Die-to-die communication links for receiver integrated circuit dies and related methods

Patent metadata

Field	Value
Publication number	US-9252891-B2
Application number	US-201414575391-A
Country	US
Kind code	B2
Filing date	Dec 18, 2014
Priority date	Nov 7, 2013
Publication date	Feb 2, 2016
Grant date	Feb 2, 2016

Abstract

Die-to-die communication links for receiver integrated circuit dies within multi-die systems and related methods are disclosed for radio frequency (RF) receivers. The disclosed embodiments provide die-to-die communication links that allow for direct communication of operating parameters between receiver integrated circuit dies and other integrated circuit dies within a multi-die system so that the operation of receive path circuitry can be adjusted without requiring intervention from an external host processor integrated circuit. A variety of operating parameter information can be communicated through the die-to-die communication links so that the integrated circuit dies can quickly adjust to changing signal conditions without requiring intervention by the external host processor integrated circuit.

First claim

What is claimed is:

1. A multi-die system having die-to-die communications, comprising:
a first integrated circuit die, comprising:
a radio frequency (RF) input configured to receive an RF input signal;
receive path circuitry coupled to receive the RF input signal and configured to generate a tuned digital signal representing content of a channel within the RF input signal based upon a channel selection signal, the receive path circuitry including analog front end circu…

Assignees

• Silicon Lab Inc

Inventors

• Youngblood John B
• Arslan Guner
• Bolton J A
• Grale Trenton J
• Pereira Vitor
• Tindle Jeffrey A
• Trager David S
• Zhou Yan

Classifications

• H04B15/00 Primary

  Electricity · mapped topic