Manufacturing method for transparent substrate

Patent metadata

Field	Value
Publication number	US-9254627-B2
Application number	US-201113640444-A
Country	US
Kind code	B2
Filing date	Apr 28, 2011
Priority date	Apr 30, 2010
Publication date	Feb 9, 2016
Grant date	Feb 9, 2016

Abstract

There is provided a manufacturing method for a transparent substrate excellent in bending property, flexibility, impact resistance, and external appearance. A manufacturing method for a transparent substrate according to an embodiment of the present invention includes: a step A of applying a thermoplastic resin (A) composition solution onto a support backing having solvent permeability to form an applied layer; a step B of attaching at least one surface of an inorganic glass and the applied layer to each other via an adhesive composition to form a laminate; a step C of subjecting the laminate to a first heat treatment to reduce an amount of a solvent remaining in the applied layer to a predetermined amount; and a step D including peeling the support backing from the laminate and subjecting the resultant to a second heat treatment to dry the applied layer, thereby forming a thermoplastic resin layer.

First claim

The invention claimed is:

1. A manufacturing method for a transparent substrate, comprising:
a step A of applying a thermoplastic resin (A) composition solution onto a support backing having solvent permeability to form an applied layer; wherein the thermoplastic resin (A) composition solution comprises a solvent and a thermoplastic resin (A); then
a step B of attaching at least one surface of an inorganic glass and the applied layer to each other via an adhesive composition to form a laminate; then
a step C of subjecting the laminate to a first heat treatment to reduce an amount of the solvent to a predetermined amount; and then
a step D of peeling the support backing from the laminate and then subjecting the resultant to a second heat treatment to dry the applied layer, thereby forming a thermoplastic resin layer,
wherein the adhesive composition comprises a solvent, and the solvent in the adhesive composition exhibits the property of dissolving thermoplastic resin (A) contained in the thermoplastic resin (A) composition solution.

2. A manufacturing method for a transparent substrate according to claim 1 , wherein the amount of the solvent after step A but before step B is 7 wt % or more.

3. A manufacturing method for a transparent substrate according to claim 1 , wherein the first heat treatment reduces the amount of the solvent to 15 wt % or less.

4. A manufacturing method for a transparent substrate according to claim 1 , wherein a shrinkage stress of the applied layer upon peeling the support backing is 10 MPa or less.

5. A manufacturing method for a transparent substrate according to claim 1 , wherein a stress to be applied to the inorganic glass after the second heat treatment is 10 MPa to 30 MPa.

6. A manufacturing method for a transparent substrate according to claim 1 , wherein a temperature of the first heat treatment is, with respect to a boiling point (bp A ) of the solvent contained in a largest amount in the thermoplastic resin (A) composition solution, (bp A −60°) C. to (bp A +40°) C.

7. A manufacturing method for a transparent substrate according to claim 1 , wherein a temperature of the second heat treatment is, with respect to a boiling point (bp A ) of the solvent contained in a largest amount in the thermoplastic resin (A) composition solution, (bp A −20°) C. to 250° C.

8. A manufacturing method for a transparent substrate according to claim 1 , wherein the adhesive composition comprises a solvent, and a boiling point of the solvent in the adhesive composition is equal to or higher than a boiling point of a solvent contained in the thermoplastic resin (A) composition solution.

9. A manufacturing method for a transparent substrate according to claim 1 , wherein the adhesive composition comprises a component exhibiting compatibility with a thermoplastic resin (A) contained in the thermoplastic resin (A) composition solution.

10. A manufacturing method for a transparent substrate according to claim 1 , wherein the adhesive composition comprises a solvent, a thermoplastic resin (B) exhibiting compatibility with the thermoplastic resin (A) composition solution, a thermosetting monomer, and a curing reaction catalyst.

11. A manufacturing method for a transparent substrate according to claim 10 , wherein the thermoplastic resin (B) has a reaction group at a terminal.

12. A manufacturing method for a transparent substrate according to any one of claims 1 to 8 and 9 to 11 , wherein the support backing has a storage elastic modulus at 90° C. of 1.0×10 7 Pa or more.

13. A manufacturing method for a transparent substrate according to claim 12 , wherein a thickness of the inorganic glass is 100 μm or less.

Assignees

• Hattori Daisuke
• Murashige Takeshi
• Kameyama Tadayuki
• Nitto Denko Corp

Inventors

• Hattori Daisuke
• Murashige Takeshi
• Kameyama Tadayuki

Classifications

• B32B17/064 Primary

  Operations & Transport · mapped topic

• B29C66/91431

  the temperature being kept constant over time · CPC title

• B29C66/91645

  by steps · CPC title

• B32B2309/105

  Thickness · CPC title

• B29C66/7315

  Mechanical properties · CPC title