Coated cutting tool
US-2024287680-A1 · Aug 29, 2024 · US
US9255327B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9255327-B2 |
| Application number | US-201113818154-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 23, 2011 |
| Priority date | Aug 24, 2010 |
| Publication date | Feb 9, 2016 |
| Grant date | Feb 9, 2016 |
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A method of forming a thin film on a substrate which includes a step of contacting a surface with a precursor compound having a transition metal and one or more alkyl-1,3-diazabutadiene ligands is provided. The resulting modified surface is then contacted with an activating compound.
Opening claim text (preview).
What is claimed is: 1. A method for depositing a thin film on a surface of a substrate, the method comprising: a) contacting the substrate with a vapor of a metal-containing compound to form a modified surface on the substrate, the metal-containing compound being described by formula II: wherein M is Mn(II), Fe(II), Co(II), or Ni(II); R 1 is C 1 -C 12 alkyl, amine, or C 6 -C 18 aryl; and R 2 is hydrogen, C 1 -C 10 alkyl, C 6 -C 18 aryl, amino, C 1 -C 12 alkylamino, or C 2 -C 24 dialkylamino; and b) contacting the modified surface with a vapor of an activating compound to form at least a portion of the thin film on the surface of the substrate. 2. The method of claim 1 wherein the activating compound is a reducing agent and the thin film is a metallic film. 3. The method of claim 2 wherein the reducing agent is selected from the group consisting of molecular hydrogen, atomic hydrogen, silane, disilane, organosilanes, compounds containing Si—H bonds, germane, organogermanes, compounds containing Ge—H bonds, stannane, compounds containing Sn—H bonds, other metal hydride compounds, formic acid, glyoxalic acid, oxalic acid, other carboxylic acids, diborane, compounds containing B—H bonds, hydrazine, carbon-substituted hydrazines, formalin, formaldehyde, organic alcohols, organoaluminum compounds, organozinc compounds, and plasma-activated versions thereof. 4. The method of claim 1 wherein the activating compound is an oxidizing agent and the thin film is a metal oxide. 5. The method of claim 4 wherein the oxidizing agent is selected from the group consisting of water, ozone, molecular oxygen, atomic oxygen, organic alcohols, hydrogen peroxide, organic hydroperoxides, organic peroxides, nitrous oxide, and plasma-activated versions of thereof. 6. The method of claim 1 wherein the activating compound is a nitrogen-containing agent and the thin film is a metal nitride. 7. The method of claim 6 wherein the activating compound is selected from the group consisting of ammonia, hydrazine, alkyl-substituted hydrazines, and plasma activated versions thereof. 8. The method of claim 1 wherein the compound having formula II is thermally activated. 9. The method of claim 1 wherein the compound having formula II is plasma activated. 10. The method of claim 1 wherein R 1 and R 2 are each independently C 1 -C 4 alkyl. 11. The method of claim 1 wherein R 1 and R 2 are each independently methyl, ethyl, propyl, n-butyl, sec-butyl, isobutyl, or t-butyl. 12. The method of claim 1 wherein R 1 is t-butyl. 13. The method of claim 1 wherein M is Fe(II), Co(II), or Ni(II). 14. The method of claim 1 wherein M is Mn(II), Co(II), or Ni(II). 15. The method of claim 1 wherein M is Co(II). 16. The method of claim 1 wherein M is Mn(II). 17. The method of claim 1 wherein M is Ni(II). 18. The method of claim 1 wherein M is Fe(II).
Compounds without a metal-carbon linkage · CPC title
Nitrides {(C23C16/303 takes precedence)} · CPC title
without a metal-carbon linkage · CPC title
Post-treatment of applied coatings · CPC title
without a metal-carbon linkage · CPC title
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