Wafer processing apparatus and wafer processing method
US-2024395512-A1 · Nov 28, 2024 · US
Two piece shutter disk assembly for a substrate process chamber
US9252002B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9252002-B2 |
| Application number | US-201213550997-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 17, 2012 |
| Priority date | Jul 17, 2012 |
| Publication date | Feb 2, 2016 |
| Grant date | Feb 2, 2016 |
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- Title
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Abstract
Official abstract text for this publication.
Shutter disk assemblies for use in process chambers to protect a substrate support disposed below the shutter disk assembly from undesired material deposition are provided herein. In some embodiments, a shutter disk assembly for use in a process chamber to protect a substrate support disposed below the shutter disk assembly may include an upper disk member having a top surface and a bottom surface; and a lower carrier member having at least a portion of the lower carrier member disposed below a portion of the upper disk member to support the upper disk member and to create a protective overlap region that prevents exposure of the substrate support upon deformation of the upper disk member.
First claim
Opening claim text (preview).
What is claimed is: 1. A shutter disk assembly, comprising: an upper disk member having a top surface and a bottom surface; and a lower carrier member having at least a portion of the lower carrier member disposed below a portion of the upper disk member to support the upper disk member and to create a protective overlap region that prevents exposure of a substrate support disposed below the shutter disk assembly upon deformation of the upper disk member, wherein the lower ca…
Assignees
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Classifications
- H01J37/34Primary
Electricity · mapped topic
Chemistry & Metallurgy · mapped topic
- H01J37/3447Primary
Electricity · mapped topic
Electricity · mapped topic
- H10P72/70Primary
Electricity · mapped topic
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- What does patent US9252002B2 cover?
- Shutter disk assemblies for use in process chambers to protect a substrate support disposed below the shutter disk assembly from undesired material deposition are provided herein. In some embodiments, a shutter disk assembly for use in a process chamber to protect a substrate support disposed below the shutter disk assembly may include an upper disk member having a top surface and a bottom surf…
- Who is the assignee on this patent?
- Tsai Cheng-Hsiung Matthew, Jupudi Ananthkrishna, Dinsmore Robert, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H01J37/34. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 02 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).