CMOS-MEMS integrated flow for making a pressure sensitive transducer

Patent metadata

Field	Value
Publication number	US-9254997-B2
Application number	US-201314013080-A
Country	US
Kind code	B2
Filing date	Aug 29, 2013
Priority date	Aug 29, 2013
Publication date	Feb 9, 2016
Grant date	Feb 9, 2016

Abstract

A sensor is made up of two substrates which are adhered together. A first substrate includes a pressure-sensitive micro-electrical-mechanical (MEMS) structure and a conductive contact structure that protrudes outwardly beyond a first face of the first substrate. A second substrate includes a complementary metal oxide semiconductor (CMOS) device and a receiving structure made up of sidewalls that meet a conductive surface which is recessed from a first face of the second substrate. A conductive bonding material physically adheres the conductive contact structure to the conductive surface and electrically couples the MEMS structure to the CMOS device.

First claim

What is claimed is:

1. A sensor, comprising:
a first substrate including a conductive layer vertically arranged between a semiconductor layer and a conductive contact structure, wherein the conductive layer includes stationary regions and a movable region extending laterally between the stationary regions, wherein the movable region includes a plurality of recesses extending downwardly into an upper side of the conductive layer, wherein some of the plurality of recesses taper inwardly to adjoin openings extending through perforated regions in a lower side of the conductive layer and other of the plurality of recesses terminate at an upper surface of a conductive membrane of the conductive layer that is laterally arranged between the perforated regions, wherein the conductive contact structure protrudes outwardly from a lower side of the conductive layer, beyond a face of the first substrate, and wherein the conductive contact structure is electrically coupled to a pressure-sensitive micro-electrical-mechanical (MEMS) structure on the first substrate;
a second substrate including a receiving structure having a conductive surface which is recessed from a face of the second substrate by sidewalls that bound the conductive surface, wherein the conductive surface is electrically coupled to a complementary metal oxide semiconductor (CMOS) device on the second substrate; and
a conductive bonding material to physically adhere the conductive contact structure to the conductive surface and to electrically couple the MEMS structure to the CMOS device.

2. The sensor of claim 1 , wherein the sensor includes a capacitive sensing element comprising:
the conductive membrane, which acts as a first capacitive plate, arranged on the first substrate; and
a metal layer, which acts as a second capacitive plate, arranged on the second substrate.

3. The sensor of claim 2 , wherein the movable region further comprises a conductive cantilever support structure which physically supports and is electrically coupled to the conductive membrane, and wherein the stationary region includes a conductive anchor structure arranged to physically support the conductive cantilever support structure and to electrically couple the conductive cantilever support structure to the conductive contact structure.

4. The sensor of claim 3 , wherein the second substrate includes an aperture which is aligned to the conductive membrane when the first and second substrates are physically adhered to one another.

5. The sensor of claim 4 , where the second substrate further comprises:
a CMOS circuit configured to supply a predetermined charge to the conductive membrane and to monitor how a voltage changes between the conductive membrane and the metal layer as a function of the predetermined charge.

6. The sensor of claim 2 , wherein the second substrate comprises:
an analog-to-digital converter to digitize an electrical signal related to a position of the conductive membrane in time; and
an analog or digital acoustic filter.

7. The sensor of claim 1 , wherein the receiving structure comprises:
a hydro-fluoric (HF) acid barrier layer that extends laterally along the face of the second substrate and which extends vertically along the sidewall from the face of the second substrate to the recessed conductive surface.

8. The sensor of claim 3 , wherein the conductive contact structure comprises:
a polysilicon body that is vertically spaced from the face of the first substrate by a pair of conductive vias and a dielectric layer, wherein the dielectric layer is arranged laterally between the conductive vias and completely fills a void between the conductive vias, wherein the conductive vias couple the polysilicon body to the conductive anchor structure; and
a germanium pad coupling the polysilicon body to the conductive surface of the second substrate.

9. A sensor, comprising:
a first substrate including a conductive contact structure which protrudes outwardly beyond a face of the first substrate and which is electrically coupled to a conductive membrane, which acts as a first capacitive plate, on the first substrate, wherein the conductive contact structure includes a conductive body that is vertically spaced from the face of the first substrate by a pair of vias and a dielectric layer arranged laterally between the vias;
a second substrate including a receiving structure having a conductive surface which is recessed from a face of the second substrate by sidewalls and which is electrically coupled to a metal layer, which acts as a second capacitive plate, on the second substrate; and
a circuit on the second substrate and configured to supply a predetermined charge to the conductive membrane and to monitor how a voltage changes between the conductive membrane and the metal layer as a function of the predetermined charge.

10. The sensor of claim 9 , further comprising:
a conductive eutectic bonding material to physically adhere the conductive contact structure to the conductive surface of the receiving structure and to electrically couple the conductive membrane to the circuit.

11. The sensor of claim 10 , wherein the conductive body is polysilicon and electrically coupled to the conductive membrane by the vias, and wherein the conductive contact structure further comprises:
a germanium pad electrically coupling the conductive body to the conductive surface of the second substrate.

12. The sensor of claim 11 , wherein the second substrate includes an aperture which is aligned to the conductive membrane when the first and second substrates are physically adhered to one another, and wherein the conductive body and the germanium pad are received in the receiving structure.

13. A sensor, comprising:
a first substrate including a conductive layer vertically arranged between a semiconductor layer and a polysilicon contact structure, wherein the conductive layer includes stationary regions and a movable region extending laterally between the stationary regions, wherein the semiconductor layer includes a recess arranged over and exposing the movable region, and wherein the polysilicon contact structure protrudes outwardly from the stationary region beyond a face of the first substrate, and wherein the polysilicon contact structure is electrically coupled to a conductive membrane of the movable region, which acts as a first capacitor plate, on the first substrate;
a second substrate including a receiving structure having a conductive surface which is arranged in a recess in a face of the second substrate and which is electrically coupled to a metal layer, which acts as a second capacitor plate, on the second substrate;
a germanium pad arranged in the recess and coupling the polysilicon contact structure to the conductive surface of the second substrate; and
a circuit configured to supply a predetermined charge to the conductive membrane and to monitor how a voltage changed between the conductive membrane and the metal layer as a function of the predetermined charge.

14. The sensor of claim 13 , wherein the second substrate includes an aperture extending along an aperture axis, wherein the aperture axis intersects the conductive membrane.

15. The sensor of claim 14 , wherein the aperture includes an upper aperture portion and a lower aperture portion, the upper aperture portion being proximate to the face of the first substrate and having opposing sidewalls that are spaced apart by a first distance, and the lower aperture portion having opposing sidewalls that are spaced apart by a second distance that is smaller than the first distance.

16. The sen

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Cheng Chun-Wen
• Liang Kai-Chih
• Chu Chia-Hua

Classifications

• B81C1/00238 Primary

  Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure · CPC title

• B81B2201/0264

  Pressure sensors · CPC title