Structural component and method for producing a structural component

Patent metadata

Field	Value
Publication number	US-9252344-B2
Application number	US-201214114502-A
Country	US
Kind code	B2
Filing date	Apr 12, 2012
Priority date	Apr 29, 2011
Publication date	Feb 2, 2016
Grant date	Feb 2, 2016

Abstract

The invention relates to a structural component which comprises a support ( 1 ), an optoelectronic semiconductor chip ( 2 ) having at least one lateral face ( 2 a ), further comprising a connecting means ( 3 ), a first molded element ( 4 ), and a second molded element ( 5 ), the optoelectronic semiconductor chip ( 2 ) being mechanically connected to the support ( 1 ) by the connecting means ( 3 ). The first molded element ( 4 ) covers an exposed outer face of the optoelectronic semiconductor chip ( 2 ) and the first molded element ( 4 ) covers an exposed outer face of the connecting means ( 3 ). The second molded element ( 5 ) covers an exposed outer face of the first molded element ( 5 ) and the second molded element ( 5 ) has a higher modulus of elasticity at room temperature than the first molded element.

First claim

The invention claimed is:

1. A structural component comprising:
a carrier;
an optoelectronic semiconductor chip having at least one side surface;
a connecting means;
a contact-making wire connected to the optoelectronic chip at its side facing away from the carrier;
a first shaped body; and
a second shaped body, wherein
the optoelectronic semiconductor chip is mechanically connected to the carrier by means of the connecting means,
the connecting means covers in places the side surface of the optoelectronic semiconductor chip and a surface of the carrier which faces the optoelectronic semiconductor chip,
the connecting means is arranged directly between the optoelectronic semiconductor chip and the surface of the carrier which faces the optoelectronic semiconductor chip,
the first shaped body covers an exposed outer surface of the optoelectronic semiconductor chip,
the first shaped body covers an exposed outer surface of the connecting means,
the second shaped body covers an exposed outer surface of the first shaped body, and
the second shaped body has a higher modulus of elasticity at room temperature than the first shaped body.

2. The structural component according to claim 1 , wherein the second shaped body has a higher hardness than the first shaped body.

3. The structural component according to claim 1 , wherein the first shaped body is formed predominantly or completely with a silicone and the second shaped body is formed predominantly or completely with an epoxy resin.

4. The structural component according to claim 1 , wherein the first shaped body covers the optoelectronic semiconductor chip at its side facing away from the carrier.

5. The structural component according to claim 1 , wherein the first shaped body is free of foreign particles.

6. The structural component according to claim 1 , wherein the first shaped body has substantially the same optical refractive index as the second shaped body.

7. The structural component according to claim 1 , of the first shaped body.

8. The structural component according to claim 1 , wherein the first shaped body, at that side of the optoelectronic semiconductor chip which faces away from the carrier, has a thickness of at most 100 μm above the optoelectronic semiconductor chip.

9. The structural component according to claim 1 , further comprising a depression in the carrier, wherein the optoelectronic semiconductor chip is arranged in the depression and the first shaped body projects above a side wall of the depression.

10. The structural component according to claim 1 , wherein the connecting means is formed with an adhesive.

11. A method for producing a structural component comprising the following steps:
providing a carrier;
fixing an optoelectronic semiconductor chip having at least one side surface onto the carrier by means of a connecting means;
applying a first shaped body to an exposed outer surface of the optoelectronic semiconductor chip and an exposed outer surface of the connecting means;
incipiently curing the first shaped body;
fully curing the first shaped body; and
applying a second shaped body to an exposed outer surface of the fully cured first shaped body,
wherein
the connecting means is in direct contact with a surface of the optoelectronic semiconductor chip facing the carrier,
the connecting means is in direct contact with at least one two of the at least one side surfaces of the optoelectronic semiconductor chip, and
the second shaped body has a higher modulus of elasticity at room temperature than the first shaped body.

12. The method according to claim 11 , wherein
the incipient curing is effected at a first temperature,
the full curing is effected at a second temperature,
the carrier with the semiconductor chip fixed on the carrier is heated before the first shaped body is applied, such that the carrier is at a third temperature during the application of the first shaped body,
the third temperature is greater than room temperature, and
the second temperature is less than the first temperature.

13. The method according to claim 12 , wherein the third temperature is less than or equal to the first temperature.

14. A structural component comprising:
a carrier;
an optoelectronic semiconductor chip having at least one side surface,

a connecting means;
a first shaped body; and
a second shaped body, wherein
the optoelectronic semiconductor chip is mechanically connected to the carrier by means of the connecting means,
the first shaped body covers an exposed outer surface of the optoelectronic semiconductor chip,
the first shaped body covers an exposed outer surface of the connecting means,
the second shaped body covers an exposed outer surface of the first shaped body,
the second shaped body has a higher modulus of elasticity at room temperature than the first shaped body,
the connecting means covers in places the side surface of the optoelectronic semiconductor chip and a surface of the carrier which faces the optoelectronic semiconductor chip,
the connecting means is formed with an adhesive, and
the first shaped body, at that side of the optoelectronic semiconductor chip which faces away from the carrier, has a thickness of at most 100 μm above the optoelectronic semiconductor chip.

Assignees

• Kippes Thomas
• Haslbeck Stephan
• Luruthudass Annaniah
• Lee Ee Lian
• Osram Opto Semiconductors Gmbh

Inventors

• Kippes Thomas
• Haslbeck Stephan
• Luruthudass Annaniah
• Lee Ee Lian

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/01515

  Forming coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title