure which suppresses a predetermined current component of the operating frequency. The structure member is provided between the dielectric substrate and the conductive housing. The suppression member is disposed along a current path of a harmonic current component flowing in the pass member.
Opening claim text (preview).
What is claimed is: 1. A structure member mounted in a communication apparatus including a conductive housing incorporating a dielectric substrate on which a high-frequency circuit is mounted, the structure member comprising: a pass member which passes a harmonic current component of an operating frequency generated in said dielectric substrate when the high-frequency circuit operates; and a suppression member having an EBG structure which suppresses a predetermined current component of the operating frequency, wherein the structure member is provided between said dielectric substrate and said conductive housing, and said suppression member is disposed along a current path of said harmonic current component flowing in said pass member. 2. The structure member according to claim 1 , wherein the structure member is provided between a GND portion of said dielectric substrate and said conductive housing. 3. The structure member according to claim 1 , wherein said pass member passes said harmonic current component of said operating frequency generated in a GND portion of said dielectric substrate when the high-frequency circuit operates. 4. The structure member according to claim 1 , wherein said pass member has a polyhedral structure. 5. The structure member according to claim 1 , wherein said suppression member suppresses a fundamental wave current component of said operating frequency generated in a GND portion of said dielectric substrate when the high-frequency circuit operates. 6. The structure member according to claim 1 , wherein said suppression member is disposed parallel to said current path. 7. The structure member according to claim 1 , wherein said pass member includes a low-impedance conductive member and has a plurality of flat surfaces. 8. The structure member according to claim 1 , wherein said pass member has a plurality of flat surfaces along the current path. 9. The structure member according to claim 1 , wherein said suppression member includes a dielectric base material on which a plurality of element arrays, each having said EBG structure, are arranged. 10. The structure member according to claim 9 , wherein said suppression member is disposed on at least one of a plurality of flat surfaces of said pass member. 11. The structure member according to claim 1 , wherein said suppression member includes a plurality of signal conductors, a plurality of conductive conductors conducting to said signal conductors, and a dielectric base material. 12. The structure member according to claim 11 , wherein at least one of the conductive conductors is disposed substantially perpendicular to a signal conductor surface of said signal conductor. 13. The structure member according to claim 11 , wherein said signal conductor and said conductive conductor are formed within the same plane. 14. The structure member according to claim 1 , wherein an antenna element is disposed on said dielectric substrate. 15. A communication apparatus comprising: a conductive housing incorporating a dielectric substrate on which a high-frequency circuit is mounted; and a structure member, said structure member comprising a pass member which passes a harmonic current component of an operating frequency generated in said dielectric substrate when the high-frequency circuit operates; and a suppression member having an EBG structure which suppresses a predetermined current component of the operating frequency, wherein the structure member is provided between said dielectric substrate and said conductive housing, and said suppression member is disposed along a current path of said harmonic current component flowing in said pass member. 16. The apparatus according to claim 15 , wherein the structure member is provided between a GND portion of said dielectric substrate and said conductive housing. 17. The apparatus according to claim 15 , wherein said pass member passes said harmonic current component of said operating frequency generated in a GND portion of said dielectric substrate when the high-frequency circuit operates. 18. The apparatus according to claim 15 , wherein said pass member has a polyhedral structure. 19. The apparatus according to claim 15 , wherein said suppression member suppresses a fundamental wave current component of said operating frequency generated in a GND portion of said dielectric substrate when the high-frequency circuit operates. 20. The apparatus according to claim 15 , wherein said suppression member is disposed parallel to said current path. 21. The apparatus according to claim 15 , wherein said pass member includes a low-impedance conductive member and has a plurality of flat surfaces. 22. The apparatus according to claim 15 , wherein said pass member has a plurality of flat surfaces along the current path. 23. The apparatus according to claim 15 , wherein said suppression member includes a dielectric base material on which a plurality of element arrays, each having said EBG structure, are arranged. 24. The apparatus according to claim 23 , wherein said suppression member is disposed on at least one of a plurality of flat surfaces of said pass member. 25. The apparatus according to claim 15 , wherein said suppression member includes a plurality of signal conductors, a plurality of conductive conductors conducting to said signal conductors, and a dielectric base material. 26. The apparatus according to claim 25 , wherein at least one of the conductive conductors is disposed substantially perpendicular to a signal conductor surface of said signal conductor. 27. The apparatus according to claim 25 , wherein said signal conductor and said conductive conductor are formed within the same plane. 28. The apparatus according to claim 15 , wherein an antenna element is disposed on said dielectric substrate.
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