Hard lead egress adapter for an instrumentation component

Patent metadata

Field	Value
Publication number	US-9255654-B2
Application number	US-201213617522-A
Country	US
Kind code	B2
Filing date	Sep 14, 2012
Priority date	Sep 14, 2012
Publication date	Feb 9, 2016
Grant date	Feb 9, 2016

Abstract

An instrumentation component includes an instrumentation portion, a casing at least partially surrounding the instrumentation portion, a lead protruding from the instrumentation portion through a lead egress hole in the casing, a lead egress adapter, and a lead egress cap. The lead egress adapter is situated in the lead egress hole. The lead egress adapter includes a cup portion and a lip portion at least partially circumscribing the cup portion. The lead egress adapter includes a hole in the cup portion. The lead protrudes through the cup hole and the cup hole is tight fit to the lead. A potting material fills a remainder of the cup portion. The lip portion of the lead egress adapter contacts the casing. A lead egress cap seals the lead egress adapter to the casing. The lead egress cap further includes a cap hole through which the lead protrudes, and the cap hole is tight fit to the lead egress.

First claim

The invention claimed is:

1. An instrumentation component comprising:
an instrumentation portion;
a casing at least partially surrounding said instrumentation portion;
a lead protruding from the instrumentation portion through a lead egress hole in the casing;
a lead egress adapter situated in said lead egress hole, wherein said lead egress adapter includes a cup portion and a lip portion at least partially circumscribing the cup portion, wherein said lead egress adapter includes a hole in said cup portion, wherein said lead protrudes through said cup hole and said cup hole is tight fit to said lead, and wherein a potting material fills a remainder of said cup portion;
wherein said lip portion of said lead egress adapter contacts said casing; and
a lead egress cap sealing said lead egress adapter to said casing, wherein said lead egress cap further comprises a cap hole through which said lead protrudes, and wherein said cap hole is tight fit to said lead egress;
wherein said lip portion of said lead egress adapter further comprises a tack weld trough circumscribing said cup portion and wherein said tack weld trough is thinner than a non-tack weld trough portion of said lip portion along an axis defined by the lead; and
a potting material filling said trough portion.

2. The instrumentation component of claim 1 , wherein said cup hole is tight fit to said lead with a clearance of between 0.001 inches and 0.004 inches.

3. The instrumentation component of claim 1 , wherein said cap hole is tight fit to said lead with a clearance of between 0.001 inches and 0.004 inches.

4. The instrumentation component of claim 1 , wherein said cap further comprises a tack weld portion extending beyond an outer circumference of said lip portion of said lead egress adapter, and wherein said tack weld portion is tack welded to said casing.

5. The instrumentation component of claim 1 , wherein said lead extends through said lead egress adapter approximately perpendicular to said casing.

6. The instrumentation component of claim 1 , wherein said lead extends through said lead egress adapter at an angle relative to said casing.

7. The instrumentation component of claim 1 , wherein said cup portion includes a cup portion wall, and wherein said cup portion wall extends beyond said lip portion of said lead egress adapter along the axis defined by the lead.

8. The instrumentation component of claim 1 , wherein said cap further includes a deformed portion, and wherein said deformed portion conforms to an outer edge of said lip portion of said adapter.

9. The instrumentation component of claim 8 , wherein said deformed portion further forms a gap between said deformed portion as said lead egress adapter and wherein said gap is filled with a potting material.

10. The instrumentation component of claim 1 , wherein said cap is tack welded to said lead egress adapter.

11. An instrumentation component comprising:
an instrumentation portion;
a casing at least partially surrounding said instrumentation portion;
a lead protruding from the instrumentation portion through a lead egress hole in the casing;
a lead egress adapter situated in said lead egress hole, wherein said lead egress adapter includes a cup portion and a lip portion at least partially circumscribing the cup portion, wherein said lead egress adapter includes a hole in said cup portion, wherein said lead protrudes through said cup hole and said cup hole is tight fit to said lead, and wherein a potting material fills a remainder of said cup portion;
wherein said lip portion of said lead egress adapter contacts said casing, and includes a brazing chamfer on an outer edge of said lip portion and a braze connecting said brazing chamfer to said casing; and
a lead egress cap sealing said lead egress adapter to said casing, wherein said lead egress cap further comprises a cap hole through which said lead protrudes, and wherein said cap hole is tight fit to said lead egress.

Assignees

• Warren Eli Cole
• Leslie Nicholas R
• United Technologies Corp

Inventors

• Warren Eli Cole
• Leslie Nicholas R

Classifications

• F16L5/02 Primary

  Sealing · CPC title

• Y10T29/49966

  with supplemental joining · CPC title

• F16L5/10

  by using sealing rings or sleeves only · CPC title

• H02G3/22

  Installations of cables or lines through walls, floors or ceilings, e.g. into buildings · CPC title

• H02G3/088

  Dustproof, splashproof, drip-proof, waterproof, or flameproof casings or inlets · CPC title