Light pipe heat sink element

Patent metadata

Field	Value
Publication number	US-9255703-B2
Application number	US-201414303660-A
Country	US
Kind code	B2
Filing date	Jun 13, 2014
Priority date	Jun 13, 2014
Publication date	Feb 9, 2016
Grant date	Feb 9, 2016

Abstract

An assembly for use with a heat producing electronic device is disclosed. The assembly may include a heat sink in thermally conductive contact with a shell containing the electronic device, and a light pipe having a first thermal conductivity and configured to transmit light from a light-emitting diode (LED) to a front side of the heat sink. The light pipe may include at least a portion having a thermally conductive layer with a second thermal conductivity greater than the first thermal conductivity. The thermally conductive layer may cover at least a portion of an outer surface of the light pipe, and be positioned between, and in thermally conductive contact with a portion of the heat sink protrusions. The thermally conductive layer may be designed to conduct and radiate heat away from at least a portion of the heat sink protrusions.

First claim

What is claimed is:

1. An assembly for use with a heat producing electronic device, comprising:
a heat sink in thermally conductive contact with a top side of a shell containing the heat-producing electronic device, the heat sink including:
a top side having protrusions extending away from the top side;
a front side; and
a rear side; and

a first light pipe configured to transmit, through a first optically transmissive core having a first thermal conductivity, light, received from a first light-emitting diode (LED) located on the heat producing electronic device, to the front side of the heat sink, the first light pipe having:
a first portion configured to transmit light upwards from the LED and past the rear side of the heat sink, towards a second portion optically connected to the first portion; and
the second portion, configured to transmit light received from the first portion, from the rear side of the heat sink, along the top side of the heat sink to the front side of the heat sink, and including a thermally conductive layer having a second thermal conductivity greater than the first thermal conductivity, the thermally conductive layer:
covering at least a portion of an outer surface of the optically transmissive core;
positioned between, and in thermally conductive contact with at least a portion of the heat sink protrusions; and
designed to conduct and radiate heat away from at least a portion of the heat sink protrusions.

2. The assembly of claim 1 , wherein the thermally conductive layer includes metallic foil.

3. The assembly of claim 1 , wherein the thermally conductive layer includes a metallic film deposited on at least a portion of an outer surface of the optically transmissive core.

4. The assembly of claim 1 , wherein the thermally conductive layer includes thermally conductive paint.

5. The assembly of claim 1 , wherein the optically transmissive core is thermally insulative.

6. The assembly of claim 1 , wherein the heat-producing electronic device includes an integrated circuit (IC).

7. The assembly of claim 1 , wherein the heat-producing electronic device is an electronic module.

8. The assembly of claim 1 , wherein the heat-producing electronic device is an electronic component.

9. The assembly of claim 1 , further comprising a second light pipe configured to transmit, through a second optically transmissive core, light, received from a second light-emitting diode (LED) located on the heat producing electronic device, to the front side of the heat sink, the second light pipe having a first portion and a second portion.

10. The assembly of claim 1 , wherein the first light pipe is in thermally conductive contact with a first portion of the heat sink and with a second portion of the heat sink.

11. A light pipe kit for an assembly that includes a heat producing electronic device, the light pipe kit comprising:
a heat sink to, when assembled, be in thermally conductive contact with a top side of a shell containing the heat-producing electronic device, the heat sink including:
a top side having protrusions extending away from the top side;
a front side; and
a rear side; and

a first light pipe configured to, when assembled, transmit, through a first optically transmissive core having a first thermal conductivity, light, received from a first light-emitting diode (LED) located on the heat producing electronic device, to the front side of the heat sink, the first light pipe having:
a first portion configured to, when assembled, transmit light upwards from the LED and past the rear side of the heat sink, towards a second portion optically connected to the first portion; and
the second portion, configured to, when assembled, transmit light received from the first portion, from the rear side of the heat sink, along the top side of the heat sink to the front side of the heat sink, the second portion including a thermally conductive layer having a second thermal conductivity greater than the first thermal conductivity, the thermally conductive layer:
covering at least a portion of an outer surface of the optically transmissive core;
positioned, when assembled, between, and in thermally conductive contact with at least a portion of the heat sink protrusions; and
designed to, when assembled, conduct and radiate heat away from at least a portion of the heat sink protrusions.

12. The light pipe kit of claim 11 , further comprising a thermal material to create a thermally conductive contact between the light pipe and the heat sink, wherein the thermal material includes at least one member of a group consisting of: thermal interface material (TIM) and thermal compound.

13. The light pipe kit of claim 11 , further comprising a clip to attach the light pipe to the heat sink.

14. The light pipe kit of claim 11 , wherein the thermally conductive layer includes metallic foil.

15. The light pipe kit of claim 11 , wherein the thermally conductive layer includes thermally conductive paint.

16. The light pipe kit of claim 11 , wherein the thermally conductive layer includes a metallic film deposited on at least a portion of an outer surface of the optically transmissive core.

17. The light pipe kit of claim 11 , further comprising a second light pipe configured to transmit, through a second optically transmissive core, light, received from a second light-emitting diode (LED) located on the heat producing electronic device, to the front side of the heat sink, the second light pipe having a first portion and a second portion.

18. The light pipe kit of claim 11 , wherein, when assembled, the first light pipe is in thermal contact with a first portion of the heat sink and with a second portion of the heat sink.

19. The light pipe kit of claim 11 , wherein the optically transmissive core is thermally insulative.

20. The light pipe kit of claim 11 , wherein the heat-producing electronic device is an electronic module.

Assignees

• Lenovo Entpr Solutions Singapore Pte Ltd

Inventors

• Auyeung Andrew S
• Craven Michael J
• Dang Huu
• Hum Harvey

Classifications

• F21V29/80

  with pins or wires · CPC title

• F21V29/713 Primary

  in direct thermal and mechanical contact of each other to form a single system · CPC title

• F21V29/71

  using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements · CPC title

• G02B6/0008 Primary

  the light being emitted at the end of the fibre · CPC title

• F21V29/502

  characterised by the adaptation for cooling of specific components · CPC title