Light-emitting device and electronic device using the same
US-2024128272-A1 · Apr 18, 2024 · US
US9257679B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9257679-B2 |
| Application number | US-201313949872-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 24, 2013 |
| Priority date | Mar 26, 2013 |
| Publication date | Feb 9, 2016 |
| Grant date | Feb 9, 2016 |
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A method of manufacturing a flexible display device, the method including depositing a separation layer on a supporting substrate; depositing a display panel on the separation layer; cutting the display panel to have a predetermined shape; cutting the supporting substrate and the separation layer to have a wider area than an area where the display panel, that is cut with the predetermined shape, contacts the supporting substrate and the separate layer; and separating the separate layer and the display panel from each other.
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a flexible display device, the method comprising: depositing a separation layer on a supporting substrate; depositing a display panel on the separation layer; cutting the display panel to have a predetermined shape; cutting the supporting substrate and the separation layer to have a wider area than an area where the display panel, that is cut with the predetermined shape, contacts the supporting substrate and the separation layer; and separating the separation layer and the display panel from each other. 2. The method of claim 1 , wherein: cutting the display panel includes cutting the display panel from an upper side of the display panel in a downward direction, cutting the supporting substrate and the separation layer includes cutting the supporting substrate and the separation layer from a lower side of the supporting substrate in an upward direction. 3. The method of claim 1 , wherein the predetermined shape in which the display panel is cut is a rectangular shape, and cutting the supporting substrate and the separation layer includes cutting the separation layer and the supporting substrate to have a rectangular shape corresponding to the rectangular shape of the display panel. 4. The method of claim 3 , wherein at least one first incision surface of the display panel having the rectangular shape and a first incision surface of the separation layer and the supporting substrate, corresponding to the first incision surface, are stepped relative to one another. 5. The method of claim 4 , wherein another incision surface, different from the at least one first incision surface of the display panel, is parallel to and aligned with another incision surface of the separation layer and the supporting substrate, different from the first incision surface of the separation layer and the supporting substrate. 6. The method of claim 1 , further comprising, before separating the separation layer and the display panel, separating the display panel, the supporting substrate, and the separation layer around the display panel, the supporting substrate, and the separation layer that are cut with the predetermined shape from the display panel, the supporting substrate, and the separation layer that are cut with the predetermined shape. 7. The method of claim 4 , wherein separating the separation layer and the display panel includes peeling between a side end of the first incision surface of the display panel and the first incision surface of the separation layer that are stepped relative to one another. 8. The method of claim 7 , wherein, in the peeling of the side end of the first incision surface of the display panel and the separation layer that are stepped relative to one another, the side end of the first incision surface of the display panel and the separation layer that are stepped relative to one another are physically peeled by inserting a peeler between the side end of the first incision surface of the display panel and the separation layer that are stepped relative to one another. 9. The method of claim 8 , wherein the peeler has a thin plate shape having a width corresponding to a width of the display panel. 10. The method of claim 8 , wherein, after peeling the side end of the first incision surface and the separation layer, the display panel and the separation layer are separated from each other by relatively moving the side end of the first incision surface of the display panel and the separation layer in a direction away from each other. 11. The method of claim 10 , wherein separating the display panel from the separation layer and the supporting substrate includes: respectively fixing an outer surface of the supporting substrate and an outer surface of the display panel to first and second fixing parts, respectively, that are separated from each other; and operating the first and second fixing parts to gradually separate the separation layer from the side end of the first incision surface of the peeled display panel in a state in which the outer surface of the supporting substrate and the outer surface of the display panel are respectively fixed to the first and second fixing parts. 12. The method of claim 11 , wherein: the first fixing part includes a first conveyor belt extended in a horizontal direction; and the second fixing part includes a second conveyor belt having a portion that is extended in the horizontal direction and a remaining portion that is extended in an inclined direction. 13. The method of claim 4 , wherein a separation distance in the horizontal direction between the first incision surface of the display panel and the first incision surface of the separation layer is about 0.5 mm to about 3 mm. 14. The method of claim 1 , wherein the separation layer is formed of aluminum zinc oxide. 15. The method of claim 1 , wherein a thickness of the separation layer is about 50 Å to about 300 Å. 16. The method of claim 1 , wherein a surface roughness of the separation layer is about 6 Å to about 15 Å. 17. The method of claim 1 , wherein the display panel includes: a display substrate on the separation layer, an organic light emitting element on the display substrate, and a thin film encapsulation layer covering the organic light emitting element.
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