Power sources suitable for use in implantable medical devices and corresponding fabrication methods

Patent metadata

Field	Value
Publication number	US-9252415-B2
Application number	US-201213524304-A
Country	US
Kind code	B2
Filing date	Jun 15, 2012
Priority date	Jun 15, 2012
Publication date	Feb 2, 2016
Grant date	Feb 2, 2016

Abstract

Arrays of planar solid state batteries are stacked in an aligned arrangement for subsequent separation into individual battery stacks. Prior to stacking, a redistribution layer (RDL) is formed over a surface of each wafer that contains an array; each RDL includes first and second groups of conductive traces, each of the first extending laterally from a corresponding positive battery contact, and each of the second extending laterally from a corresponding negative battery contact. Conductive vias, formed before or after stacking, ultimately couple together corresponding contacts of aligned batteries. If before, each via extends through a corresponding battery contact of each wafer and is coupled to a corresponding conductive layer that is included in another RDL formed over an opposite surface of each wafer. If after, each via extends through corresponding aligned conductive traces and, upon separation of individual battery stacks, becomes an exposed conductive channel of a corresponding battery stack.

First claim

The invention claimed is:

1. A power source for an implantable medical device, the power source comprising:
a plurality of planar solid state batteries overlaying one another in an aligned arrangement and adhered to one another to form a stack, the stack having first and second edges extending along a height of the stack, the first and second edges being opposite one another;
a first group of conductive vias, each via of the first group extending through a positive contact of a corresponding battery and approximately parallel to the first edge of the stack;
a second group of conductive vias, each via of the second group extending through a negative contact of a corresponding battery and approximately parallel to the first edge of the stack;
a first group of redistribution layers, each redistribution layer of the first group of redistribution layers extending over a first surface of a corresponding battery and each including a first conductive trace, coupled to the positive battery contact of the corresponding battery, and a second conductive trace, coupled to the negative contact of the corresponding battery, each first conductive trace extending to the first edge of the stack, and each second conductive trace extending to the second edge of the stack; and
a second group of redistribution layers, each redistribution layer of the second group of redistribution layers extending over a second surface of a corresponding battery, the second surface opposite the first surface, and each second group of redistribution layers including a conductive bonding runner, each conductive bonding runner being coupled to a corresponding via of the first and second groups of conductive vias and to a corresponding conductive trace of an adjacent and confronting redistribution layer of the first group of redistribution layers.

2. The power source of claim 1 , wherein the plurality of planar solid state batteries are adhered to one another by reflow of a solder compound against each conductive bonding runner, the solder compound being coupled to and located over each conductive trace and corresponding battery contact.

3. The power source of claim 1 , wherein the plurality of planar solid state batteries are adhered to one another by bonding a conductive epoxy adhesive to each conductive bonding runner, the adhesive being coupled to and located over each conductive trace and corresponding battery contact.

4. The power source of claim 1 , further comprising a cavity between adjacent batteries, each cavity having a height ranging between approximately one micrometers and approximately five micrometers.

Assignees

• Askarinya Mohsen
• Fenner Andreas A
• Herrmann Erik J
• Ruben David A
• Day John K
• Medtronic Inc

Inventors

• Askarinya Mohsen
• Fenner Andreas A
• Herrmann Erik J
• Ruben David A
• Day John K

Classifications

• H01M6/46 Primary

  of flat cells · CPC title

• H01M50/516

  by welding, soldering or brazing · CPC title

• H01M50/507

  comprising an arrangement of two or more busbars within a container structure, e.g. busbar modules · CPC title

• H01M50/503

  characterised by the shape of the interconnectors · CPC title

• Y10T29/49112

  including laminating of indefinite length material · CPC title