Noise suppression structure for differential pair
US-2024023227-A1 · Jan 18, 2024 · US
High speed bypass cable for use with backplanes
US9257794B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9257794-B2 |
| Application number | US-201514829319-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 18, 2015 |
| Priority date | Feb 27, 2013 |
| Publication date | Feb 9, 2016 |
| Grant date | Feb 9, 2016 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that maintains the geometry of the cable in place from the chip to the connector and then through the connector. The connector includes a plurality of conductive terminals and shield members arranged within an insulative support frame in a manner that approximates the structure of the cable so that the impedance and other electrical characteristics of the cable may be maintained as best is possible through the cable termination and the connector.
First claim
Opening claim text (preview).
What is claimed is: 1. A bypass cable assembly, comprising: a chip package supported on a circuit board; a cable including an insulative body portion with pairs of associated signal conductors extending lengthwise through the insulative body portion, the signal conductors of each pair being separated by a first spacing, and a ground member associated with each pair of signal conductors, the ground member and signal conductors having opposing first and second free ends, and first…
Assignees
Inventors
Classifications
- H01R13/6473Primary
Electricity · mapped topic
- H01R12/7076Primary
Electricity · mapped topic
Electricity · mapped topic
- H01R13/6471Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9257794B2 cover?
- A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that maintains the geometry of the cable in place from the chip to the connector and then through the connector. The connector includes a plurality of conductive te…
- Who is the assignee on this patent?
- Molex Llc
- What technology area does this patent fall under?
- Primary CPC classification H01R13/6473. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 09 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).