Cu—Mg—P based copper alloy material and method of producing the same

Patent metadata

Field	Value
Publication number	US-9255310-B2
Application number	US-80135910-A
Country	US
Kind code	B2
Filing date	Jun 4, 2010
Priority date	Dec 23, 2009
Publication date	Feb 9, 2016
Grant date	Feb 9, 2016

Abstract

A copper alloy material includes, by mass %, Mg of 0.3 to 2%, P of 0.001 to 0.1%, and the balance including Cu and inevitable impurities. An area fraction of such crystal grains that an average misorientation between all the pixels in each crystal grain is less than 4° is 45 to 55% of a measured area, when orientations of all the pixels in the measured area of the surface of the copper alloy material are measured by an EBSD method with a scanning electron microscope of an electron backscattered diffraction image system and a boundary in which a misorientation between adjacent pixels is 5° or more is considered as a crystal grain boundary, and a tensile strength is 641 to 708 N/mm 2 , and a bending elastic limit value is 472 to 503 N/mm 2 .

First claim

The invention claimed is:

1. A copper alloy plate consisting of, by mass %:
Mg of 0.3 to 2%;
P of 0.001 to 0.1%;
Zr of 0.001 to 0.03%; and
the balance including Cu and inevitable impurities,
wherein an area fraction of those crystal grains of the copper alloy material, wherein an average misorientation between all pixels in each crystal grain is less than 4°, is 45 to 55% of a measured area,

when wherein the measurement of orientations of all the pixels in the measured area of the surface of the copper alloy material is carried out
a) in a step size of 0.5 μm by an EBSD method with a scanning electron microscope of an electron backscattered diffraction image system and
b) a boundary in which a misorientation between adjacent pixels is 5° or more is considered as a crystal grain boundary,
and wherein a tensile strength of the copper alloy material is 650 to 708 N/mm 2 , a bending elastic limit value is 484 to 503 N/mm 2 , and a conductivity is 49 to 68% IACS.

2. A method of producing the copper alloy plate according to claim 1 , wherein when a copper alloy is produced by a process including hot rolling, solution treatment, finishing cold rolling, and low temperature annealing in this order, the hot rolling is performed under the conditions that a hot rolling starting temperature is 700° C. to 800° C., a total hot rolling reduction ratio is 90% or higher, an average hot rolling reduction ratio per 1 pass is 10% to 35%, a Vickers hardness of a copper alloy plate after the solution treatment is adjusted to be 80 to 100 Hv, and the low temperature annealing is performed at 250° C. to 450° C. for 30 to 180 seconds.

3. The copper alloy plate according to claim 1 , wherein plate is a thin plate of about 0.2 mm.

Assignees

• Sakurai Takeshi
• Kameyama Yoshihiro
• Abe Yoshio
• Mitsubishi Shindo Kk

Inventors

• Sakurai Takeshi
• Kameyama Yoshihiro
• Abe Yoshio

Classifications

• C22C9/00 Primary

  Alloys based on copper · CPC title

• C22F1/08

  of copper or alloys based thereon · CPC title